Method and apparatus for substrate temperature control
Abstract
A method and apparatus for gas control is provided. The apparatus may be used for controlling gases delivered to a chamber, controlling the chamber pressure, controlling the delivery of backside gas between a substrate and substrate support and the like. In one embodiment, an apparatus for controlling gas control includes at least a first flow sensor having a control valve, a first pressure sensor and at least a second pressure sensor. An inlet of the first flow sensor is adapted for coupling to a gas supply. A control valve is coupled to an outlet of the flow sensor. The first pressure sensor is adapted to sense a metric indicative of the pressure upstream of the first flow sensor. The second pressure sensor is adapted to sense a metric indicative of the pressure downstream of the control valve.
Claims
exact text as granted — not AI-modified1 . Apparatus for gas control, comprising:
at least a first flow sensor having an inlet adapted for coupling to a gas supply by a first gas line; a control valve; a second gas line coupled to an outlet of the flow sensor and an inlet of the control valve; a third gas line coupled to an outlet of the control valve; a upstream pressure sensor coupled to the first gas line and adapted to sense a metric indicative of pressure within the first gas line; and a downstream pressure sensor coupled to the third gas line and adapted to sense a metric indicative of pressure within the third gas line.
2 . The apparatus of claim 1 further comprising:
a bypass line coupled to the third gas line.
3 . The apparatus of claim 2 , wherein the bypass line further comprises:
a restrictor sized such that flow is choked and proportional to the downstream pressure sensor; and a bypass valve coupled in parallel.
4 . The apparatus of claim 3 further comprising:
a vacuum source coupled in parallel to outlets of the restrictor and bypass valve.
5 . The apparatus of claim 4 , wherein the vacuum source provides a pressure at least 2 times less than a pressure in the third gas line.
6 . The apparatus of claim 1 further comprising:
an intermediate pressure sensor adapted to provide a metric of pressure in the second gas line, wherein a flow of gas passing through the second gas line may be expressed as: F A = F S + F Δ P S ( ⅆ P S ⅆ t , V s ) - F P ( ⅆ P ⅆ t ) where: F S is the flow sensed by the flow sensor; P is the pressure sensed in the first gas line; P S is the pressure sensed in the second gas line; and V S is the volume between flow sensor and the control valve in the second gas line.
7 . The apparatus of claim 6 further comprising:
a bypass control branch teed to the third gas line and having a bypass restrictor; a bypass valve coupled in parallel to the bypass restrictor; and a vacuum source coupled in parallel to outlets of the bypass restrictor and the bypass valve.
8 . The apparatus of claim 1 further comprising:
an intermediate pressure sensor coupled to the second gas line and adapted to sense a metric indicative of pressure within the second gas line and;
9 . The apparatus of claim 8 , wherein a flow of gas passing through an outlet of the apparatus downstream of the downstream pressure sensor may be expressed as:
F W =F A −F BLEED ( P W )
where:
F A is the flow measured by the flow sensor;
F BLEED is the flow to the vacuum source; and
P W is the pressure sensed in the third gas line
10 . The apparatus of claim 9 , wherein the flow of gas to the vacuum source is at least one of measured or factory calibrated.
11 . The apparatus of claim 2 , wherein the bypass line is disposed downstream of the downstream pressure sensor.
12 . The apparatus of claim 2 further comprising:
a bypass pressure sensor coupled to the bypass control branch and adapted to sense a metric indicative of pressure within the bypass control branch.
13 . The apparatus of claim 1 , wherein the third gas line is coupled to a processing chamber.
14 . The apparatus of claim 16 , wherein the third gas line is routed through a substrate support disposed in the processing chamber.
15 . The apparatus of claim 1 , wherein the control valve, the flow sensor, and up to three pressure sensors define a first sub-circuit having a first gas outlet; and
a second sub-circuit configured substantially identical to the first sub-circuit and having a second gas outlet.
16 . The apparatus of claim 15 , wherein the outlet of the first sub-circuit is coupled to a first substrate support and the outlet of the second sub-circuit is coupled to a second substrate support.
17 . The apparatus of claim 16 , wherein the first substrate support is disposed in a different processing chamber than the second substrate support.
