US2005158451A1PendingUtilityA1
Permeation layer attachment chemistry and method
Est. expiryDec 15, 2019(expired)· nominal 20-yr term from priority
G01N 27/40G01N 33/5438B01J 2219/00722B01J 2219/00659B01J 2219/00725C40B 40/10B01J 2219/00653C40B 40/06G01N 33/48
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Claims
Abstract
Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface. Methods for covalently attaching the permeation layer to the microchips are also described.
Claims
exact text as granted — not AI-modified1 . A method of covalently attaching a permeation layer having reactive moieties to an electrode of an electronically addressable microchip comprising:
contacting the surface of the electrode with a linker molecule by vapor deposition wherein the linker molecule comprises a first reactive moiety that is capable of reacting with the electrode surface to form a covalent bond with the electrode, and a second reactive moiety that is capable of reacting with monomers to form the permeation layer; reacting the first moiety of the linker molecule with the electrode surface to form a covalent bond between the linker molecule and the electrode surface; synthesizing the permeation layer by reacting the linker molecule with monomers under conditions where polymerization is conducted between the monomers and the second reactive moiety of the linker; wherein the resulting covalent attachment between the electrode and the linker and the permeation layer material is stable at a current density of at least 0.10 nA/μm 2 .
2 . The method of claim 1 , wherein the electrode is a metal/silicide electrode selected from the group consisting of platinum silicide, tungsten silicide, titanium silicide, and gold silicide.
3 . The method of claim 1 , wherein the electrode is a metal/metal electrode selected from the group consisting of platinum/titanium and gold /titanium.
4 . The method of claim 1 , wherein the electrode is an organic electrode selected from the group consisting of poly(phenylene vinylene), polythiophene, and polyaniline.
5 . The method of claim 1 , wherein the linker has the formula
wherein
X is selected from the group consisting of acrylate, methacrylate, acrylamide, methacrylamide, allyl, vinyl, acetyl, amine, substituted amine, epoxy and thiol;
SPACER is selected from the group consisting of alkyl, aryl, mono- or polyalkoxy, ethyleneglycol, polyethyleneglycol, mono- or polyalkylamine, mono- or polyamide, thioether derivatives, and mono- or polydisulfides;
A and B are selected from the group consisting of Oxygen-R, Cl, Br, X-SPACER moiety, and any combination thereof, wherein R is selected from the group consisting of H, alkyl, methyl, ethyl, propyl, isopropyl, and branched or linear alkyl of 4 to 10 carbon atoms; and
C is a hydrolyzable moiety selected from the group consisting of Oxygen-R, Cl, and Br, wherein R is selected from the group consisting of H, branched alkyl, methyl, ethyl, propyl, isopropyl, and branched or linear alkyl. of 4 to 10 carbon atoms.
6 . The method of claim 5 , wherein the linker is selected from the group consisting of
H 2 NCH 2 CH 2 CH 2 Si(OCH 3 ) 3, H 2 NCH 2 CH 2 NHCH 2 CH 2 CH 2 Si(OCH 3 ) 3, H 2 NCH 2 CH 2 CH 2 CH 2 CH 2 CH 2 NHCH 2 CH 2 CH 2 Si(OCH 3 ) 3, CH 2 ═C(CH 3 )COOCH 2 CH 2 CH 2 Si(OCH 3 ) 3, and CH 2 ═CHCONHCH 2 CH 2 CH 2 Si(OC 2 Hs) 3 .
7 . The method of claim 6 , wherein the linker is H 2 NCH 2 CH 2 CH 2 Si(OCH 3 ) 3 .
8 . The method of claim 6 , wherein the linker is H 2 NCH 2 CH 2 NHCH 2 CH 2 CH 2 Si(OCH 3 ) 3 .
9 . The method of claim 6 , wherein the linker is CH 2 ═C(CH 3 )COOCH 2 CH 2 CH 2 Si(OCH 3 ) 3 .
10 . The method of claim 5 , wherein the linker is an acrylate linker selected from the group consisting of
CH 2 ═CHCOOCH 2 CH 2 CH 2 Si(OCH 3 ) 3, CH 2 ═CHCOOCH 2 CH 2 CH 2 SiCl 3, CH 2 ═CHCOOCH 2 CH 2 CH 2 Si(CH 3 )(OCH 3 ) 2, CH 2 ═CHCOOCH 2 CH 2 CH 2 Si(CH 3 ) 2 (OCH 3 ), CH 2 ═CHCOOCH 2 CH 2 CH 2 Si(CH 3 )Cl 2, and CH 2 ═CHCOOCH 2 CH(OH)CH 2 NHCH 2 CH 2 CH 2 Si(OC2H 5 ) 3.
11 . The method of claim 5 , wherein the linker is a methacrylate linker selected from the group consisting of
CH 2 ═C(CH 3 )COOCH 2 CH 2 CH 2 Si(OCH 3 ) 3 , CH 2 ═C(CH 3 )COOCH 2 CH 2 CH 2 SiCl 3, CH 2 ═C(CH 3 )COOCH 2 CH 2 CH 2 Si(CH 3 )(OCH 3 ) 2, CH 2 ═C(CH 3 )COOCH 2 CH 2 CH 2 Si(CH 3 ) 2 (OCH 3 ), CH 2 ═C(CH 3 )COOCH 2 CH 2 CH 2 Si(CH 3 )Cl 2, and CH 2 ═C(CH 3 )COOCH 2 CH(OH)CH 2 NHCH 2 CH 2 CH 2 Si(OC 2 H 5 ) 3.
