Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device

Abstract

A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.

1 . A heat exchanger comprising: 
 a. an interface layer in contact with the heat source and configured to pass fluid therethrough to cool the heat source, the interface layer includes a thickness within a range of about 0.3 to about 1.0 millimeters; and    b. a manifold layer coupled to the interface layer, the manifold layer further comprising a first set of individualized fluid paths for channeling fluid to the interface layer, the individual fluid paths in the first set positioned to minimize pressure drop within the heat exchanger.    
   
   
       2 . The heat exchanger according to  claim 1  wherein the manifold layer further comprises a second set of individualized fluid paths for channeling fluid from the interface layer.  
   
   
       3 . The heat exchanger according to  claim 2  wherein the manifold layer further comprises a first port for providing fluid to the first set of individualized fluid paths and a second port for removing fluid channeled from the second set of individualized fluid paths.  
   
   
       4 . The heat exchanger according to  claim 1  wherein the first set of fluid paths are arranged to provide a minimized fluid path distance along the interface layer to cool a predetermined region of the heat source to a desired temperature.  
   
   
       5 . The heat exchanger according to  claim 3  wherein the first set and second set of fluid paths are arranged to provide a minimized fluid path distance between the first and second ports to cool a predetermined region of the heat source to a desired temperature.  
   
   
       6 . The heat exchanger according to  claim 1  wherein the fluid is in single phase flow conditions.  
   
   
       7 . The heat exchanger according to  claim 1  wherein at least a portion of the fluid is in two phase flow conditions.  
   
   
       8 . The heat exchanger according to  claim 1  wherein at least a portion of the fluid undergoes a transition between single and two phase flow conditions in the heat exchanger.  
   
   
       9 . The heat exchanger according to  claim 2  wherein the manifold layer further comprises a circulation level having the first and second fluid paths extending therethrough, the circulation level coupled to the interface layer and configured to separably channel fluid to and from the interface layer via the first and second set of fluid paths.  
   
   
       10 . The heat exchanger according to  claim 9  wherein each of the fluid paths in the first set include a cylindrical protrusion in communication therewith, each cylindrical protrusion extending from the circulation level at a predetermined height.  
   
   
       11 . The heat exchanger according to  claim 3  wherein the manifold layer further comprises 
 a. a first level configured to channel fluid between the first port and the first set of fluid paths; and    b. a second level coupled to the first level and configured to channel fluid between the second port and the second set of fluid paths wherein fluid channeled via the first level is kept separate from the fluid channeled via the second level in the manifold layer.    
   
   
       12 . The heat exchanger according to  claim 11  wherein the first level further comprises a first corridor in communication with the first port and the first set of fluid paths, wherein fluid in the first corridor flows directly to the first set of fluid paths.  
   
   
       13 . The heat exchanger according to  claim 11  wherein the second level further comprises a second corridor in communication with the second port and the second set of fluid paths wherein fluid in the second set flows directly to the second corridor.  
   
   
       14 . The heat exchanger according to  claim 2  wherein the first set of fluid paths are thermally insulated from the second set of fluid paths to prevent heat transfer therebetween.  
   
   
       15 . The heat exchanger according to  claim 2  wherein the first set and the second set of fluid paths are arranged in a uniform manner along at least one dimension.  
   
   
       16 . The heat exchanger according to  claim 2  wherein the first set and second set of fluid paths are arranged in a non-uniform manner along at least one dimension.  
   
   
       17 . The heat exchanger according to  claim 1  wherein each fluid paths in the first set is positioned a closest optimal distance to one another.  
   
   
       18 . The heat exchanger according to  claim 2  wherein the first set and second set of fluid paths are positioned to cool at least one interface hot spot region in the heat source.  
   
   
       19 . The heat exchanger according to  claim 2  wherein at least one of the first fluid paths flows via a plurality of first holes, wherein at least one first hole in the plurality has a first dimension substantially equivalent to a second dimension of at least one hole in the second set of fluid paths.  
   
