US2005109822A1PendingUtilityA1

Solder fillers for aluminum body parts and methods of applying the same

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Assignee: JOHNSON MFG COMPANYPriority: Apr 9, 2002Filed: Dec 20, 2004Published: May 26, 2005
Est. expiryApr 9, 2022(expired)· nominal 20-yr term from priority
B23K 35/282B23K 35/262
33
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Claims

Abstract

One aspect of the present invention is a method of applying a solder filler to an aluminum body part. The method includes abrading the surface of an aluminum body part at a temperature of at least about 300 degrees Celsius with a solder filler at a temperature of at least about 300 degrees Celsius.

Claims

exact text as granted — not AI-modified
1 . A method of applying a solder filler to an aluminum body part, the method comprising: 
 abrading the surface of an aluminum body part at a temperature of at least about 300 degrees Celsius with a solder filler at a temperature of at least about 300 degrees Celsius.    
   
   
       2 . The method of  claim 1  wherein the solder filler is a tin-based solder filler.  
   
   
       3 . The method of  claim 2  wherein the tin-based solder filler consists of, by weight, 55% to 85% Sn, 12% to 40% Zn, and 3% to 5% Ni, Fe, Cu or Co.  
   
   
       4 . The method of  claim 1  further comprising moving an instrument along the surface of the aluminum body part to remove a portion of the abraded surface.  
   
   
       5 . The method of  claim 1  further comprising heating the surface to a temperature in the range of about 300 degrees Celsius to about 900 degrees Celsius prior to the abrading step.  
   
   
       6 . The method of  claim 2  further comprising heating the tin-based solder filler to a temperature in the range of about 300 Celsius to about 900 Celsius prior to the abrading step.  
   
   
       7 . The method of  claim 3  wherein the tin-based solder filler consists by weight of 66.5% Sn, 30% Zn, and 3.5% Cu.  
   
   
       8 . The method of  claim 2  wherein the tin-based solder filler has a melting point in the range of about 195 degrees Celsius and 368 degrees Celsius.  
   
   
       9 . The method of  claim 1  wherein the aluminum body part is comprised of a 5000 series aluminum alloy.  
   
   
       10 . The method of  claim 1  wherein the aluminum body part is comprised of an aluminum alloy having greater than about 0.5% Mg.  
   
   
       11 . A method of deoxidizing an aluminum body part, the method comprising: 
 abrading the surface of an aluminum body part at a temperature of about 300 degrees Celsius with a tin-based solder filler at a temperature of at least about 300 degrees Celsius.    
   
   
       12 . The method of  claim 11  wherein the tin-based solder filler consists by weight of 66.5% Sn, 30% Zn, and 3.5% Cu.  
   
   
       13 . The method of  claim 11  wherein the abrading step is not preceded by a fluxing step.  
   
   
       14 . A method of soldering an aluminum body part, the method comprising: 
 abrading at least a portion of the surface of an aluminum body part with a tin-based solder filler consisting of, by weight, 55% to 85% Sn, 12% to 40% Zn, and 3% to 5% Ni, Fe, Cu or Co;    applying a second solder filler to a portion of the abraded surface portion; and    heating the second solder filler to bond the solder filler to the aluminum body part.    
   
   
       15 . The method of  claim 14  wherein the second solder filler is comprised by weight of about 95% Sn and about 5% Sb.  
   
   
       16 . The method of  claim 14  wherein the second solder filler has a melting point in the range of about 232 degrees Celsius and about 240 degrees Celsius.  
   
   
       17 . The method of  claim 14  wherein the applying step includes filling the abraded surface portion.  
   
   
       18 . The method of  claim 14  wherein the applying step includes joining the abraded surface portion to a second body part.  
   
   
       19 . A solder filler for aluminum body parts consisting by weight of 81% to 85% Sn, 3% to 5% Zn, and 12% to 14% Cu.  
   
   
       20 . A solder filler for aluminum body parts consisted by weight of 55% to 85% Sn, 12% to 40% Zn, and 3% to 5% Ni, Fe, Cu or Co.

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