Heat sink-type cooling device for an integrated circuit

Abstract

A heat sink-type cooling device for an integrated circuit having a base and plurality of fin extended upward. The plurality of fins are divided into more than one heat zones and said plurality of heat zones have a height drop between each two zones wherein a rectangular hole can also be punched on the plate end of said plurality of fin which is not connected with said base. By these heat zones with height drop between each two zones, the heat sink-type cooling device is able to match up the inner space allocation of the computer mainframe and be assembled even more easily into the computer mainframe so that heat is dispersed efficiently.

1 - 7 . (canceled)  
   
   
       8 . A heat sink cooling device for an integrated circuit comprising: 
 a) a base; and    b) a plurality of heat zones having: 
 i) at least one first heat zone having a plurality of first heat zone fins, the plurality of first heat zone fins having a plurality of first heat zone vertical plates and a plurality of first heat zone horizontal plates, each first heat zone vertical plate is located between two first heat zone horizontal plates of the plurality of first heat zone horizontal plates, each two first heat zone horizontal plates including a first top horizontal plate and a first bottom horizontal plate, each first bottom horizontal plate is connected to the base and each first top horizontal plate is spaced apart from the base; and  
 ii) at least one second heat zone having a plurality of second heat zone fins, the plurality of second heat zone fins having a plurality of second heat zone vertical plates and a plurality of second heat zone horizontal plates, each second heat zone vertical plate is located between two second heat zone horizontal plates of the plurality of second heat zone horizontal plates, each two second heat zone horizontal plates including a second top horizontal plate and a second bottom horizontal plate, each second bottom horizontal plate is connected to the base and each second top horizontal plate is spaced apart from the base,  
 wherein each of the plurality of first heat zone vertical plates have a height that is higher than a height of each of the plurality of second heat zone vertical plates and each of the plurality of first heat zone vertical plates have a bottom in a same plane as a bottom of each of the plurality of second heat zone vertical plates.  
   
   
   
       9 . The heat sink cooling device according to  claim 8 , wherein the plurality of heat zones includes one first heat zone and one second heat zone.  
   
   
       10 . The heat sink cooling device according to  claim 8 , wherein the plurality of heat zones includes one first heat zone and two second heat zones.  
   
   
       11 . The heat sink cooling device according to  claim 8 , wherein the plurality of heat zones includes two first heat zones and one second heat zone.  
   
   
       12 . The heat sink cooling device according to  claim 8 , wherein each first top horizontal plate and each second top horizontal plate includes a rectangular hole.  
   
   
       13 . The heat sink cooling device according to  claim 8 , wherein the plurality of heat zones are formed by bending a metal plate.