12 . The method of claim 5 , wherein the linker is an acrylamide linker selected from the group consisting of
CH 2 ═CHCONHCH 2 CH 2 CH 2 Si(OC 2 H 5 ) 3, CH 2 ═CHCONHCH 2 CH 2 CH 2 SiCl 3, CH 2 ═CHCONHCH 2 CH 2 CH 2 Si(CH 3 )(OCH 3 ) 2, CH 2 ═CHCONHCH 2 CH 2 CH 2 Si(CH 3 ) 2 (OCH 3 ), CH 2 ═CHCONRCH 2 CH 2 CH 2 Si(CH 3 )C1 2, CH 2 ═CHCONHCH 2 CH(OH)CH 2 NHCH 2 CH 2 CH 2 Si(OC 2 H 5 ) 3 , and CH 2 ═CHCONHCH 2 CH 2 CONHCH 2 CH 2 CONHCH 2 CH 2 CH 2 Si(OC 2 H 5 ) 3.
13 . The method of claim 5 , wherein the linker is a methacrylamide linker selected from the group consisting of
CH 2 ═C(CH 3 )CONHCH 2 CH 2 CH 2 Si(OCH 3 ) 3 , CH 2 ═C(CH 3 )CONHCH 2 CH 2 CH 2 SiCl 3, CH 2 ═C(CH 3 )CONHCH 2 CH 2 CH 2 Si(CH 3 )(OCH 3 ) 2, CH 2 ═C(CH 3 )CONHCH 2 CH 2 CH 2 Si(CH 3 ) 2 (OCH 3 ), CH 2 ═C(CH 3 )CONHCH 2 CH 2 CH 2 Si(CH 3 )Cl 2, and CH 2 ═C(CH 3 )CONHCH 2 CH(OH)CH 2 NHCH 2 CH 2 CH 2 Si(OC 2 H 5 ) 3.
14 . The method of claim 5 , wherein the linker is an allyl derivative linker selected from the group consisting of
CH 2 ═CHCH 2 NHCH 2 CH 2 CH 2 Si(OCH 3 ) 3, CH 2 ═CHCH 2 SiH(OCH 3 ) 2, CH 2 ═CHCH 2 Si(CH 3 ) 2 Cl, CH 2 ═CHCH 2 SiHCl 2, and CH 2 ═CHCH 2 Si(OCH 3 ) 3.
15 . The method of claim 5 , wherein the linker is an amino derivative linker selected from the group consisting of
H 2 NCH 2 CH 2 NHCH 2 CH 2 CH 2 Si(OCH 3 ) 3, H 2 NCH 2 CH 2 CH 2 CH 2 CH 2 CH 2 NHCH 2 CH 2 CH 2 Si(OCH 3 ) 3 , H 2 NCH 2 CH 2 CH 2 Si(OCH 3 ) 3 , and H 2 NCH 2 CH 2 CH 2 Si(OC 2 H 5 ) 3.
16 . The method of claim 5 , wherein the linker is an epoxy derivative linker selected from the group consisting of
17 . The method according to claim 1 , wherein the permeation layer is a hydrogel comprising a material selected from the group consisting of agarose, glyoxylagarose, acrylamide, methacrylamide, polyacrylamide, and other synthetic polymers.
18 . The method of claim 17 , wherein the hydrogel comprises glyoxylagarose.
19 . The method of claim 17 , wherein the hydrogel comprises polyacrylamide.
20 . The method of claim 1 , wherein the step of reacting the linker molecule with monomers is a Schiff base reduction or polymerization.
21 . The method of claim 1 , wherein the second reactive moiety of the linker comprises an amine group.
22 . The method of claim 1 , wherein steps (b) and (c) occur at different times.
23 . The method of claim 1 , wherein the step of reacting the first moiety of the linker molecule with the electrode surface comprises heat curing of the linker molecule and the electrode surface.
24 . The method of claim 1 , wherein the resulting covalent attachment between the electrode and the linker and the permeation layer material is stable at a current density of at least 0.14 nA/μm 2 .
25 . The method of claim 1 , wherein the resulting covalent attachment between the electrode and the linker and the permeation layer material is stable at a current density of at least 0.2 nA/μm 2 .
26 . The method of claim 1 , wherein the resulting covalent attachment between the electrode and the linker and the permeation layer material is stable at a current density of at least 0.4 nA/μm 2 .
27 . The method of claim 1 , wherein the step of reacting the linker molecule with monomers is a free radical polymerization reaction.
28 . The method of claim 1 , wherein the polymerization is conducted in a solution phase reaction.
29 . The method of claim 1 , wherein the polymerization is conducted between the monomers, and between the monomers and the second reactive moiety of the linker.Join the waitlist — get patent alerts
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