US2005186412A1PendingUtilityA1
Forming thin films on substrates using a porous carrier
Assignee: INNOVATION CHEMICAL TECHNOLOGIPriority: Oct 29, 2001Filed: Apr 8, 2005Published: Aug 25, 2005
Est. expiryOct 29, 2021(expired)· nominal 20-yr term from priority
Inventors:Pramod K. Arora
B32B 3/26Y10T428/24997C03C 25/22B05D 1/60C23C 14/243C03C 17/001C23C 14/12
56
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Claims
Abstract
The invention relates to a composite containing a porous carrier and an amphiphilic material. The composite may be employed in methods and systems for forming thin films on substrates.
Claims
exact text as granted — not AI-modified1 . A method of forming a thin film on a substrate, comprising:
providing the substrate in a chamber; inserting a composite comprising a metallic porous carrier and an amphiphilic material into the chamber, wherein the amphiphilic material is represented by Formula I: R m SiZ n (I) where each R is individually fluorinated alkyl or fluorinated alkyl ether containing from about 1 to about 30 carbon atoms; each Z is individually one of hydrogen, halogens, hydroxy, alkoxy and acetoxy; and m is from about 1 to about 3, n is from about 1 to about 3, and m+n equal 4; in the chamber, setting at least one of a temperature of the composite from about 20 to about 400° C. and a pressure from about 0.000001 to about 760 torr to induce vaporization of the amphiphilic material; and recovering the substrate having the thin film thereon.
2 . The method of claim 1 , wherein the substrate comprises at least one of a glass, a glass having an antireflection coating thereon, silica, germanium oxide, a ceramic, porcelain, fiberglass, a metal, a thermoset, and a thermoplastic.
3 . The method of claim 1 , wherein the metallic porous carrier comprises pores having an average pore size from about 1 micron to about 1,000 microns.
4 . The method of claim 1 , wherein the metallic porous carrier has a porosity so that it absorbs from about 0.001 g to about 5 g of amphiphilic material per cm 3 of metallic porous carrier.
5 . The method of claim 1 , wherein the metallic porous carrier comprises at least one of aluminum, brass, bronze, chromium, copper, gold, iron, nickel, palladium, platinum, silver, stainless steel, tin, titanium, tungsten, zinc, and zirconium.
6 . The method of claim 1 , after setting at least one of the temperature and the pressure, keeping the substrate in the chamber for a time from about 10 seconds to about 24 hours.
7 . The method of claim 1 , wherein
where each R is fluorinated alkyl ether containing from about 1 to about 30 carbon atoms.
8 . The method of claim 1 , wherein the pressure is set prior to setting the temperature.
9 . The method of claim 1 , wherein the temperature is set from about 40 to about 350° C. and the pressure is set from about 0.00001 to about 200 torr.
10 . The method of claim 1 , wherein the thin film is formed at a rate of about 0.01 nm/sec or more and about 1 nm/sec or less.
11 . The method of claim 1 , wherein the thin film has a thickness from about 1 nm to about 250 nm.
12 . A system for forming a thin film, comprising:
a film forming chamber in communication with at least one of a heat source and a vacuum system; a composite comprising a metallic porous carrier and an amphiphilic material positionable within the film forming chamber, the amphiphilic material comprising at least one of a polyhedral oligomeric silsesquioxane and a compound represented by Formula I: R m SiZ n (I) where each R is individually fluorinated alkyl or fluorinated alkyl ether containing from about 1 to about 30 carbon atoms; each Z is individually one of hydrogen, halogens, hydroxy, alkoxy and acetoxy; and m is from about 1 to about 3, n is from about 1 to about 3, and m+n equal 4; and a substrate on which the thin film is formed positionable within the film forming chamber.
13 . The system of claim 12 , wherein the film forming chamber is in communication with a heat source and a vacuum system.
14 . The system of claim 12 , wherein the metallic porous carrier comprises pores having an average pore size from about 5 microns to about 500 microns.
15 . The system of claim 12 , wherein the composite comprises from about 0.01 g to about 2 g of the amphiphilic material per cm 3 of metallic porous carrier.
16 . The system of claim 12 , wherein the composite further comprises at least one of a non-polar organic solvent, a film forming catalyst, and a quencher.
17 . A film forming composite, comprising:
a metallic porous carrier comprising pores having an average pore size from about 1 micron to about 1,000 microns; and an amphiphilic material, the amphiphilic material comprising at least one of a polyhedral oligomeric silsesquioxane and a compound represented by Formula I: R m SiZ n (I) where each R is individually fluorinated alkyl or fluorinated alkyl ether containing from about 1 to about 30 carbon atoms; each Z is individually one of hydrogen, halogens, hydroxy, alkoxy and acetoxy; and m is from about 1 to about 3, n is from about 1 to about 3, and m+n equal 4, wherein the metallic porous carrier has a porosity so that it absorbs from about 0.001 g to about 5 g of amphiphilic material per cm 3 of metallic porous carrier.
18 . The film forming composite of claims 17 , wherein the metallic porous carrier comprises at least one of aluminum, brass, bronze, chromium, copper, gold, iron, nickel, palladium, platinum, silver, stainless steel, tin, titanium, tungsten, zinc, and zirconium.
19 . The film forming composite of claims 17 , wherein the metallic porous carrier comprises pores having an average pore size from about 5 microns to about 500 microns and the porous carrier has a porosity so that it absorbs from about 0.01 g to about 1 g of amphiphilic material per cm 3 of metallic porous carrier.
20 . The film forming composite of claims 17 , wherein the composite has one of a cylindrical shape, a spherical shape, an oval shape, a tablet shape, a disc shape, a plug shape, a pellet shape, a cubical shape, a rectangular shape, and a conical shape.
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