Apparatus and method of cleaning a substrate

Abstract

A cleaning apparatus is provided with a processing bath to be filled with a cleaning chemical, an ultrasonic oscillator, and a retainer for holding a substrate to be immersed into a cleaning chemical. The front surface of the substrate is cleaned while ultrasonic waves are radiated from the ultrasonic oscillator onto the back surface of the substrate.

1 . A substrate cleaning method characterized in that a substrate whose surface has been processed is immersed in a cleaning chemical filled in a processing bath, and ultrasonic waves are radiated onto a back surface of the substrate, thereby cleaning a front surface of the substrate.  
     
     
         2 . The substrate cleaning method according to  claim 1 , wherein ultrasonic waves originate from a plurality of origination sources disposed in a dispersed manner.  
     
     
         3 . The substrate cleaning method according to  claim 1 , wherein the substrate is cleaned while being rotated.  
     
     
         4 . The substrate cleaning method according to  claim 1 , wherein ultrasonic waves are radiated by way of a propagation control member for scattering or damping ultrasonic waves.  
     
     
         5 . The substrate cleaning method according to  claim 1 , wherein cleaning is effected while the chemical through which ultrasonic waves propagate is stirred or agitated.  
     
     
         6 . A method of manufacturing a semiconductor device through use of the substrate cleaning method defined in  claim 1.