Rinse nozzle and method

Abstract

A method and apparatus for rinsing and drying a substrate ( 100 ) of a semiconductor wafer ( 102 ), has a first nozzle ( 110 ) dispensing rinsing fluid against the substrate ( 100 ); and a second nozzle ( 114 ) dispensing dry gas under pressure against the substrate ( 100 ) during a drying cycle to dry the substrate ( 100 ) completely. The second nozzle ( 114 ) can point to the substrate ( 100 ) while the substrate ( 100 ) spins. The nozzles ( 110 ) and ( 114 ) can be positioned by a robot arm ( 112 ).

1 . A process for rinsing and drying a substrate on a semiconductor wafer, comprising the steps of: 
 dispensing rinsing fluid on the substrate during a rinsing cycle; and    spinning the wafer about an axis of rotation during a drying cycle to dry the wafer, while dispensing dry gas under pressure against the substrate to dry the wafer completely.    
     
     
         2 . The process of  claim 1 , further comprising the steps of: 
 dispensing the rinsing fluid on a surface of the substrate near the axis of rotation during the rinsing cycle; and    dispensing the gas on the surface of the substrate near the axis of rotation during the drying cycle.    
     
     
         3 . The process of  claim 1 , further comprising the steps of: 
 dispensing the rinsing fluid through a first nozzle mounted on a robot arm; and    dispensing the gas through a second nozzle mounted on the robot arm.    
     
     
         4 . The process of  claim 1 , further comprising the steps of: 
 pointing a first nozzle to the substrate near the axis of rotation while dispensing the rinsing fluid through the first nozzle; and    pointing a second nozzle to the substrate near the axis of rotation while dispensing the gas though the nozzle.    
     
     
         5 . The process of  claim 1 , further comprising the steps of: 
 moving a robot arm on which a first nozzle is mounted to point the first nozzle at the substrate while dispensing the rinsing fluid during the rinsing cycle; and    moving the robot arm on which a second nozzle is mounted to point the second nozzle at the substrate while dispensing the gas during the drying cycle.    
     
     
         6 . The process of  claim 1 , further comprising the steps of: 
 opening and closing a motor controlled first valve during the rinsing cycle to dispense the rinsing fluid; and    opening and closing a motor controlled second valve during the drying cycle to dispense the gas.    
     
     
         7 . The process of  claim 1 , further comprising the steps of: 
 moving a robot arm on which a first nozzle is mounted to point the first nozzle at the substrate while dispensing the rinsing fluid during the rinsing cycle;    opening and closing a motor controlled first valve during the rinsing cycle to dispense the rinsing fluid;    moving the robot arm on which a second nozzle is mounted to point the second nozzle at the substrate while dispensing the gas during the drying cycle; and    opening and closing a motor controlled second valve during the drying cycle to dispense the gas during the drying cycle.    
     
     
         8 . The process of  claim 1 , further comprising the steps of: 
 supplying the rinsing fluid through a motor controlled valve to a first nozzle;    dispensing the rinsing fluid through the first nozzle;    supplying the gas through a motor controlled valve to a second nozzle; and    dispensing the gas through the second nozzle.    
     
     
         9 . The process of  claim 1 , further comprising the step of: 
 dispensing the gas on the surface of the substrate near the axis of rotation during the drying cycle.    
     
     
         10 . The process of  claim 1 , further comprising the steps of: 
 dispensing the gas on the surface of the substrate near the axis of rotation during the drying cycle; and    dispensing the gas through a nozzle mounted on a robot arm.    
     
     
         11 . Apparatus for rinsing and drying a substrate of a semiconductor wafer, comprising: 
 a first nozzle dispensing rinsing fluid against the substrate during a rinsing cycle; and    a second nozzle dispensing dry gas under pressure against the substrate during a drying cycle to dry the substrate completely.    
     
     
         12 . The apparatus of  claim 11 , further comprising: 
 the first nozzle being mounted on a robot arm that positions the first nozzle during the rinsing cycle; and    the second nozzle being mounted on the robot arm that positions the second nozzle during a drying cycle to dry the substrate completely.    
     
     
         13 . The apparatus of  claim 12 , further comprising: 
 a microprocessor controlling the robot arm.    
     
     
         14 . The apparatus of  claim 11 , further comprising: 
 a motor controlled first valve supplying rinsing fluid to the first nozzle; and    a motor controlled second valve supplying rinsing fluid to the second nozzle.    
     
     
         15 . The apparatus of  claim 14 , further comprising: 
 a microprocessor controlling the first valve and the second valve.