IC package substrate with over voltage protection function

Abstract

The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.

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       7 . An IC package substrate with over voltage protection function, comprising: 
 a plurality of protection material layers ( 314 ,  324 ,  334 ,  344 );    a plurality of lower electrodes ( 325 ,  345 ) disposed on the plurality of protection material layers and electrically connected with the plurality of protection material layers;    a plurality of upper electrodes ( 3311 ,  331 ), disposed on the plurality of protection material layers and electrically connected with the plurality of the protection material layers;    a plurality of grounding lines ( 313 ,  323 ,  333 ,  343 ), disposed on the protection material layers and electrically connected with the protection material layers; and    a termination ( 37 ) for connecting the each grounding line and upper electrode.    
   
   
       8 . The IC package substrate with over voltage protection function of  claim 7 , wherein the protection material layers are variable resistance materials.  
   
   
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       11 . The IC package substrate with over voltage protection function of  claim 7 , further comprising an overcoat for protecting IC chip and helping heat dissipation.