Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier

Abstract

To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 μm or less, and the microscopic line and a wiring board have large peel strength even after line of 15 μm is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 μm as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 μm or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment.

1 . An ultra-thin copper foil with a carrier foil wherein 
 a carrier foil, a peeling layer, an ultra-thin copper foil are electroplated in this order, and;    said ultra-thin copper foil is an electrolytic copper foil that has surface roughness of 2.5 μm as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 μm or more.    
     
     
         2 . An ultra-thin copper foil with a carrier foil wherein 
 a carrier foil, a peeling layer, an ultra-thin copper foil are electroplated in this order, and;    said ultra-thin copper foil is an electrolytic copper foil that has surface roughness of 2.5 μm as ten point height of roughness profile, the minimum distance between peaks of salients of a based material is 5 μm or more, and a crystal grain having average grains diameter is 2 μm or less is deposited on the surface.    
     
     
         3 . An ultra-thin copper foil with a carrier foil wherein an exposed surface of said ultra-thin copper foil as set forth in  claim 1  is performed chemical treatment and/or electrochemical treatment within a range that profile of said treatment side does not change.  
     
     
         4 . An ultra-thin copper foil with a carrier foil wherein 
 roughening treatment is performed on a surface of said ultra-thin copper foil as set forth in  claim 1 , and;    said treatment side is performed chemical treatment and/or electrochemical treatment within a range that profile of said treatment side does not change.    
     
     
         5 . An ultra-thin copper foil with a carrier foil wherein a roughening treatment result of the surface of said ultra-thin copper foil as set forth in  claim 4  is roughening plating by roughening treatment that a copper microscopic grain is electrodeposited.  
     
     
         6 . An ultra-thin copper foil with a carrier foil wherein roughening treatment of said ultra-thin copper foil as set forth in  claim 4  is chemical treatment and/or electrochemical treatment.  
     
     
         7 . An ultra-thin copper foil with a carrier foil wherein said peeling layer as set forth in  claim 1  consists of Cr, Ni, Co, Fe, Mo, Ti, W, P and/or these alloy metal layer, or these hydrous oxide layer, or an organic film.  
     
     
         8 . An ultra-thin copper foil with a carrier foil wherein an exposed surface of said ultra-thin copper foil as set forth in  claim 2  is performed chemical treatment and/or electrochemical treatment within a range that profile of said treatment side does not change.  
     
     
         9 . An ultra-thin copper foil with a carrier foil wherein 
 roughening treatment is performed on a surface of said ultra-thin copper foil as set forth in  claim 2 , and;    said treatment side is performed chemical treatment and/or electrochemical treatment within a range that profile of said treatment side does not change.    
     
     
         10 . An ultra-thin copper foil with a carrier foil wherein a roughening treatment result of the surface of said ultra-thin copper foil as set forth in  claim 9  is roughening plating by roughening treatment that a copper microscopic grain is electrodeposited.  
     
     
         11 . An ultra-thin copper foil with carrier foil wherein roughening treatment of said ultra-thin copper foil as set forth in  claim 9  is chemical treatment and/or electrochemical treatment.  
     
     
         12 . An ultra-thin copper foil with a carrier foil wherein said peeling layer as set forth in  claim 1  or  2  consists of Cr, Ni, Co, Fe, Mo, Ti, W, P and/or these alloy metal layer, or these hydrous oxide layer, or an organic film.  
     
     
         13 . A printed wiring board characterized in that high density ultra-fine wiring is performed by an ultra-thin copper foil with a carrier foil as set forth in  claim 1 .  
     
     
         14 . A printed wiring board characterized in that high density ultra-fine wiring is performed by an ultra-thin copper foil with a carrier foil as set forth in  claim 2 .  
     
     
         15 . A manufacturing method of an ultra-thin copper foil with a carrier foil comprising: 
 a step of performing a carrier foil, a peeling layer and an ultra-thin copper foil formed by an electrolytic copper foil having surface roughness of 2.5 μm as ten point height of roughness profile, having the minimum distance between peaks of salients of a based material is 5 μm or more, and having a crystal grain having average grains diameter is 2 μm or less deposited on the surface in this order, and;    a step of performing chemical treatment and/or electrochemical treatment onto an exposed surface of said ultra-thin copper foil within a range that profile of said exposed surface does not change.    
     
     
         16 . A manufacturing method of an ultra-thin copper foil with a carrier foil comprising: 
 a step of performing a carrier foil, a peeling layer and an ultra-thin copper foil formed by an electrolytic copper foil having surface roughness of 2.5 μm as ten point height of roughness profile, having the minimum distance between peaks of salients of a based material is 5 μm or more, and having a crystal grain having average grains diameter is 2 μm or less deposited on the surface in this order, and;    a step that the surface of said ultra-thin copper foil is performed roughening treatment, and a step of performing chemical treatment and/or electrochemical treatment onto the treatment side of said ultra-thin copper foil within a range that profile of said treatment side does not change.    
     
     
         17 . A manufacturing method of an ultra-thin copper foil with a carrier foil as set forth in  claim 16  wherein roughening treatment of the surface of said ultra-thin copper foil is roughening plating that a copper microscopic grain is electrodeposited.  
     
     
         18 . A manufacturing method of an ultra-thin copper foil with a carrier foil as set forth in  claim 16  wherein roughening treatment of the surface of said ultra-thin copper foil is performed by chemical etching and/or electrochemical etching.