US2005219327A1PendingUtilityA1
Features in substrates and methods of forming
Est. expiryMar 31, 2024(expired)· nominal 20-yr term from priority
B41J 2/14016B41J 2/1603B41J 2/1625B41J 2/14145B41J 2/1639B41J 2/1623B41J 2/1645B41J 2/1631B41J 2/1634Y10T29/49401Y10T156/10
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Claims
Abstract
The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.
Claims
exact text as granted — not AI-modified1 . A microdevice comprising:
a substrate having a first substrate surface and a generally opposing second substrate surface; and, multiple features formed through the substrate between the first surface and the second surface, wherein at least one feature extends into and out of the substrate along a bore axis, and wherein the bore axis is not transverse to the first surface.
2 . The microdevice of claim 1 , wherein at least some of the multiple features comprise electrical interconnects.
3 . The microdevice of claim 1 , wherein at least some of the multiple features comprise fluid-handling slots.
4 . The microdevice of claim 1 , wherein at least some features extend within the substrate along a long axis and have a generally uniform width between the first surface and the second surface as measured transverse to the long axis.
5 . The microdevice of claim 1 , wherein the at least one feature extends along a long axis that defines an angle of less than 90 degrees relative to a plane of the first surface.
6 . The microdevice of claim 1 , wherein the at least one features extends along a long axis that defines an angle in a range of 10 degrees to 80 degrees relative to a plane the first surface.
7 . The microdevice of claim 1 , wherein the at least one feature extends along a long axis that defines an angle of less than 90 degrees relative to a plane of the first surface.
8 . The microdevice of claim 1 , wherein the at least one feature extends along a long axis that defines an angle in a range of 10 degrees to 80 degrees relative to a plane of the first surface.
9 . The microdevice of claim 1 , wherein a first feature of the multiple features has a bore axis that is transverse to the first surface and a second feature of the multiple features has a bore axis that is not transverse to the first surface.
10 . The microdevice of claim 1 , wherein an individual feature of the multiple features extends between the first surface and the second surface along a long axis that is generally parallel to the first surface, wherein a cross-sectional area of the individual feature is substantially a parallelogram.
11 . The microdevice of claim 1 embodied as a print head.
12 . A microdevice comprising:
a substrate extending between a first substrate surface and a generally opposing second substrate surface; and, at least one feature formed into the substrate along a bore axis that is not transverse to the first surface and is not parallel to the first surface.
13 . The microdevice of claim 12 , wherein the feature is formed in a substrate sidewall surface.
14 . The microdevice of claim 13 , wherein the feature extends between the substrate sidewall surface and the first surface.
15 . The microdevice of claim 13 , wherein the substrate sidewall surface is oriented obliquely to the first substrate surface.
16 . The microdevice of claim 13 , wherein the substrate sidewall surface extends between the first substrate surface and the second substrate surface.
17 . The microdevice of claim 12 , wherein the feature is defined by at least one sidewall and wherein a first portion of the sidewall is generally transverse the first surface and a second different portion of the sidewall is not transverse the first surface.
18 . The microdevice of claim 12 , wherein the feature is defined by at least one sidewall and wherein a first portion of the sidewall and a second portion of the sidewall are not transverse the first surface, and the first portion lies at a first angle relative the first surface and the second portion lies at a second different angle.
19 . The microdevice of claim 12 , wherein a cross-sectional area of the feature approximates an ellipsoid at the first surface.
20 . The microdevice of claim 12 , wherein a cross-sectional area of the feature approximates a rectangle at the first surface.
21 . The microdevice of claim 12 , wherein a cross-sectional area of the feature approximates a regular geometric shape at the first surface.
22 . The microdevice of claim 12 , wherein the feature extends between the first surface and the second surface.
23 . The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 10 degrees to about 80 degrees relative to the first surface.
24 . The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 60 degrees to about 80 degrees relative to the first surface.
25 . The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 40 degrees to about 59 degrees relative to the first surface.