18 . The apparatus of claim 16 , wherein the outlet of the first sub-circuit is coupled to a first backside gas control zone of the first and second substrate supports; and
the outlet of the second sub-circuit is coupled to a second backside gas control zone of the first and second substrate supports.
19 . Apparatus for gas control, comprising:
at least a first control valve having an inlet adapted for coupling to a gas supply; a flow sensor coupled to an outlet of the control valve; a first gas line coupled to an outlet of the control valve and the inlet of the flow sensor; a upstream pressure sensor couple to the first gas line and adapted to sense a metric indicative of pressure within the first gas line. a second gas line coupled to an outlet of the flow sensor; and a downstream pressure sensor coupled to the second gas line and adapted to sense a metric indicative of pressure within the second gas line.
20 . The apparatus of claim 19 further comprising;
a restrictor disposed in the second gas line; an intermediate pressure sensor coupled to the second gas line and adapted to sense a metric indicative of pressure within the second gas line upstream of the restrictor;
21 . The apparatus of claim 19 further comprising:
a bypass line coupled to the second gas line down stream of the restrictor.
22 . The apparatus of claim 21 , wherein the bypass line further comprises:
a bypass restrictor; and a bypass valve coupled in parallel.
23 . The apparatus of claim 22 further comprising:
a vacuum source coupled in parallel to outlets of the restrictor and bypass valve.
24 . The apparatus of claim 23 , wherein the vacuum source provides a pressure at least 2 times less than a pressure in the second gas line.
25 . The apparatus of claim 24 further comprising:
an intermediate pressure sensor adapted to provide a metric of pressure in the second gas line, wherein a flow of gas passing through the first gas line may be expressed as: F A = F S + F Δ P S ( ⅆ P S ⅆ t , V s ) - Fpu ( ⅆ Pu ⅆ t , Vu ) where: F S is the flow sensed by the flow sensor; Pu is the pressure sensed in the first gas line; Vu is the volume between the between the flow sensor and the control valve in the first gas line; P S is the pressure sensed in the second gas line; and V S is the volume between flow in the second gas line.
26 . The apparatus of claim 25 further comprising:
a bypass control branch teed to the second gas line; a bypass restrictor; a bypass valve coupled in parallel to the bypass restrictor; and a vacuum source coupled in parallel to outlets of the bypass restrictor and bypass valve.
27 . The apparatus of claim 26 , wherein a flow of gas passing through an outlet of the apparatus teed to the second gas line and bypass line may be expressed as:
F W =F A −F BLEED ( P W )
where:
F A is the flow measured by the flow sensor; and
F BLEED is the flow to the vacuum source.
28 . The apparatus of claim 27 , wherein the flow of gas to the vacuum source is at least one of measured or factory calibrated.
29 . The apparatus of claim 27 further comprising:
a restrictor disposed in the second gas line; and an intermediate pressure sensor coupled to the second gas line and adapted to sense a metric indicative of pressure within the second gas line upstream of the restrictor.
30 . The apparatus of claim 22 further comprising an outlet gas line.
31 . The apparatus of claim 30 , wherein the outlet gas line is coupled to a processing chamber.
32 . The apparatus of claim 19 , wherein the control valve, the flow sensor, the upstream pressure sensor and the downstream pressure sensor define a first sub-circuit having a first gas outlet; and
a second sub-circuit configured substantially identical to the first sub-circuit and having a second gas outlet.
33 . The apparatus of claim 32 , wherein the outlet of the first sub-circuit is coupled to a first substrate support and the outlet of the second sub-circuit is coupled to a second substrate support.
34 . The apparatus of claim 32 , wherein the first substrate support is disposed in a different processing chamber than the second substrate support.
35 . The apparatus of claim 33 , wherein the outlet of the first sub-circuit is coupled to a first backside gas control zone of the first and second substrate supports; and
the outlet of the second sub-circuit is coupled to a second backside gas control zone of the first and second substrate supports.
36 . The apparatus of claim 19 further comprising:
a restrictor disposed between the second and downstream pressure sensor.
37 . The apparatus of claim 19 further comprising:
a bypass control branch teed between the control valve and the flow sensor; a bypass restrictor; a bypass valve coupled in parallel to the bypass restrictor; and a vacuum source coupled in parallel to outlets of the bypass restrictor and bypass valve.Join the waitlist — get patent alerts
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