Material separation to form segmented product

Abstract

A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.

1 - 20 . (canceled)  
   
   
       21 . A method of bonding an electronic component to a heat sink, said method comprising: 
 providing a layer of base material;    positioning a layer of first material and a layer of release material on said layer of base material such that said layer of release material is located substantially between said layer of base material and said layer of first material,    providing a plurality of first cuts through said layer of first material;    providing a plurality of deeper, second cuts through said layer of release material and said layer of first material to substantially fuse said layer of release material to said layer of base material;    separating said layer of said first material from said layer of base material so as to remove only selected portions of said first material and leave other portions of said first material on said layer of base material;    providing an electronic component and a heat sink; and    using said removed selected portions of said first material as a bonding material between said electronic component and said heat sink to bond said electronic component to said heat sink.    
   
   
       22 . The method of  claim 21  wherein said plurality of first cuts are provided using a laser.  
   
   
       23 . The method of  claim 21  wherein said plurality of second cuts are provided using a laser.  
   
   
       24 . The method of  claim 21  wherein said plurality of first cuts are provided using a laser pulse energy of from about 0.05 milli-joules to about 0.15 milli-joules and a pulse spacing within the range of from about five micrometers to about fifteen micrometers.  
   
   
       25 . The method of  claim 21  wherein said plurality of second cuts are provided using a laser pulse energy of from about 0.07 milli-joules to about 0.20 milli-joules and a pulse spacing within the range of from about two micrometers to about ten micrometers.  
   
   
       26 . The method of  claim 21  wherein said electronic component is a semiconductor chip.  
   
   
       27 . The method of  claim 21  wherein said layer of said first material is provided in the form of a first sub-layer of polymer material and second and third sub-layers of adhesive located on opposite sides of said first sub-layer.  
   
   
       28 . The method of  claim 21  wherein said layer of release material is bonded to said layer of base material during said providing of said first and second cuts.  
   
   
       29 . The method of  claim 28  wherein said layer of release material is bonded to said layer of base material using a vacuum.