US2005206005A1PendingUtilityA1

Composition and a method for defect reduction

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Assignee: BUEHLER MARK FPriority: Dec 31, 1999Filed: May 19, 2005Published: Sep 22, 2005
Est. expiryDec 31, 2019(expired)· nominal 20-yr term from priority
Inventors:Mark Buehler
H10P 70/277H10P 70/56H10P 52/403B24B 37/042C23G 1/103
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Claims

Abstract

A metal layer cleaning composition including a first component that is an acid; and a different second component that is a chelating agent, wherein the composition is in a form suitable for use in effectively removing undesirable constituents from a wafer surface following a polishing operation.

Claims

exact text as granted — not AI-modified
1 . A metal layer cleaning composition comprising: 
 a first component that is an acid; and    a different second component that is a chelating agent,    wherein the composition is in a form suitable for use in effectively removing undesirable constituents from a wafer surface following a polishing operation.    
   
   
       2 . The composition of  claim 1 , wherein the acid is selected from the group consisting of acetic acid, citric acid, gluconic acid, glucuronic acid, oxalic acid, and tartaric acid.  
   
   
       3 . The composition of  claim 1 , wherein the chelating agent is selected from the group consisting of ethylenediaminetetraacitic acid, ethylenediamine, nitrilotriacetic acid, glycin, diethylene triamine, and triethanol amine.  
   
   
       4 . The composition of  claim 1 , wherein the pH of the composition is acidic.

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