Semiconductor laser apparatus, laser coupler, data reproduction apparatus, data recording apparatus and production method of semiconductor laser apparatus

Abstract

There is provided a semiconductor laser apparatus capable of individually optimizing oscillations at a plurality of light emitting units fabricated on the single substrate in accordance with usages of each emitted laser lights. A plurality of cavities (laser diodes A and B), which correspond to the plurality of light emitting units, are fabricated on single substrate. And cavity lengths of the cavities are fabricated to different from one another.

1 . A semiconductor laser apparatus having a plurality of cavities corresponding to a plurality of light emitting units disposed on a substrate, wherein: 
 at least one of said plurality of cavities has a cavity length different from another of said plurality of cavities.    
   
   
       2 . A semiconductor laser apparatus according to  claim 1 , wherein: 
 said plurality of cavities is fabricated to have cavity lengths corresponding to oscillation wavelengths of lights emitted from respective cavities.    
   
   
       3 . A semiconductor laser apparatus according to  claim 1 , wherein: 
 said plurality of cavities is fabricated to have cavity lengths all less than a length of said substrate.    
   
   
       4 . A semiconductor laser apparatus according to  claim 1 , further comprising: 
 a barrier member disposed in between neighboring cavities.    
   
   
       5 . A semiconductor laser apparatus according to  claim 1 , wherein: 
 one of said plurality of cavities comprises a three-element type compound semiconductor, and another of the plurality of cavities comprises a four-element type compound semiconductor.    
   
   
       6 . A semiconductor laser apparatus according to  claim 1 , wherein: 
 one of said plurality of cavities emits laser light with a 780 nm band oscillation wavelength, and another of said plurality of cavities emits laser light with a 650 nm band oscillation wavelength.    
   
   
       7 . A semiconductor laser apparatus according to  claim 1 , wherein: 
 one of said plurality of cavities is provided to be used for CD (compact disk), and another of said plurality of cavities is provided to be used for DVD (digital video disk).    
   
   
       8 . A laser coupler apparatus having a semiconductor laser apparatus, wherein: 
 said semiconductor laser apparatus comprises a plurality of cavities corresponding to a plurality of light emitting units disposed on a substrate, and    at least one of said plurality of cavities has a cavity length different from another of said plurality of cavities.    
   
   
       9 . A data reproducing apparatus having a semiconductor laser apparatus, wherein: 
 said semiconductor laser apparatus comprises a plurality of cavities corresponding to a plurality of light emitting units disposed on a substrate, and    at least one of said plurality of cavities has a cavity length different from another of said plurality of cavities.    
   
   
       10 . A data recording apparatus having a semiconductor laser apparatus, wherein: 
 said semiconductor laser apparatus comprises a plurality of cavities corresponding to a plurality of light emitting units disposed on a substrate, and    at least one of said plurality of cavities has a cavity length different from another of said plurality of cavities.    
   
   
       11 . A production method of a semiconductor laser comprising the steps of: 
 a step of constructing a plurality of cavities corresponding to a plurality of light emitting units disposed on a substrate, and    a step of removing a part of at least one of said plurality of cavities to set cavity lengths of said plurality of cavities.    
   
   
       12 . A production method according to  claim 11 , wherein: 
 said at least one of said plurality of cavities is removed by a dry process.    
   
   
       13 . A production method according to  claim 11 , wherein: 
 one of said plurality of cavities having the largest cavity length is fabricated by using cleavage process.