Liquid droplet ejection system and control program of ejection condition of compositions

Abstract

When using a liquid droplet ejection method, a conventional photomask is not required, however, it is required instead that a moving path of a nozzle or a substrate is controlled with accuracy at least in ejecting liquid droplets. According to the characteristics of compositions to be ejected or their pattern, such ejection conditions are desirably set as the moving rate of a nozzle or a substrate, ejection quantity, ejection distance and ejection rate of compositions, atmosphere of the space that the compositions are ejected, the temperature and moisture of the space, and heating temperature of the substrate. A liquid droplet ejection system in accordance with the invention comprises an input means for inputting data of a thin film pattern, a set means for setting a nozzle for a ejecting a composition containing a material for forming the thin film or setting a moving path of the substrate to which the composition is ejected, an image pick-up means for detecting an alignment marker formed on a substrate and a control means for controlling the moving path of the nozzle or the substrate.

1 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern;    set means for setting a moving path of a nozzle for ejecting a composition containing a material for forming the thin film based on the data;    image pick-up means for detecting an alignment marker formed on a substrate; and    control means for controlling the moving path of the nozzle.    
     
     
         2 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern and a composition containing a material for forming the film;    set means for setting a nozzle and an ejection head for ejecting the composition and setting a moving path of the nozzle based on the data;    image pick-up means for detecting an alignment marker formed on a substrate; and    control means for controlling the moving path of the nozzle.    
     
     
         3 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern;    set means for setting a moving path of a substrate to which a composition containing a material for forming the thin film is ejected based on the data;    image pick-up means for detecting an alignment marker formed on a substrate; and    control means for controlling the moving path of the substrate.    
     
     
         4 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern and a composition containing a material for forming the film;    set means for setting a nozzle and an ejection head for ejecting the composition and setting a moving path of the substrate to which the composition is ejected based on the data;    image pick-up means for detecting an alignment marker formed on a substrate; and    control means for controlling the moving path of the substrate.    
     
     
         5 . A liquid droplet ejection system comprising: 
 image pick-up means for detecting a first thin film pattern formed over a substrate;    input means for inputting data of a second thin film pattern and a composition containing a material for forming the thin film;    set means for setting a moving path of a nozzle for ejecting the composition based on the data; and    control means for controlling the moving path of the nozzle.    
     
     
         6 . A liquid droplet ejection system comprising: 
 image pick-up means for detecting a first thin film pattern formed over a substrate;    input means for inputting data of a second thin film pattern and a composition containing a material for forming the thin film;    set means for setting a nozzle and an ejection head for ejecting the composition and setting a moving path of the nozzle based on the data; and    control means for controlling the moving path of the nozzle.    
     
     
         7 . A liquid droplet ejection system comprising: 
 image pick-up means for detecting a first thin film pattern formed over a substrate;    input means for inputting data of a second thin film pattern and a composition containing a material for forming the thin film;    set means for setting a substrate to which the composition is ejected based on the data; and    control means for controlling the moving path of the substrate.    
     
     
         8 . A liquid droplet ejection system comprising: 
 image pick-up means for detecting a first thin film pattern formed over a substrate;    input means for inputting data of a second thin film and a composition containing a material for forming and the thin film;    set means for setting a nozzle and an ejection head for ejecting the composition and setting a moving path of a substrate to which the composition is ejected; and    control means for controlling the moving path of the substrate.    
     
     
         9 . The liquid droplet ejection system according to  claim 1 , 
 wherein a broken wiring portion of the thin film pattern formed over the substrate is detected by an image pick-up means identical to or different from the image pick-up means; and    the set means for setting the moving path of the nozzle allows to the composition to be ejected onto the broken wiring portion.    
     
     
         10 . The liquid droplet ejection system according to  claim 2 , 
 wherein a broken wiring portion of the thin film pattern formed over the substrate is detected by an image pick-up means identical to or different from the image pick-up means; and    the set means for setting the moving path of the nozzle allows to the composition to be ejected onto the broken wiring portion.    
     
     
         11 . The liquid droplet ejection system according to  claim 3 , 
 wherein a broken wiring portion of the thin film pattern formed over the substrate is detected by an image pick-up means identical to or different from the image pick-up means; and    the set means for setting the moving path of the substrate allows the composition to be ejected onto the broken wiring portion.    
     
     
         12 . The liquid droplet ejection system according to  claim 4 , 
 wherein a broken wiring portion of the thin film pattern formed over the substrate is detected by an image pick-up means identical to or different from the image pick-up means; and    the set means for setting the moving path of the substrate allows the composition to be ejected onto the broken wiring portion.    
     
     
         13 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern,    set means for setting moving paths of a first nozzle and a second nozzle for ejecting a composition containing a material for forming the thin film based on the data,    image pick-up means for detecting an alignment marker formed on a substrate; and    control means for controlling the moving paths of the first nozzle and the second nozzle,    wherein the moving path of the second nozzle is set to cross the moving path of the first nozzle.    
     
     
         14 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern,    set means for setting a moving path of a first nozzle for successively ejecting a composition containing a material for forming the thin film based on the data;    set means for setting a moving path of a second nozzle for intermittently ejecting the composition based on the data; and    image pick-up means for detecting an alignment marker formed on a substrate;    control means for controlling the moving paths of the first nozzle and the second nozzle,    wherein the moving path of the second nozzle is set to cross the moving path of the first nozzle.    
     
