Heat absorber and its fabrication

Abstract

A heat absorber is constructed to have a heat-absorber plate and a liquid cooled tube, the liquid cooled tube being curved circuitously on a common plane that is closely attached to the top surface of the heat-absorber plate, and then welded to the top surface of the heat-absorber plate. By means of the design of the liquid cooled tube, heat-transfer fluid can flow through the liquid cooled tube, and no additional sealing gasket is necessary to prevent leakage.

1 . A heat absorber fabrication method comprising the steps of: 
 a) placing a liquid cooled tube on the top surface of a heat-absorber plate, said liquid cooled tube being curved circuitously on a common plane;    b) providing a solder to the top surface of said heat-absorber plate and said liquid cooled tube;    c) heating said heat-absorber plate and said liquid cooled tube and said solder to melt said solder and to let the molten solder fill up capillary gaps in between said heat-absorber plate and said liquid cooled tube; and    d) cooling down said heat-absorber plate and said liquid cooled tube to harden said solder and to let the hardened solder be bonded to said heat-absorber plate and said liquid cooled tube;    wherein said solder is a weld rod of P/Cu that has a melting point lower than said heat-absorber plate and said liquid cooled tube.    
   
   
       2 . The heat absorber fabrication method as claimed in  claim 1 , wherein said liquid cooled tube has a flat shape in section.  
   
   
       3 . (canceled)  
   
   
       4 . The heat absorber fabrication method as claimed in  claim 1 , wherein said step c) to heat said heat-absorber plate and said liquid cooled tube and said solder is performed in a furnace.  
   
   
       5 . The heat absorber fabrication method as claimed in  claim 4 , wherein said furnace is a brazing furnace.  
   
   
       6 - 10 . (canceled)  
   
   
       11 . A heat absorber fabrication method for manufacturing a heat absorber for a computer processing unit comprising the steps of: 
 a) placing a liquid cooling tube on a top surface of a heat-absorber plate, said liquid cooling tube being curved circuitously on a common plane;    b) providing a solder to the top surface of said heat-absorber plate and said liquid cooling tube;    c) heating said heat-absorber plate and said liquid cooling tube and said solder to melt said solder and to let the molten solder fill up capillary gaps in between said heat-absorber plate and said liquid cooling tube; and    d) cooling down said heat-absorber plate and said liquid cooling tube to harden said solder and to let the hardened solder be bonded to said heat-absorber plate and said liquid cooling tube;    wherein said solder is a weld rod of P/Cu that has a melting point lower than said heat-absorber plate and said liquid cooling tube.    
   
   
       12 . The heat absorber fabrication method as claimed in  claim 11 , wherein said liquid cooled tube has two flat and opposed surfaces in cross section.  
   
   
       13 . The heat absorber fabrication method as claimed in  claim 11 , wherein said step c) to heat said heat-absorber plate and said liquid cooled tube and said solder is performed in a furnace.  
   
   
       14 . The heat absorber fabrication method as claimed in  claim 13 , wherein said furnace is a brazing furnace.