Packaging structure and component installation method for oscillator

Abstract

Disclosed are a packaging structure of an oscillator and a method for installing components in the packaging structure. Fluid capillarity and surface tension are utilized so that both the dimension of the oscillator can be reduced and the contamination of the piezoelectric components of the oscillator can be avoided at the same time. The packaging structure includes a platform having a top surface and a bottom surface, a number of side rims on the circumstance of the top surface extending upward for a distance and forming a top-open space with the top surface that can receive at least a piezoelectric component; a top cover sealing the top-open space into a closed and airtight space; a circuit placed beneath the bottom surface that can attach at least an electronic component, a number of pillars of a same length positioned on the circuit; a bottom cover having an adhesive injection aperture and joining the pillars to form a partially open space, and a malleable material filling the partially open space through the aperture.

1 . A packaging structure for an oscillator comprising: 
 a platform having a top surface and a bottom surface;    a plurality of side rims on a circumference of said top surface extending outward for a distance perpendicularly to said top surface, and jointly forming a top-open space along with said top surface, wherein said top-open space receives at least a piezoelectric component;    a top cover sealing said top-open space into a closed space;    a circuit beneath said bottom surface comprising at least an electronic component;    a plurality of pillars of a same length dispersed on said circuit;    a bottom cover attaching to said pillars and jointly forming a partially open space along with said bottom surface, wherein bottom cover has an adhesive injection aperture; and    a malleable material filling said partially open space.    
   
   
       2 . The packaging structure for an oscillator according to  claim 1 , wherein said platform further comprises a plurality of side surfaces each having a plurality of electrodes for electrically connecting said circuit on said bottom surface to an external circuit.  
   
   
       3 . The packaging structure for an oscillator according to  claim 1 , wherein said platform is made of a ceramic material.  
   
   
       4 . The packaging structure for an oscillator according to  claim 1 , wherein said plurality of side rims have a plurality of soldering pads on top of said side rims for attaching to said top cover.  
   
   
       5 . The packaging structure for an oscillator according to  claim 4 , wherein said plurality of soldering pads are made of a metal with a specific thickness or a metal-plated film.  
   
   
       6 . The packaging structure for an oscillator according to  claim 1 , wherein said piezoelectric component is an AT-CUT quartz crystal.  
   
   
       7 . The packaging structure for an oscillator according to  claim 1 , wherein said at least an electronic component is an integrated circuit.  
   
   
       8 . The packaging structure for an oscillator according to  claim 1 , wherein said at least an electronic component comprises an integrated circuit and at least a capacitor.  
   
   
       9 . The packaging structure for an oscillator according to  claim 1 , wherein said top cover comprises a metal.  
   
   
       10 . The packaging structure for an oscillator according to  claim 1 , wherein said plurality of pillars comprise a conducting material.  
   
   
       11 . The packaging structure for an oscillator according to  claim 1 , wherein said bottom cover is made of a ceramic material.  
   
   
       12 . The packaging structure for an oscillator according to  claim 1 , wherein said bottom cover is made of a material for making printed circuit boards.  
   
   
       13 . The packaging structure for an oscillator according to  claim 1 , wherein said bottom cover further comprises a top surface and a bottom surface, each having a plurality of soldering pads for electrically connecting said plurality of pillars to an external circuit.  
   
   
       14 . The packaging structure for an oscillator according to  claim 1 , wherein said malleable material is epoxy resin.  
   
   
       15 . The packaging structure for an oscillator according to  claim 1 , wherein said malleable material is confined by a capillarity and surface tension of said malleable material within said partially open space formed by said bottom cover, said pillars, and said bottom surface.  
   
   
       16 . A method for installing components in a packaging structure of an oscillator comprising the steps of: 
 providing a packaging structure having a top-open space and a bottom surface;    attaching and sealing a piezoelectric component in said partially open space;    attaching a plurality of electronic components on said bottom surface of said packaging structure;    providing a plurality of pillars beneath said bottom surface of said packaging structure;    attaching a bottom cover to said pillars to form a partially open space, said bottom cover having an adhesive injection aperture;    filling a malleable material in said partially open space through said adhesive injection aperture; and    adjusting an output frequency and functionality of said oscillator.