US2005139317A1PendingUtilityA1
Shielding plate in plasma for uniformity improvement
Priority: Mar 30, 2001Filed: Nov 3, 2004Published: Jun 30, 2005
Est. expiryMar 30, 2021(expired)· nominal 20-yr term from priority
C23C 16/507C23C 16/45591H01J 37/32623
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Claims
Abstract
An apparatus comprising a plasma chamber containing a plasma for a plasma-assisted material process upon a substrate; a shielding plate within the plasma chamber to actively direct ion flux to desired areas of the substrate; and a supporting structure to support the shielding plate within the chamber is disclosed.
Claims
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20 . A method comprising:
actively directing ion flux within a plasma chamber by the insertion of a plate into the chamber; and regulating ion flux to different areas of the substrate by altering properties of the plate.
21 . The method of claim 20 further comprising conducting a plasma-assisted etching process upon the substrate.
22 . The method of claim 20 further comprising conducting a plasma-enhanced chemical vapor deposition process upon the substrate.
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29 . (canceled)Join the waitlist — get patent alerts
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