Temperature-controlled rework system

Abstract

A temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of the adjacent area to below a temperature of the rework zone. The system also comprises a temperature control system adapted to monitor the temperature of the adjacent area.

1 - 21 . (canceled)  
   
   
       22 . A rework system, comprising: 
 a manifold assembly adapted to deliver a low temperature gas flow to an area of a printed circuit board adjacent a rework zone, the manifold assembly adapted to cooperate with a nozzle for directing a high temperature gas flow toward the rework zone.    
   
   
       23 . The system of  claim 22 , wherein the manifold assembly comprises an opening for receiving the nozzle.  
   
   
       24 . The system of  claim 22 , wherein the manifold assembly comprises a manifold having plurality of apertures for delivering the low temperature gas flow.  
   
   
       25 . The system of  claim 22 , wherein the manifold assembly is adapted to deliver the low temperature gas flow about a perimeter of the rework zone.  
   
   
       26 . The system of  claim 22 , wherein the manifold assembly comprises a plurality of supports adapted to support a manifold of the manifold assembly a desired distance from the printed circuit board.  
   
   
       27 . The system of  claim 22 , wherein the manifold assembly comprises a plurality of flexible supports.  
   
   
       28 . The system of  claim 22 , wherein the manifold assembly comprises a plurality of supports adapted to accommodate height variations of the printed circuit board.  
   
   
       29 . The system of  claim 22 , wherein the manifold assembly comprises a plurality of supports adapted to support a manifold of the manifold assembly a desired distance from the printed circuit board in response to a force applied to the manifold toward the printed circuit board.  
   
   
       30 . A rework assembly, comprising: 
 means for delivering a low temperature gas flow to an area of a printed circuit board adjacent a rework zone; and    means formed in the delivering means for cooperating with a means for directing a high temperature gas flow toward the rework zone.    
   
   
       31 . The system of  claim 30 , wherein the delivering means comprises means for delivering the low temperature gas flow about a perimeter of the rework zone.  
   
   
       32 . The system of  claim 30 , wherein the delivering means comprises means for supporting a manifold of the delivering means a desired distance from the printed circuit board.  
   
   
       33 . The system of  claim 30 , wherein the delivering means comprises means for accommodating height variations of the printed circuit board.  
   
   
       34 . The system of  claim 30 , wherein the delivering means comprises means for supporting a manifold of the delivering means a desired distance from the printed circuit board in response to a force applied to the manifold toward the printed circuit board.  
   
   
       35 . A rework system, comprising: 
 a nozzle adapted to direct a high temperature gas flow toward a rework zone of a printed circuit board; and    a manifold assembly disposed about a perimeter of the nozzle for delivering a low temperature gas flow about the perimeter of the rework zone.    
   
   
       36 . The system of  claim 35 , wherein the manifold assembly comprises a centrally disposed opening for receiving the nozzle.  
   
   
       37 . The system of  claim 35 , wherein the manifold assembly comprises a plurality of flexible supports.  
   
   
       38 . The system of  claim 35 , wherein the manifold assembly is adapted to accommodate height variations of the printed circuit board.  
   
   
       39 . The system of  claim 35 , wherein the manifold assembly comprises a plurality of supports for supporting a manifold a desired distance from the printed circuit board.  
   
   
       40 . The system of  claim 35 , wherein the manifold assembly comprises a plurality of supports for supporting a manifold a desired distance from the printed circuit board in response to a force applied to the manifold toward the printed circuit board.