Connecting unit including contactor having superior electrical conductivity and resilience, and method for producing the same

Abstract

A connecting unit for establishing a connection with external connecting portions of an electronic device includes a base and a plurality of spiral contactors having a conductive layer and an auxiliary resilient layer. The top face, the bottom face, and both side faces of the conductive layer are completely surrounded by the auxiliary resilient layer. The conductive layer is composed of a material having a specific resistance lower than the specific resistance of the auxiliary resilient layer. The auxiliary resilient layer is composed of a material having a yield point and an elastic modulus higher than the yield point and the elastic modulus of the conductive layer.

1 - 9 . (canceled)  
     
     
         10 . A method for producing a connecting unit for establishing a connection with a plurality of external connecting portions of an electronic device, the connecting unit comprising a base and a plurality of spiral contactors formed on the base and having a spiral shape, the spiral contactors being put in contact with the external connecting portions of the electronic device, the method comprising: 
 forming the plurality of spiral contactors by laminating a conductive layer and an auxiliary resilient layer by plating,    wherein the conductive layer comprises a material having a specific resistance lower than the specific resistance of the auxiliary resilient layer, and the auxiliary resilient layer comprises a material having a yield point and an elastic modulus higher than the yield point and the elastic modulus of the conductive layer.    
     
     
         11 . The method for producing a connecting unit according to  claim 10 , wherein either the conductive layer or the auxiliary resilient layer is formed with a metal foil so as to have a spiral shape, and then the auxiliary resilient layer or the conductive layer is laminated by plating.  
     
     
         12 . The method for producing a connecting unit according to  claim 10 , wherein a plurality of spiral contactors composed of either the conductive layer or the auxiliary resilient layer are formed, and then the periphery of the spiral contactors is surrounded by the auxiliary resilient layer or the conductive layer by electroless plating.  
     
     
         13 . The method for producing a connecting unit according to  claim 10 , wherein the conductive layer composed of a copper alloy is formed; an adherent layer composed of a metal selected from the group consisting of Cu, Ag, Au, Ru, Rh, Pd, Os, Ir, and Pt is formed on the conductive layer; and the auxiliary resilient layer composed of Ni or Ni—X wherein X is at least one element selected from the group consisting of P, W, Mn, Ti, and Be is formed on the adherent layer.  
     
     
         14 . The method for producing a connecting unit according to  claim 10 , wherein the auxiliary resilient layer composed of Ni or Ni—X wherein X is at least one element selected from the group consisting of P, W, Mn, Ti, and Be is formed; an adherent layer composed of a metal selected from the group consisting of Cu, Ag, Au, Ru, Rh, Pd, Os, Ir, and Pt is formed on the auxiliary resilient layer; and the conductive layer composed of a copper alloy is formed on the adherent layer.  
     
     
         15 . The method for producing a connecting unit according to  claim 13 , wherein the thickness of the adherent layer is controlled to be 0.01 to 0.1 μm.  
     
     
         16 . The method for producing a connecting unit according to  claim 10 , wherein the auxiliary resilient layer is formed with Ni or Ni—X wherein X is at least one element selected from the group consisting of P, W, Mn, Ti, and Be.  
     
     
         17 . The method for producing a connecting unit according to  claim 16 , wherein the auxiliary resilient layer is formed with Ni 100-X P X  wherein X satisfies 30≧x≧10 by atomic percent.  
     
     
         18 . The method for producing a connecting unit according to  claim 10 , wherein the conductive layer is formed with Cu, Au, Ag, Pd, or a copper alloy.  
     
     
         19 . The method for producing a connecting unit according to  claim 18 , wherein the copper alloy used for forming the conductive layer is a Corson alloy containing Cu, Si, and Ni.