Integrated VCSELs on traditional VLSI packaging

Abstract

A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic VLSI package substrate, resulting is a high density device with a small footprint. Interconnection between the electronic devices and the VCSEL array modules is accomplished using standard integrated circuit packaging technology and flexible connectors. Optical connections from the VCSEL arrays to fiber optic cables are made possible by integrating industry-standard optical connectors onto the package. Optical receiver and transceiver modules may also be incorporated into the circuit module.

1 . A method for construction of a circuit module comprising the steps of: 
 a) providing a VLSI package substrate;    b) attaching an ASIC to the VLSI package substrate;    c) attaching a plurality of VCSEL array modules to at least one flexible connector;    d) attaching the at least one flexible connector to the VLSI package substrate; and    e) electrically coupling the ASIC to the VCSEL array modules through the at least one flexible connector.    
     
     
         2 . The method for construction of a circuit module as recited in  claim 1 , wherein the ASIC is electrically coupled to the VCSEL array modules through the VLSI package substrate and the at least one flexible connector.  
     
     
         3 . The method for construction of a circuit module as recited in  claim 1 , further comprising the step of: 
 f) attaching a heat spreader to the VLSI package substrate, wherein the heat spreader is thermally coupled to the ASIC.    
     
     
         4 . The method for construction of a circuit module as recited in  claim 1 , further comprising the steps of: 
 f) attaching a plurality of optical receiver modules to at least one flexible connector; and    g) electrically coupling the ASIC to the optical receiver modules through the at least one flexible connector.    
     
     
         5 . The method for construction of a circuit module as recited in  claim 4 , wherein the ASIC is electrically coupled to the optical receiver modules through the substrate and the at least one flexible connector.  
     
     
         6 . A method for construction of a circuit module comprising the steps of: 
 a) providing a VLSI package substrate;    b) attaching an ASIC to the VLSI package substrate;    c) attaching a plurality of optical receiver modules to at least one flexible connector;    d) attaching the flexible connector to the VLSI package substrate; and    e) electrically coupling the ASIC to the optical receiver modules through the at least one flexible connector.    
     
     
         7 . The method for construction of a circuit module as recited in  claim 6 , wherein the ASIC is electrically coupled to the optical receiver modules through the VLSI package substrate and the at least one flexible connector.  
     
     
         8 . The method for construction of a circuit module as recited in  claim 6 , further comprising the step of: 
 f) attaching a heat spreader to the VLSI package substrate, wherein the heat spreader is thermally coupled to the ASIC.    
     
     
         9 . A method for construction of a circuit module comprising the steps of: 
 a) providing a VLSI package substrate;    b) attaching an ASIC to the VLSI package substrate;    c) attaching a plurality of VCSEL transceiver modules to the VLSI package substrate; and    d) electrically coupling the ASIC to the VCSEL transceiver modules through the VLSI package substrate.    
     
     
         10 . The method for construction of a circuit module as recited in  claim 9 , further comprising the step of: 
 e) attaching a heat spreader to the VLSI package substrate, wherein the heat spreader is thermally coupled to the ASIC.    
     
     
         11 . The method for construction of a circuit module as recited in  claim 9 , further comprising the steps of: 
 e) attaching a plurality of VCSEL array modules to the VLSI package substrate; and    f) electrically coupling the ASIC to the VCSEL array modules through the VLSI package substrate.    
     
     
         12 . The method for construction of a circuit module as recited in  claim 9 , further comprising the steps of: 
 e) attaching a plurality of optical receiver modules to the VLSI package substrate; and    a) electrically coupling the ASIC to the optical receiver modules through the VLSI package substrate.    
     
     
         13 . A method for construction of a circuit module comprising the steps of: 
 a) providing a VLSI package substrate;    b) attaching an ASIC to the VLSI package substrate;    c) attaching a plurality of VCSEL transceiver modules to at least one flexible connector;    d) attaching the at least one flexible connector to the VLSI package substrate; and    e) electrically coupling the ASIC to the VCSEL transceiver modules through the at least one flexible connector.    
     
     
         14 . The method for construction of a circuit module as recited in  claim 13 , wherein the ASIC is electrically coupled to the VCSEL transceiver modules through the VLSI package substrate and the at least one flexible connector.  
     
     
         15 . The method for construction of a circuit module as recited in  claim 13 , further comprising the step of: 
 f) attaching a heat spreader to the VLSI package substrate, wherein the heat spreader is thermally coupled to the ASIC.    
     
     
         16 . The method for construction of a circuit module as recited in  claim 13 , further comprising the steps of: 
 f) attaching a plurality of VCSEL array modules to at least one flexible connector; and    g) electrically coupling the ASIC to the VCSEL array modules through the at least one flexible connector.    
     
     
         17 . The method for construction of a circuit module as recited in  claim 16 , wherein the ASIC is electrically coupled to the VCSEL array modules through the VLSI package substrate and the at least one flexible connector.  
     
     
         18 . The method for construction of a circuit module as recited in  claim 13 , further comprising the steps of: 
 f) attaching a plurality of optical receiver modules to at least one flexible connector; and    g) electrically coupling the ASIC to the optical receiver modules through the at least one flexible connector.    
     
     
         19 . The method for construction of a circuit module as recited in  claim 18 , wherein the ASIC is electrically coupled to the optical receiver modules through the VLSI package substrate and the at least one flexible connector.