US2005215035A1PendingUtilityA1

Field effect transistor with metal oxide gate insulator and sidewall insulating film

Assignee: YAMAGUCHI TAKESHIPriority: Mar 27, 2002Filed: May 25, 2005Published: Sep 29, 2005
Est. expiryMar 27, 2022(expired)· nominal 20-yr term from priority
H10P 14/69215H10P 14/6328H10P 14/662H10P 34/42H10D 64/01344H10D 64/01342H10D 64/667H10D 64/665H10D 64/68H10D 64/021H10D 30/021H10D 64/691
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Claims

Abstract

Provided is a semiconductor device including a silicon substrate, a gate insulator disposed on the silicon substrate and containing a metal oxide, a gate electrode disposed on the gate insulator, and a sidewall insulating film disposed on a side of the gate insulator and the gate electrode and containing aluminum, silicon, oxygen and nitrogen.

Claims

exact text as granted — not AI-modified
1 - 14 . (canceled)  
   
   
       15 . A method of manufacturing a semiconductor device, comprising: 
 forming a gate insulator containing a metal oxide on a silicon substrate;    forming a gate electrode on the gate insulator;    forming a sidewall insulating film containing aluminum, silicon, oxygen and nitrogen on a side of the gate insulator and gate electrode; and    after forming the sidewall insulating film, introducing an impurity into a surface region of the silicon substrate by ion implantation.    
   
   
       16 . The method according to  claim 15 , wherein the sidewall insulating film has a network structure constructed by aluminum, silicon, nitrogen and oxygen.  
   
   
       17 . The method according to  claim 15 , wherein at least a part of the sidewall insulating film has a composition represented by a general formula:  
       Si 6-z Al z O z N 8-z    where z is a value larger than 0 and smaller than 6.    
   
   
       18 . The method according to  claim 15 , wherein a sum of concentrations of aluminum, silicon, oxygen and nitrogen in the sidewall insulating film is equal to or larger than 97 atomic %.  
   
   
       19 . The method according to  claim 15 , wherein a material of the gate insulator is silicate of the metal oxide and silicon dioxide, and the metal oxide contains as a constituent metal element thereof at least one metal element selected from the group consisting of zirconium, hafnium, lanthanum, cerium, titanium, yttrium, tantalum, bismuth and praseodymium.  
   
   
       20 . The method according to  claim 15 , wherein the gate insulator consists essentially of the metal oxide, and the metal oxide contains as a constituent metal element thereof at least one metal element selected from the group consisting of zirconium, hafnium, lanthanum, cerium, titanium, yttrium, tantalum, bismuth and praseodymium.

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