     
         15 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern,    set means for setting a moving path of a substrate to which a composition containing a material for forming the thin film is ejected based on the data;    image pick-up means for detecting an alignment marker formed on a substrate; and    control means for controlling the moving path of the substrate,    wherein the moving path of the substrate has at least a first path and a second path; and    the first path is set to cross the second path;    
     
     
         16 . A liquid droplet ejection system comprising: 
 input means for inputting data of a thin film pattern,    set means for setting a moving path of a substrate to which a composition containing a material for forming the thin film is ejected based on the data; and    image pick-up means for detecting an alignment marker formed on the substrate; and    a control means for controlling the moving path of the substrate,    wherein the moving path of the substrate has at least a first path and a second path;    the first path is set to cross the second path;    the composition is successively ejected from a nozzle for ejecting the composition while the substrate passes one of the first path and the second path; and    the composition is intermittently ejected from the nozzle while the substrate passes the other path.    
     
     
         17 . The liquid droplet ejection system according to  claim 1 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         18 . The liquid droplet ejection system according to  claim 2 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         19 . The liquid droplet ejection system according to  claim 3 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         20 . The liquid droplet ejection system according to  claim 4 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         21 . The liquid droplet ejection system according to  claim 13 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         22 . The liquid droplet ejection system according to  claim 14 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         23 . The liquid droplet ejection system according to  claim 15 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         24 . The liquid droplet ejection system according to  claim 16 , wherein the material for forming the thin film is at least one of Ag, Au, Ci, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, Ba, ITO, ITSO organic indium, organotin and zinc oxide (ZnO).  
     
     
         25 . The liquid droplet ejection system according to  claim 1 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         26 . The liquid droplet ejection system according to  claim 2 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         27 . The liquid droplet ejection system according to  claim 3 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         28 . The liquid droplet ejection system according to  claim 4 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         29 . The liquid droplet ejection system according to  claim 5 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         30 . The liquid droplet ejection system according to  claim 6 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         31 . The liquid droplet ejection system according to  claim 7 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         32 . The liquid droplet ejection system according to  claim 8 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         33 . The liquid droplet ejection system according to  claim 13 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         34 . The liquid droplet ejection system according to  claim 14 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         35 . The liquid droplet ejection system according to  claim 15 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         36 . The liquid droplet ejection system according to  claim 16 , further comprising means for controlling an atmosphere of the space that the composition is ejected.  
     
     
         37 . The liquid droplet ejection system according to  claim 1 , further comprising means for heating the substrate.  
     
     
         38 . The liquid droplet ejection system according to  claim 2 , further comprising means for heating the substrate.  
     
     
         39 . The liquid droplet ejection system according to  claim 3 , further comprising means for heating the substrate.  
     
     
         40 . The liquid droplet ejection system according to  claim 4 , further comprising means for heating the substrate.  
     
     
         41 . The liquid droplet ejection system according to  claim 5 , further comprising means for heating the substrate.  
     
     
         42 . The liquid droplet ejection system according to  claim 6 , further comprising means for heating the substrate.  
     
     
         43 . The liquid droplet ejection system according to  claim 7 , further comprising means for heating the substrate.  
     
     
         44 . The liquid droplet ejection system according to  claim 8 , further comprising means for heating the substrate.  
     
     
         45 . The liquid droplet ejection system according to  claim 13 , further comprising means for heating the substrate.  
     
     
         46 . The liquid droplet ejection system according to  claim 14 , further comprising means for heating the substrate.  
     
     
         47 . The liquid droplet ejection system according to  claim 15 , further comprising means for heating the substrate.  
     
     
         48 . The liquid droplet ejection system according to  claim 16 , further comprising means for heating the substrate.  
     
     
         49 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 1 .  
     
     
         50 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 2 .  
     
     
         51 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 3 .  
     
     
         52 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 4 .  
     
     
         53 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 5 .  
     
     
         54 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 6 .  
     
     
         55 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 7 .  
     
     
         56 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 8 .  
     
     
         57 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 13 .  
     
     
         58 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 14 .  
     
     
         59 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 15 .  
     
     
         60 . A light-emitting device comprising a light-emitting element including an organic compound or an inorganic compound, which is manufactured by using the liquid droplet ejection system according to  claim 16 .  
     
     
         61 . A control program of ejection conditions of a composition comprising a feature which allows a computer for controlling the ejection conditions of a composition containing a material for forming a thin film to function as set means for setting a moving path of a nozzle for ejecting the composition based on the data of the thin film pattern which has been inputted to the computer.  
     
     
         62 . A control program of ejection conditions of a composition comprising a feature which allows a computer for controlling the ejection conditions of a composition containing a material for forming a thin film to function as set means for setting a nozzle or an ejection head for ejecting the composition and setting a moving path of the nozzle based on the data of the thin film pattern which has been inputted to the computer.  
     
     
         63 . A control program of ejection conditions of a composition comprising a feature which allows computer for controlling the ejection conditions of a composition containing a material for forming a thin film to function as set means for setting a moving path of a substrate to which the composition is ejected based on the data of the thin film pattern which has been inputted to the computer.  
     
     
         64 . A control program of ejection conditions of a composition comprising a feature which allows a computer for controlling the ejection conditions of a composition containing a material for forming a thin film to function as set means for setting nozzle and an ejection head for ejecting the composition and setting a moving path of a substrate to which the composition is ejected based on the data of the composition type and the thin film pattern which have been inputted to the computer.