   
       20 . The heat exchanger according to  claim 2  wherein at least one of the first fluid paths flows via a plurality of first holes, wherein at least one first hole in the plurality has a first dimension different than a second dimension of at least one second hole in the second set of fluid paths.  
   
   
       21 . The heat exchanger according to  claim 1  wherein the interface layer is made of a material having a thermal conductivity of at least 100 W/mk.  
   
   
       22 . The heat exchanger according to  claim 1  wherein the interface layer includes a coating thereupon, wherein the coating provides an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       23 . The heat exchanger according to  claim 1  wherein the interface layer further comprises a plurality of pillars configured in a predetermined pattern along the interface layer.  
   
   
       24 . The heat exchanger according to  claim 23  wherein at least one of the plurality of pillars has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       25 . The heat exchanger according to  claim 23  wherein at least one of the plurality of pillars has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       26 . The heat exchanger according to  claim 23  wherein at least two of the plurality of pillars are separate from each other by a spacing dimension within the range of and including  10  to 150 microns.  
   
   
       27 . The heat exchanger according to  claim 23  wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       28 . The heat exchanger according to  claim 23  wherein at least one of the plurality of pillars includes at least varying dimension along a predetermined direction.  
   
   
       29 . The heat exchanger according to  claim 23  wherein an appropriate number of pillars are disposed in a predetermined area along the interface layer.  
   
   
       30 . The heat exchanger according to  claim 1  wherein at least a portion of the interface layer has a roughened surface.  
   
   
       31 . The heat exchanger according to  claim 23  wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       32 . The heat exchanger according to  claim 1  further comprising a porous microstructure disposed along the interface layer.  
   
   
       33 . The heat exchanger according to  claim 32  wherein the porous microstructure has a porosity within the range of and including 50 to 80 percent.  
   
   
       34 . The heat exchanger according to  claim 32  wherein the porous microstructure has an average pore size within the range of and including 10 to 200 microns.  
   
   
       35 . The heat exchanger according to  claim 32  wherein the porous microstructure has a height dimension within the range of and including 0.25 to 2.00 millimeters.  
   
   
       36 . The heat exchanger according to  claim 32  wherein the porous microstructure includes at least one pore having a varying dimension along a predetermined direction.  
   
   
       37 . The heat exchanger according to  claim 1  further comprising a plurality of microchannels disposed in a predetermined configuration along the interface layer.  
   
   
       38 . The heat exchanger according to  claim 37  wherein at least one of the plurality of microchannels has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       39 . The heat exchanger according to  claim 37  wherein at least one of the plurality of microchannels has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       40 . The heat exchanger according to  claim 37  wherein at least two of the plurality of microchannels are separate from each other by a spacing dimension within the range of and including 10 to 150 microns.  
   
   
       41 . The heat exchanger according to  claim 37  wherein at least one of the plurality of microchannels has a width dimension within the range of and including 10 to 100 microns.  
   
   
       42 . The heat exchanger according to  claim 37  wherein the plurality of microchannels include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       43 . The heat exchanger according to  claim 1  wherein the interface layer is coupled to the heat source.  
   
   
       44 . The heat exchanger according to  claim 1  wherein the interface layer is integrally formed to the heat source.  
   
   
       45 . The heat exchanger according to  claim 1  wherein the heat source is an integrated circuit.  
   
   
       46 . The heat exchanger according to  claim 1  wherein an overhang dimension is within the range of and including 0 to 15 millimeters.  
   
   
       47 . A heat exchanger configured to cool a heat source comprising: 
 a. an interface layer in contact with the heat source and configured to pass fluid therethrough, the interface layer includes a thickness within a range of about 0.3 to about 1.0 millimeters; and    b. a manifold layer coupled to the interface layer, the manifold layer further comprising: 
 i. a first level having a plurality of substantially vertical inlet paths for delivering fluid to the interface layer, wherein the inlet paths are arranged an optimal fluid travel distance from one another other; and  
 ii. a second level having at least one outlet path for removing fluid from the interface layer.  
   
