Apparatus for controlling galvanic corrosion effects on a single-wafer cleaning system

Abstract

A single substrate cleaning apparatus that prevents galvanic corrosion is provided. The apparatus includes a spindle configured to rotatably support a substrate. A moveable dispense arm disposed over the spindle is included. The dispense arm supports a first supply line and a second supply line. The first supply line has a first nozzle affixed to an end of the first supply line, and the second supply line has a second nozzle affixed to an end of the second supply line. The first nozzle is positioned behind the second nozzle such that a fluid dispensed from the second nozzle is dried by application of a fluid simultaneously dispensed from the first nozzle in manner that protects the substrate from galvanic corrosion.

1 . A system for cleaning a single substrate, the system comprising: 
 a spindle adapted to support the substrate, the spindle configured to spin the substrate;    a substrate surface having a layer of a cleaning chemistry disposed thereover;    a first nozzle positioned over the substrate surface, the first nozzle configured to apply a rinsing agent on the substrate surface while the substrate is spinning;    a second nozzle positioned over the substrate surface, the second nozzle configured to apply a drying agent on the substrate surface while the first nozzle is applying the rinsing agent;    a dispense arm to which the first and second nozzles are rigidly attached, the dispense arm configured to advance radially above the substrate surface from a center of the substrate to an edge of the substrate while the substrate is spinning and while the first and second nozzles are applying the rinsing agent and the drying agent, respectively, wherein the substrate surface is dried to reduce exposure of the substrate surface to corrosion.    
   
   
       2 . The system of  claim 1 , wherein the cleaning chemistry includes a solvent and a chelator.  
   
   
       3 . The system of  claim 1 , wherein the corrosion reduced is galvanic corrosion.  
   
   
       4 . The system of  claim 1  further comprising: 
 a spray shield surrounding the spindle.    
   
   
       5 . The system of  claim 4 , wherein the spray shield provides access to the substrate.  
   
   
       6 . A single substrate cleaning apparatus that prevents galvanic corrosion, comprising: 
 a spindle configured to rotatably support a substrate;    a moveable dispense arm disposed over the spindle, the dispense arm supporting a first supply line and a second supply line, the first supply line having a first nozzle affixed to an end of the first supply line, the second supply line having a second nozzle affixed to an end of the second supply line, the first nozzle positioned behind the second nozzle such that a fluid dispensed from the second nozzle is dried by application of a fluid simultaneously dispensed from the first nozzle in manner that protects the substrate from galvanic corrosion.    
   
   
       7 . The apparatus of  claim 6 , wherein the dispense arm is configured to traverse over a surface of the substrate.  
   
   
       8 . The apparatus of  claim 6 , wherein the dispense arm is configured to traverse over a surface of the substrate from a center region of the substrate to a peripheral region of the substrate.  
   
   
       9 . The apparatus of  claim 6 , further comprising a support post connected to the dispense arm, the dispense arm configured to pivot about the support post, thereby driving the first and second nozzles radially over the surface of the substrate.  
   
   
       10 . The apparatus of  claim 6 , further comprising: 
 a spindle motor providing rotational energy to the spindle through a belt operably connecting the spindle and the spindle motor.    
   
   
       11 . The apparatus of  claim 6 , further comprising: 
 a drip tray disposed around and below the spindle.    
   
   
       12 . The apparatus of  claim 6 , wherein the first and second nozzles are configured to direct fluid streams therefrom at an angle relative to a surface of the substrate.  
   
   
       13 . The apparatus of  claim 12 , wherein the angle causes the fluid streams to be directed towards an outer edge of the substrate when the first and second nozzles are disposed over an inner region of the substrate.  
   
   
       14 . A single substrate cleaning apparatus, comprising: 
 a rotatable substrate support;    a dispense arm moveably disposed over the substrate support, the dispense arm moveable in a plane substantially parallel to a top surface of the substrate support, the dispense arm supporting multiple fluid delivery lines, each of the fluid delivery lines having a nozzle affixed to corresponding ends of the fluid delivery lines;    a post providing support for the dispense arm to pivot around; and    a drip tray encircling at least a bottom surface of the substrate support.    
   
   
       15 . The apparatus of  claim 14 , further comprising: 
 a motor providing rotational energy to the substrate support through a belt operably connecting the motor and the substrate support.    
   
   
       16 . The apparatus of  claim 14 , wherein the drip tray includes a vent and a drain.  
   
   
       17 . The apparatus of  claim 14 , wherein each nozzle is oriented in a same plane thereby enabling a first nozzle to apply a rinsing agent and a second nozzle behind the first nozzle to simultaneously apply a drying agent so as to minimize conditions conducive to galvanic corrosion.  
   
   
       18 . The apparatus of  claim 17 , wherein each nozzle is configured to direct a fluid stream at an angle to a surface of the substrate support in a direction of movement of the dispense arm.