US2005218411A1PendingUtilityA1
Hafnium nitride buffer layers for growth of GaN on silicon
Individually held — no corporate assignee on recordPriority: May 17, 2002Filed: May 20, 2005Published: Oct 6, 2005
Est. expiryMay 17, 2022(expired)· nominal 20-yr term from priority
H10P 14/3416H10P 14/3258H10P 14/3202H10P 14/2905Y10T428/12576Y10T428/12542C30B 29/38C30B 23/02
47
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Claims
Abstract
Gallium nitride is grown by plasma-assisted molecular-beam epitaxy on (111) and (001) silicon substrates using hafnium nitride buffer layers. Wurtzite GaN epitaxial layers are obtained on both the (111) and (001) HfN/Si surfaces, with crack-free thickness up to 1.2 Om. However, growth on the (001) surface results in nearly stress-free films, suggesting that much thicker crack-free layers could be obtained.
Claims
exact text as granted — not AI-modified1 - 9 . (canceled)
10 . A composite wafer, comprising:
a substrate comprising Si, a buffer layer comprising HfN (001) overlying said Si substrate, and a GaN layer on said buffer layer.
11 . The composite wafer as claimed in claim 10 , wherein:
there is more than one buffer layer comprising HfN.
12 . The composite wafer as claimed in claim 11 , wherein:
there are two buffer layers comprising HfN overlying said Si substrate.
13 . The composite wafer as claimed in claim 10 , wherein:
the buffer layer overlies directly on the Si substrate.
14 . The composite wafer as claimed in claim 10 , wherein:
the substrate comprises Si (001).
15 . The composite wafer as claimed in claim 14 , wherein:
the GaN layer comprises wurtzite GaN.
16 . The composite wafer as claimed in claim 14 , wherein:
the HfN(001) layer lies directly on the Si(001) layer.Join the waitlist — get patent alerts
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