Interwoven manifolds for pressure drop reduction in microchannel heat exchangers

Abstract

A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.

1 . A heat exchanger comprising: 
 a. an interface layer for cooling a heat source, wherein the interface layer is configured to pass fluid therethrough and the interface layer includes a thickness within a range of about 0.3 millimeters to about 1.0 millimeters; and    b. a manifold layer for circulating fluid to and from the interface layer, the manifold layer having a first set fingers and a second set of fingers, wherein the first set of fingers are disposed in parallel with the second set of fingers and arranged to reduce pressure drop within the heat exchanger.    
   
   
       2 . The heat exchanger according to  claim 1  wherein the fluid is in single phase flow condition.  
   
   
       3 . The heat exchanger according to  claim 1  wherein the fluid is in two phase flow fluid conditions.  
   
   
       4 . The heat exchanger according to  claim 1  wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the interface layer.  
   
   
       5 . The heat exchanger according to  claim 1  wherein a particular finger in the first set is spaced apart by an appropriate dimension from a particular finger in the second set to minimize the pressure drop in the heat exchanger.  
   
   
       6 . The heat exchanger according to  claim 1  wherein each of the fingers have the same length and width dimensions.  
   
   
       7 . The heat exchanger according to  claim 1  wherein at least one of the fingers has a different dimension than the remaining fingers.  
   
   
       8 . The heat exchanger according to  claim 1  wherein the fingers are arranged non-periodically in at least one dimension in the manifold layer.  
   
   
       9 . The heat exchanger according to  claim 1  wherein at least one of the fingers has at least one varying dimension along a length of the manifold layer.  
   
   
       10 . The heat exchanger according to  claim 1  wherein the manifold layer includes more than three and less than 10 parallel fingers.  
   
   
       11 . The heat exchanger according to  claim 1  wherein the fingers in the first set and second set are alternately disposed along a dimension of the manifold layer.  
   
   
       12 . The heat exchanger according to  claim 1  wherein the manifold layer is configured to cool at least one interface hot spot region.  
   
   
       13 . The heat exchanger according to  claim 1  further comprising at least one first port in communication with the first set of fingers, wherein fluid enters the heat exchanger through the at least one first port.  
   
   
       14 . The heat exchanger according to  claim 13  further comprising at least one second port in communication with the second set of fingers, wherein fluid exits the heat exchanger through the at least one second port.  
   
   
       15 . The heat exchanger according to  claim 1  wherein the manifold layer is positioned above the interface layer, wherein fluid flows downward through the first set of fingers and upward though the second set of fingers.  
   
   
       16 . The heat exchanger according to  claim 13  further comprising a first port passage in communication with the first port and the first set of fingers, the first port passage configured to channel fluid from the first port to the first set of fingers.  
   
   
       17 . The heat exchanger according to  claim 16  further comprising a second port passage in communication with the second port and the second set of fingers, the second port passage configured to channel fluid from the second set of fingers to the second port.  
   
   
       18 . The heat exchanger according to  claim 1  wherein the interface layer is integrally formed with the heat source.  
   
   
       19 . The heat exchanger according to  claim 1  wherein the interface layer is coupled to the heat source.  
   
   
       20 . The heat exchanger according to  claim 1  further comprising an intermediate layer for channeling fluid to and from one or more predetermined positions in the interface layer via at least one conduit, the intermediate layer positioned between the interface layer and the manifold layer.  
   
   
       21 . The heat exchanger according to  claim 20  wherein the intermediate layer is coupled to the interface layer and the manifold layer.  
   
   
       22 . The heat exchanger according to  claim 20  wherein the intermediate layer is integrally formed with the interface layer and the manifold layer.  
   
   
       23 . The heat exchanger according to  claim 20  wherein the at least one conduit has at least one varying dimension along the intermediate layer.  
   
   
       24 . The heat exchanger according to  claim 1  wherein the interface layer includes a coating thereupon, wherein the coating provides an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       25 . The heat exchanger according to  claim 1  wherein the interface layer has a thermal conductivity of at least 100 W/m-K.  
   
   
       26 . The heat exchanger according to  claim 1  further comprising a plurality of pillars configured in a predetermined pattern along the interface layer.  
   
   
       27 . The heat exchanger according to  claim 26  wherein at least one of the plurality of pillars has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       28 . The heat exchanger according to  claim 26  wherein at least one of the plurality of pillars has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       29 . The heat exchanger according to  claim 26  wherein at least two of the plurality of pillars are separate from each other by a spacing dimension within the range of and including 10 to 150 microns.  
   