   
   
       48 . The heat exchanger according to  claim 47  wherein the first level further comprises at least one first port configured to channel fluid to the inlet paths.  
   
   
       49 . The heat exchanger according to  claim 48  wherein the second level further comprises at least one second port configured to channel fluid from the at least one outlet path, wherein fluid in the second level flows separately from the fluid in the first level.  
   
   
       50 . The heat exchanger according to  claim 49  wherein the second level further comprises a plurality of substantially vertical outlet paths for removing fluid from the interface layer, the plurality of inlet and outlet paths arranged an optimal fluid travel distance apart from each other.  
   
   
       51 . The heat exchanger according to  claim 50  wherein the manifold layer further comprises a circulation level coupled to the interface layer and having a plurality of first apertures extending vertically therethrough for channeling fluid along the inlet paths to the interface layer and a plurality of second apertures extending vertically therethrough for channeling fluid along the at least outlet path from the interface layer.  
   
   
       52 . The heat exchanger according to  claim 51  wherein the first level further comprises an inlet fluid corridor within for horizontally channeling fluid from the first port to the first apertures.  
   
   
       53 . The heat exchanger according to  claim 52  wherein the second level further comprises an outlet fluid corridor for horizontally channeling fluid from the second apertures to the second port.  
   
   
       54 . The heat exchanger according to  claim 51  wherein the first and second apertures are individually arranged in a uniform manner along at least one dimension.  
   
   
       55 . The heat exchanger according to  claim 51  wherein the first and second fluid apertures are individually arranged in a non-uniform manner along at least one dimension.  
   
   
       56 . The heat exchanger according to  claim 47  wherein the inlet paths and the at least one outlet paths are separately sealed from one another in the manifold layer.  
   
   
       57 . The heat exchanger according to  claim 47  wherein the interface layer is coupled to the heat source.  
   
   
       58 . The heat exchanger according to  claim 47  wherein the interface layer is integrally formed to the heat source.  
   
   
       59 . The heat exchanger according to  claim 47  wherein the heat source is an integrated circuit.  
   
   
       60 . The heat exchanger according to  claim 51  wherein the first and second apertures are arranged to cool at least one interface hot spot cooling region in the heat source.  
   
   
       61 . The heat exchanger according to  claim 51  wherein at least one of the first apertures has an inlet dimension substantially equivalent to an outlet dimension of at least one second apertures in the plurality.  
   
   
       62 . The heat exchanger according to  claim 51  wherein at least one of the first apertures has an inlet dimension different than an outlet dimension of at least one of the second apertures in the plurality.  
   
   
       63 . The heat exchanger according to  claim 47  wherein the interface layer is made of a material having a thermal conductivity of at least 100 W/mk.  
   
   
       64 . The heat exchanger according to  claim 47  wherein the interface layer includes a coating thereupon, wherein the coating provides an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       65 . The heat exchanger according to  claim 47  wherein the interface layer further comprises a plurality of pillars disposed thereon in an appropriate pattern.  
   
   
       66 . The heat exchanger according to  claim 65  wherein at least one of the plurality of pillars has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       67 . The heat exchanger according to  claim 65  wherein at least one of the plurality of pillars has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       68 . The heat exchanger according to  claim 65  wherein at least two of the plurality of pillars are separate from each other by a spacing dimension within the range of and including 10 to 150 microns.  
   
   
       69 . The heat exchanger according to  claim 65  wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       70 . The heat exchanger according to  claim 65  wherein at least one of the plurality of pillars includes at least varying dimension along a predetermined direction.  
   
   
       71 . The heat exchanger according to  claim 65  wherein an appropriate number of pillars are disposed in a predetermined area along the interface layer.  
   
