Flip-chip attach structure

Abstract

A flip-chip attach method includes the steps of: attaching a chip on a transparent substrate such that each connecting pad of the chip is aligned with each electrical connection pad on the transparent substrate; and irradiating each connecting pad and each electrical connection pad from a side of the transparent substrate with a laser beam so as to weld the connecting pad to the electrical connection pad. Furthermore, the invention also provides a flip-chip attach structure including a transparent substrate and at least one chip. A surface of the transparent substrate is formed with a plurality of electrical connection pads, and the chip has a plurality of connecting pads. The connecting pads and the electrical connection pads are irradiated with a laser beam and are welded to each other. Thus, the chip is mounted to the transparent substrate.

1 . A flip-chip attach structure, comprising: 
 a transparent substrate having one surface formed with a plurality of electrical connection pads; and    at least one chip formed with a plurality of connecting pads, wherein the connecting pads are respectively welded to the electrical connection pads by irradiating the pads with a laser beam so as to attach the chip on the transparent substrate.    
   
   
       2 . The structure according to  claim 1 , wherein each of the connecting pads is further formed with a protrusion.  
   
   
       3 . The structure according to  claim 2 , wherein the protrusion is a solder bump.  
   
   
       4 . The structure according to  claim 2 , wherein the protrusion is a gold bump.  
   
   
       5 . The structure according to  claim 1 , wherein each of the electrical connection pads on the surface of the transparent substrate is further formed with a protrusion.  
   
   
       6 . The structure according to  claim 5 , wherein the protrusion is a solder bump.  
   
   
       7 . The structure according to  claim 5 , wherein the protrusion is a gold bump.  
   
   
       8 . The structure according to  claim 1 , wherein the transparent substrate is a glass substrate.