   
       30 . The heat exchanger according to  claim 26  wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       31 . The heat exchanger according to  claim 1  wherein the interface layer has a roughened surface.  
   
   
       32 . The heat exchanger according to  claim 1  wherein the interface layer includes a micro-porous structure disposed thereon.  
   
   
       33 . The heat exchanger according to  claim 32  wherein the porous microstructure has a porosity within the range of and including 50 to 80 percent.  
   
   
       34 . The heat exchanger according to  claim 32  wherein the porous microstructure has an average pore size within the range of and including 10 to 200 microns.  
   
   
       35 . The heat exchanger according to  claim 32  wherein the porous microstructure has a height dimension within the range of and including 0.25 to 2.00 millimeters.  
   
   
       36 . The heat exchanger according to  claim 1  further comprises a plurality of microchannels configured in a predetermined pattern along the interface layer.  
   
   
       37 . The heat exchanger according to  claim 36  wherein at least one of the plurality of microchannels has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       38 . The heat exchanger according to  claim 36  wherein at least one of the plurality of microchannels has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       39 . The heat exchanger according to  claim 36  wherein at least two of the plurality of microchannels are separate from each other by a spacing dimension within the range of and including 10 to 150 microns.  
   
   
       40 . The heat exchanger according to  claim 36  wherein at least one of the plurality of microchannels has a width dimension within the range of and including 10 to 100 microns.  
   
   
       41 . The heat exchanger according to  claim 36  wherein the plurality of microchannels are coupled to the interface layer.  
   
   
       42 . The heat exchanger according to  claim 36  wherein the plurality of microchannels are integrally formed with the interface layer.  
   
   
       43 . The heat exchanger according to  claim 36  wherein the plurality of microchannels are divided into segmented arrays with at least one groove disposed therebetween, wherein the at least one groove is aligned with a corresponding finger.  
   
   
       44 . The heat exchanger according to  claim 36  wherein the plurality of microchannels include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       45 . The heat exchanger according to  claim 1  wherein an overhang dimension is within the range of and including 0 to 15 millimeters.  
   
   
       46 . A heat exchanger for cooling a heat source comprising: 
 a. a manifold layer including a first set of fingers in a first configuration, wherein each finger in the first set channels fluid at a first temperature, the manifold layer further including a second set of fingers in a second configuration, wherein each finger in the second set channels fluid at a second temperature, the first set and second set of fingers arranged parallel to each other; and    b. an interface layer including a thickness within a range of about 0.3 to 1.0 millimeters, and configured to receive fluid at the first temperature at a plurality of first locations, wherein each first location is associated with a corresponding finger in the first set, the interface layer passing fluid along a plurality of predetermined paths to a plurality of second locations, wherein each second location is associated with a corresponding finger in the second set.    
   
   
       47 . The heat exchanger according to  claim 46  wherein the fluid is in single phase flow conditions.  
   
   
       48 . The heat exchanger according to  claim 46  wherein the fluid is in two phase flow conditions.  
   
   
       49 . The heat exchanger according to  claim 46  wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the interface layer.  
   
   
       50 . The heat exchanger according to  claim 46  wherein a particular finger in the first set is spaced apart by an appropriate dimension from a particular finger in the second set, wherein the appropriate dimension reduces the pressure drop in the heat exchanger.  
   
   
       51 . The heat exchanger according to  claim 46  further comprising at least one first port in communication with the first set of fingers, wherein fluid enters the heat exchanger through the at least one first port.  
   
   
       52 . The heat exchanger according to  claim 51  further comprising at least one second port in communication with the second set of fingers, wherein fluid exits the heat exchanger through the at least one second port.  
   
   
       53 . The heat exchanger according to  claim 46  wherein the manifold layer is positioned above the interface layer, wherein fluid flows downward through the first set of fingers and upward through the second set of fingers.  
   
   
       54 . The heat exchanger according to  claim 46  wherein the interface layer is integrally formed with the heat source.  
   
   
       55 . The heat exchanger according to  claim 46  wherein the interface layer is coupled to the heat source.  
   
   
       56 . The heat exchanger according to  claim 46  wherein the fingers in the first set are positioned in an alternating configuration with the fingers in the second set.  
   
   
       57 . The heat exchanger according to  claim 46  wherein each of the fingers have the same length and width dimensions.  
   
   
       58 . The heat exchanger according to  claim 46  wherein at least one of the fingers has a different dimension than the remaining fingers.  
   
   
       59 . The heat exchanger according to  claim 46  wherein the fingers are arranged non-periodically in at least one dimension in the manifold layer.  
   