   
       72 . The heat exchanger according to  claim 47  wherein at least a portion of the interface layer has a roughened surface.  
   
   
       73 . The heat exchanger according to  claim 65  wherein the plurality of pillars include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       74 . The heat exchanger according to  claim 47  further comprising a porous microstructure disposed along the interface layer.  
   
   
       75 . The heat exchanger according to  claim 74  wherein the porous microstructure has a height dimension within the range of and including 0.25 to 2.00 millimeters.  
   
   
       76 . The heat exchanger according to  claim 74  wherein the porous microstructure includes at least one pore having a varying dimension along a predetermined direction.  
   
   
       77 . The heat exchanger according to  claim 74  wherein an average pore size in the porous microstructure is within the range and including 10 microns and 200 microns.  
   
   
       78 . The heat exchanger according to  claim 74  wherein the porous microstructure has a porosity in the range and including 50 to 80 percent.  
   
   
       79 . The heat exchanger according to  claim 47  wherein the interface layer further comprises a plurality of microchannels disposed thereon in an appropriate pattern.  
   
   
       80 . The heat exchanger according to  claim 79  wherein at least one of the plurality of microchannels has an area dimension within the range of and including (10 micron) 2  and (100 micron) 2 .  
   
   
       81 . The heat exchanger according to  claim 79  wherein at least one of the plurality of microchannels has a height dimension within the range of and including 50 microns and 2 millimeters.  
   
   
       82 . The heat exchanger according to  claim 79  wherein at least two of the plurality of microchannels are separate from each other by a spacing dimension within the range of and including 10 to 150 microns.  
   
   
       83 . The heat exchanger according to  claim 79  wherein at least one of the plurality of microchannels has a width dimension within the range of and including 10 to 100 microns.  
   
   
       84 . The heat exchanger according to  claim 79  wherein the plurality of microchannels include a coating thereupon, wherein the coating has an appropriate thermal conductivity of at least 10 W/m-K.  
   
   
       85 . The heat exchanger according to  claim 47  wherein an overhang dimension is within the range of and including 0 to 15 millimeters.  
   
   
       86 . The heat exchanger according to  claim 51  further comprising a plurality of cylindrical protrusions extending an appropriate height from the circulation level, each protrusion in communication with the first apertures.  
   
   
       87 . An electronic device which produces heat comprising: 
 a. an integrated circuit;    b. an interface layer for cooling heat produced by the electronic device, wherein the interface layer includes a thickness within a range of about 0.3 to about 1.0 millimeters, the interface layer integrally formed with the integrated circuit and configured to pass fluid therethrough; and    c. a manifold layer for circulating fluid with the interface layer, the manifold layer having at least one inlet fluid path for delivering fluid to the interface layer and at least one outlet fluid path for removing fluid from the interface layer, the at least one inlet fluid path and the at least one outlet fluid path arranged to provide an optimal minimum fluid travel distance apart from each other.    
   
   
       88 . A closed loop system for cooling at least one integrated circuit comprising: 
 a. at least one heat exchanger for absorbing heat generated by the integrated circuit, the heat exchanger further comprising: 
 i. an interface layer in contact with the integrated circuit and configured to pass fluid therethrough, the interface layer includes a thickness within a range of about 0.3 to about 1.0 millimeters; and  
 ii. a manifold layer coupled to the interface layer, the manifold layer having at least one inlet fluid path for delivering fluid to the interface layer and at least one outlet fluid path for removing fluid from the interface layer, the at least inlet fluid path and the at least one outlet fluid path arranged to provide an optimal minimum fluid travel distance apart from each other;  
   b. at least one pump for circulating fluid throughout the loop, the pump coupled to the at least one heat exchanger; and    c. at least one heat rejector coupled to the pump and the heat exchanger, the heat rejector for cooling heated liquid output from the heat exchanger.