Method and device for coating a substrate

Abstract

Apparatus and methods for coating a substrate. In an exemplary embodiment, the apparatus are used to create a metallized substrate for use as an EMI/RFI shield. The apparatus typically includes a movable processing apparatus that is movable orthogonal to the substrate to treat the substrate. The processing apparatus can include a surface preparation assembly, a heating assembly, a thermoforming assembly, a metallizing assembly, a cutting assembly, or the like.

1 .- 31 . (canceled)  
     
     
         32 . A method of manufacturing a EMI shield, the method comprising: 
 positioning a substrate on a support;    moving a processing apparatus adjacent to the substrate;    depositing a metal layer on the substrate; and    moving the processing apparatus away from the substrate.    
     
     
         33 . The method of  claim 32  further comprising creating a vacuum around at least a portion of the substrate.  
     
     
         34 . The method of  claim 32  further comprising moving the substrate along the support.  
     
     
         35 . The method of  claim 32  further comprising shaping the substrate before depositing the metal layer.  
     
     
         36 . The method of  claim 35  wherein depositing requires rotating a processing apparatus to rotate a shaping module away from the substrate and a metal depositing module toward the substrate.  
     
     
         37 . The method of  claim 35  comprising cutting the shaped substrate after depositing the metal layer.