Compression molded inorganic fiber articles, and methods and compositions used in molding same

Abstract

A method of forming articles made of an inorganic fiber material using compression molding. In one respect, a method of forming an article, wherein the method includes providing a molding composition comprising inorganic fiber and an inorganic binder, and compression molding the molding composition into the article. In another respect, the method including providing a molding composition comprising inorganic fibers and a binder, and compression molding the molding composition into the article, wherein at least 75% by weight of the molded article is inorganic material. In some embodiments the cured binder is capable of withstanding temperatures of at least 600° F. without significant degradation or deterioration due to heat. Articles made by the use of such methods and a molding composition for use in compression molding an article are also included.

1 . A compression molding composition for use in compression molding an article, said composition comprising: 
 an inorganic fiber, a binder, and a carrier solvent;    wherein the composition comprises less than about 25% by wt. inorganic fiber in an amount to be bound by the inorganic binder during the compression molding to form the article; and    wherein substantially all of the inorganic fiber comprises a fiber length of at least about ⅛ of an inch.    
     
     
         2 . The composition of  claim 1 , wherein the fiber length is less than about 2 inches.  
     
     
         3 . The composition of  claim 2 , wherein the fiber length is less than about 1 inch.  
     
     
         4 . The composition of  claim 3 , wherein the fiber length is about ⅛ of an inch to ½ of an inch.  
     
     
         5 . The composition of  claim 1 , wherein substantially all of the inorganic fiber comprises a diameter in a range of 1 micron to 30 microns.  
     
     
         6 . The composition of  claim 5 , wherein the diameter is in the range of 4 microns to 9 microns.  
     
     
         7 . The composition of  claim 6 , wherein the diameter is in the range of 5 microns to 7 microns.  
     
     
         8 . The composition of  claim 1 , wherein the inorganic fiber comprises glass fibers, ceramic fibers, refractory fibers, refractory ceramic fibers, mineral fibers, or mixtures thereof.  
     
     
         9 . The composition of  claim 1 , wherein the inorganic fiber comprises chopped fiber glass.  
     
     
         10 . The composition of  claim 1 , wherein the binder comprises silica, sodium, calcium, and magnesium based binders, or mixtures thereof.  
     
     
         11 . The composition of  claim 1 , further comprising a carrier solvent.  
     
     
         12 . The composition of  claim 11 , wherein the carrier solvent comprises water.  
     
     
         13 . The composition of  claim 1 , wherein the composition comprises less than about 10% by wt. inorganic fiber.  
     
     
         14 . The composition of  claim 13 , wherein the composition comprises less than about 5% by wt. inorganic fiber.  
     
     
         15 . The composition of  claim 1 , wherein the composition comprises in the range of about 15 to 35% by wt. binder.  
     
     
         16 . The composition of  claim 15 , wherein the composition comprises in the range of about 20 to 30% by wt. binder.  
     
     
         17 . The composition of  claim 1 , wherein the composition comprises in the range of about 15 to 45% by wt. carrier solvent.  
     
     
         18 . The composition of  claim 17 , wherein the composition comprises in the range of about 20 to 40% by wt. carrier solvent.  
     
     
         19 . The composition of  claim 18 , wherein the composition comprises in the range of about 25 to 35% by wt. carrier solvent.  
     
     
         20 . The composition of  claim 1 , wherein the composition comprises in the range of about 0 to 70% by wt. additional additives.  
     
     
         21 . The composition of  claim 20 , wherein the additional additives comprise an inorganic filler in the range of 15 to 70% by weight of the total composition.  
     
     
         22 . The composition of  claim 1 , wherein the composition has a moisture content in the range of 20 to 35% by weight of the total composition.  
     
     
         23 . The composition of  claim 1 , wherein the composition comprises in the range of about 15 to 35% by wt. inorganic binder, in the range of about 15 to 45% by wt. carrier solvent, and in the range of about 0 to 70% by wt. additional solid additives.  
     
     
         24 . A molding composition for use in forming an article, said composition comprising: 
 an inorganic fiber, an inorganic binder, and a carrier solvent;    wherein the composition comprises less than about 25% by wt. inorganic fiber in an amount to be bound by the inorganic binder during the forming of the article;    wherein the composition comprises in the range of about 15 to 35% by wt. inorganic binder;    wherein the composition comprises in the range of about 15 to 45% by wt. carrier solvent; and    wherein the composition comprises in the range of about 0 to 70% by wt. additional solid additives.    
     
     
         25 . The composition of  claim 24 , wherein at least a portion of the inorganic binder is suspended in at least a portion of the carrier solvent.  
     
     
         26 . The composition of  claim 24 , wherein the inorganic binder and at least a portion of the carrier solvent form a colloidal silica.  
     
     
         27 . The composition of  claim 24 , wherein the molding composition is a compression molding composition.  
     
     
         28 . A molding composition for use in forming an article, said composition comprising: 
 an inorganic fiber and an inorganic binder, wherein at least a portion of the inorganic binder is suspended in a carrier solvent;    wherein the composition comprises less than about 25% by wt. inorganic fiber in an amount to be bound by the inorganic binder during the forming of the article;    wherein the composition comprises in the range of about 15 to 35% by wt. inorganic binder; and    wherein substantially all of the inorganic fiber comprises a fiber length of at least about ⅛ of an inch.    
     
     
         29 . The composition of  claim 28 , wherein the molding composition is a compression molding composition.  
     
     
         30 . The composition of  claim 28 , wherein the fiber length is less than about 2 inches.  
     
     
         31 . The composition of  claim 28 , further comprising in the range of about 15 to 45% by wt. carrier solvent.