Direct writeTM system

Abstract

Although the present invention has been described in detail with reference to particular preferred and alternative embodiments, persons possessing ordinary skill in the art to which this invention pertains will appreciate that various modifications and enhancements may be made without departing from the spirit and scope of the Claims that follow. The various configurations that have been disclosed above are intended to educate the reader about preferred and alternative embodiments, and are not intended to constrain the limits of the invention or the scope of the Claims. The List of Reference Characters which follows is intended to provide the reader with a convenient means of identifying elements of the invention in the Specification and Drawings. This list is not intended to delineate or narrow the scope of the Claims.

1 . A method for the fabrication of a conductive feature on a substrate, the method comprising the steps of: 
 (a) providing a precursor composition comprising a metal precursor compound, wherein said precursor composition has a viscosity between approximately 1 and 1000 cP;    (b) depositing said precursor composition on a substrate; and    (c) converting said precursor composition to a conductive feature by heating said precursor composition to a conversion temperature of not greater than approximately 200° C.    
     
     
         2 . The method as claimed in  claim 1 , wherein said feature has a minimum feature size of not greater than about 100 μm.  
     
     
         3 . The method as claimed in  claim 1 , wherein said feature has a minimum feature size of not greater than about 25 μm.  
     
     
         4 . The method as claimed in  claim 1 , wherein said precursor composition further comprises metallic particles.  
     
     
         5 . The method as claimed in  claim 4 , wherein said precursor composition further comprises metallic nanoparticles.  
     
     
         6 . The method as claimed in  claim 1 , wherein said depositing step comprises depositing said precursor composition using an aerosol jet.  
     
     
         7 . The method as claimed in  claim 1 , wherein said heating step comprises heating said precursor composition using a laser.  
     
     
         8 . The method as claimed in  claim 1 , wherein said heating step comprises heating said precursor composition thermally.  
     
     
         9 . The method as claimed in  claim 1 , wherein said heating step comprises heating using an infrared light.  
     
     
         10 . A method for the fabrication of an electronic device, the method comprising the steps of: 
 (a) providing a substrate comprising at least an electronic component on said substrate;    (b) depositing a metal precursor composition onto said substrate in the form of a feature contacting said electronic component, wherein said precursor trace has a minimum size of not greater than approximately 100 microns; and    (c) heating said deposited precursor ink to a temperature of not greater than approximately 200° C. to form a conductive feature electrically coupled to said component, said conductive feature having a minimum feature size of not greater than approximately 100 microns.    
     
     
         11 . The method as claimed in  claim 10 , wherein said minimum size of said trace and said conductive feature is not greater than about 25 μm.  
     
     
         12 . The method as claimed in  claim 10 , wherein said metal is silver.  
     
     
         13 . The method as claimed in  claim 10 , wherein said depositing step comprises depositing said precursor composition using an aerosol jet.  
     
     
         14 . The method as claimed in  claim 10 , wherein said precursor composition has a viscosity between approximately 1 and 1000 cP.  
     
     
         15 . A method for the fabrication of an electronic component, the method comprising the steps of: 
 (a) depositing a metal precursor precursor complosition onto said substrate in the form of a trace, wherein said precursor trace has a minimum size of not greater than approximately 100 microns;    (b) heating said deposited precursor ink to a temperature of not greater than approximately 200° C. to form a conductive feature, said conductive feature having a minimum feature size of not greater than approximately 100 microns; and    (c) depositing at least a first element on said substrate, wherein said conductive feature is electrically coupled to said first element.    
     
     
         16 . The method as claimed in  claim 15 , wherein said minimum size of said trace and said conductive feature is not greater than about 100 μm.  
     
     
         17 . The method as claimed in  claim 15 , wherein said minimum size of said trace and said conductive feature is not greater than about 25 μm.  
     
     
         18 . The method as claimed in  claim 15 , wherein said metal is silver.  
     
     
         19 . The method as claimed in  claim 15 , wherein said depositing step comprises depositing said precursor composition using an aerosol jet.  
     
     
         20 . The method as claimed in  claim 15 , wherein said precursor composition has a viscosity between approximately 1 and 1000 cP.