   
       60 . The heat exchanger according to  claim 46  wherein at least one of the fingers has at least one varying dimension along a length of the manifold layer.  
   
   
       61 . The heat exchanger according to  claim 46  wherein the manifold layer includes more than three and less than 10 parallel fingers.  
   
   
       62 . The heat exchanger according to  claim 52  further comprising a first port passage in communication with the first port and the first set of fingers, the first port passage configured to channel fluid from the first port to the first set of fingers.  
   
   
       63 . The heat exchanger according to  claim 62  further comprising a second port passage in communication with the second port and the second set of fingers, the second port passage configured to channel fluid from the second set of fingers to the second port.  
   
   
       64 . The heat exchanger according to  claim 46  further comprising an intermediate layer for channeling fluid to and from one or more predetermined positions in the interface layer via at least one conduit, the intermediate layer positioned between the interface layer and the manifold layer.  
   
   
       65 . The heat exchanger according to  claim 64  wherein the conduit is arranged in a predetermined configuration to channel fluid to one or more interface hot spot regions in the interface layer.  
   
   
       66 . The heat exchanger according to  claim 64  wherein the conduit is arranged in a predetermined configuration to channel fluid from one or more interface hot spot regions in the interface layer.  
   
   
       67 . The heat exchanger according to  claim 64  wherein the intermediate layer is coupled to the interface layer and the manifold layer.  
   
   
       68 . The heat exchanger according to  claim 64  wherein the intermediate layer is integrally formed with the interface layer and the manifold layer.  
   
   
       69 . The heat exchanger according to  claim 64  wherein the conduit has at least one varying dimension in the intermediate layer.  
   
   
       70 . The heat exchanger according to  claim 46  wherein the interface layer includes a coating thereupon, wherein the coating provides an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       71 . The heat exchanger according to  claim 46  wherein the interface layer has a thermal conductivity is at least 100 W/m-K.  
   
   
       72 . The heat exchanger according to  claim 46  further comprising a plurality of pillars configured in a predetermined pattern along the interface layer.  
   
   
       73 . The heat exchanger according to  claim 72  wherein at least one of the plurality of pillars has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       74 . The heat exchanger according to  claim 72  wherein at least one of the plurality of pillars has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       75 . The heat exchanger according to  claim 72  wherein at least two of the plurality of pillars are separate from each other by a spacing dimension within the range of and including 10 to 150 microns.  
   
   
       76 . The heat exchanger according to  claim 72  wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       77 . The heat exchanger according to  claim 46  wherein the interface layer has a roughened surface.  
   
   
       78 . The heat exchanger according to  claim 46  wherein the interface layer includes a microporous structure disposed thereon.  
   
   
       79 . The heat exchanger according to  claim 78  wherein the porous microstructure has a porosity within the range of and including 50 to 80 percent.  
   
   
       80 . The heat exchanger according to  claim 78  wherein the porous microstructure has an average pore size within the range of and including 10 to 200 microns.  
   
   
       81 . The heat exchanger according to  claim 78  wherein the porous microstructure has a height dimension within the range of and including 0.25 to 2.00 millimeters.  
   
   
       82 . The heat exchanger according to  claim 46  further comprises a plurality of microchannels configured in a predetermined pattern along the interface layer.  
   
   
       83 . The heat exchanger according to  claim 82  wherein at least one of the plurality of microchannels has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       84 . The heat exchanger according to  claim 82  wherein at least one of the plurality of microchannels has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       85 . The heat exchanger according to  claim 82  wherein at least two of the plurality of microchannels are separate from each other by a spacing dimension within the range of and including 10 to 150 microns.  
   
   
       86 . The heat exchanger according to  claim 82  wherein at least one of the plurality of microchannels has a width dimension within the range of and including 10 to 100 microns.  
   
   
       87 . The heat exchanger according to  claim 82  wherein the microchannels are coupled to the interface layer.  
   
   
       88 . The heat exchanger according to  claim 82  wherein the microchannels are integrally formed with the interface layer.  
   
   
       89 . The heat exchanger according to  claim 82  wherein the microchannels are divided into segments along a dimension of the interface layer, at least one groove disposed in between the divided microchannel segments.  
   
   
       90 . The heat exchanger according to  claim 82  wherein the microchannels are continuous along a dimension of the interface layer.  
   
   
       91 . The heat exchanger according to  claim 89  wherein the at least one groove is aligned with a corresponding finger.  
   
   
       92 . The heat exchanger according to  claim 82  wherein the plurality of microchannels include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       93 . The heat exchanger according to  claim 46  wherein an overhang dimension is within the range of and including 0 to 15 millimeters.