26 . The microdevice of claim 12 , wherein the bore axis lies at an angle in a range of about 20 degrees to about 39 degrees relative to the first surface.
27 . The microdevice of claim 12 embodied as a display device.
28 . The microdevice of claim 12 embodied as an integrated circuit.
29 . A microdevice comprising:
a substrate defined at least in part by a first substrate surface; and, at least one feature formed into the substrate along a bore axis that is not transverse to the first surface and is not parallel to the first surface.
30 . The microdevice of claim 29 , wherein the feature is formed in the first surface.
31 . The microdevice of claim 29 , wherein the feature extends between the first surface and a second surface.
32 . The microdevice of claim 31 , wherein the second surface is oriented obliquely to the first surface.
33 . The microdevice of claim 31 , wherein the second surface is oriented orthogonally to the first surface.
34 . A print head comprising:
a substrate extending between a first substrate surface and a generally opposing second substrate surface; and, multiple fluid-handling slots formed through the substrate between the first surface and the second surface, wherein at the first surface the multiple slots define a first footprint having a first area and wherein at the second surface the multiple slots define a second footprint having a second area, and wherein the first area is at least about 10 percent greater than the second area.
35 . The print head of claim 34 , wherein the first footprint has a first width taken orthogonally to a long axis of the slots and the second footprint has a second width taken orthogonally to the long axis of the slots, and wherein the first width is at least about 10 percent greater than the second width.
36 . The print head of claim 35 , wherein the first width is at least about 20 percent greater than the second width.
37 . A fluid-ejecting device comprising:
a substrate extending between a first substrate surface and a generally opposing second substrate surface; and, at least one fluid-handling slot extending between the first surface and the second surface along a long axis that is generally parallel to the first surface, wherein when viewed transverse the long axis the slot has a first width at the first surface defining a first midpoint and a second width at the second surface defining a second midpoint and wherein a line intersecting the first midpoint and the second midpoint is not orthogonal to the first surface.
38 . The fluid-ejecting device of claim 37 , wherein the first width is greater than the second width.
39 . The fluid-ejecting device of claim 38 , wherein the at least one slot has a slot profile when viewed transverse the long axis that generally tapers from the second surface to the first surface.
40 . A microdevice forming method comprising:
removing substrate material from a first surface of a substrate to form a feature therein, and, wherein the feature extends along a bore axis that is not transverse the first surface.
41 . The method of claim 40 , further comprising removing substrate material from a second substrate surface which in combination with said removing substrate material from a first surface forms the feature.
42 . The method of claim 41 , wherein said removing substrate material from a second substrate surface occurs prior to said removing substrate material from a first surface.
43 . The method of claim 41 , wherein said removing substrate material from a second substrate surface comprises one or more of etching, sawing and laser machining and said removing substrate material from a first surface comprises one or more of etching, sawing and laser machining.
44 . The method of claim 40 , wherein the removing comprises laser machining the substrate at least in part by directing a laser beam at the substrate at a first angle relative to the first surface and then directing the laser beam at a second different angle relative to the first surface.
45 . The method of claim 40 , wherein the removing comprises laser machining the substrate at least in part by directing a laser beam at the substrate at a first angle relative to the first surface and from a direction sufficient to contact the first surface before contacting a second surface and then directing the laser beam at a second different angle relative to the first surface and from a direction sufficient to contact the second surface before contacting the first surface.
46 . The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 10 degrees to about 80 degrees relative to the first surface.
47 . The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 60 degrees to about 80 degrees relative to the first surface.
48 . The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 40 degrees to about 59 degrees relative to the first surface.
49 . The method of claim 40 , wherein the removing comprises directing a laser beam at the first surface so that the laser beam is oriented at an angle in a range of about 20 degrees to about 39 degrees relative to the first surface.
50 . The method of claim 40 , wherein the removing forms the feature extending between the first surface and a generally opposing second surface.Join the waitlist — get patent alerts
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