US2005228633A1PendingUtilityA1
Method and systems for electronic assembly system pricing and customer benefit sharing
Assignee: SIEMENS DEMATIC ELECTRONICS ASPriority: Jun 1, 2000Filed: Apr 29, 2005Published: Oct 13, 2005
Est. expiryJun 1, 2020(expired)· nominal 20-yr term from priority
G06Q 10/06Y02P90/02G06Q 30/0283G05B 2219/34038G05B 2219/32343G06Q 10/04G05B 2219/32359G05B 19/41885G05B 2219/32338G05B 2219/32352G06Q 30/02G06Q 10/063
52
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A method is provided for pricing an electronics assembly system solution for a customer. First, with the aid of a computer model, a customer benefit to be realized through the use of the electronics assembly system solution is predicted. A customer benefit guarantee is then generated, based on the predicted customer benefit, and a message relating to the customer benefit guarantee associated with the predicted customer benefit is transmitted to the customer.
Claims
exact text as granted — not AI-modified1 . A method for pricing a customer's electronics assembly system, comprising the steps of:
a. modeling, with a computer, the customer's electronics assembly system in real time with the customer present to predict a customer benefit to be realized through the use of the electronics assembly system; b. generating a customer benefit guarantee based on the predicted customer benefit, the customer benefit guarantee comprising a particular cost of ownership of the electronics assembly system; and c. communicating a message relating to the customer benefit guarantee associated with the predicted customer benefit.
2 - 25 . (canceled)
26 . A method for pricing an electronics assembly system solution for a customer comprising the steps of:
a. predicting, with a computer model executed by a computer, a customer benefit to be realized through the use of the electronics assembly system solution; b. generating a customer benefit guarantee based on the predicted customer benefit, the customer benefit guarantee comprising a particular cost of ownership of the electronics assembly system; and c. communicating a message relating to the customer benefit guarantee associated with the predicted customer benefit.
27 . The method according to claim 26 , wherein the prediction is performed using a computer model that represents the electronics assembly system at a material flow level.
28 . The method-according to claim 26 , wherein the step of predicting a customer benefit with the computer model comprises the steps of:
entering data into an input interface; transferring data from the input interface to a modeling tool; and building a simulation with the modeling tool utilizing the transferred data.
29 . The method according to claim 28 , wherein the simulation comprises a discrete event simulation.
30 . The method according to claim 28 , wherein the step of entering data is performed on a client device and the step of building the simulation is performed on a server device.
31 . The method according to claim 28 , wherein the input interface comprises a spread sheet.
32 . The method according to claim 28 , wherein the input interface comprises a web form.
33 . The method according to claim 26 , wherein the computer model comprises a customized user interface.
34 . The method according to claim 26 , wherein the prediction is performed using a computer model that represents the electronics assembly system and simulates an aspect of the behavior of the system.
35 . The method according to claim 26 , wherein the prediction is performed during a particular customer session.
36 . The method according to claim 26 , comprising the further step of offering the electronics assembly solution at a price that is a function of the guaranteed customer benefit.
37 . The method according to claim 26 , comprising the further step of offering the electronics assembly solution at a price that is a preselected fraction of the guaranteed customer benefit.
38 . The method according to claim 36 , wherein value corresponding to the price for the electronics assembly solution is collected after the customer benefit is realized.
39 . A method for financing the price of a customer's purchase of an electronics assembly system solution, the method comprising the steps of:
a. providing an electronics assembly system solution; b. computing a customer benefit associated with the solution; c. computing a monetary value based on the customer benefit; and d. collecting from the customer an amount based on the computed monetary value, wherein the step of computing a customer benefit is performed using a computer model that represents the electronics assembly system and simulates an aspect of the behavior of the system, the computer model being executed by a computer.
40 . The method according to claim 39 , wherein the step of computing a customer benefit comprises modeling the electronics assembly system solution at a material flow level.
41 . The method according to claim 40 , wherein the step of computing a customer benefit comprises the steps of:
entering data into an input interface; transferring data from the input interface to a modeling tool; and building a simulation with the modeling tool utilizing the transferred data.
42 . The method according to claim 41 , wherein the simulation comprises a discrete event simulation.
43 . The method according to claim 41 , wherein the step of entering data is performed on a client device and the step of building the simulation is performed on a server device.
44 . The method according to claim 41 , wherein the input interface comprises a spread sheet.
45 . The method according to claim 41 , wherein the input interface comprises a web form.
46 . The method according to claim 39 , wherein the computed monetary value is based on actual customer benefit realized during use of the electronics assembly system solution.
47 . The method according to claim 39 , wherein the collected amount comprises a fixed price portion and a variable portion based on actual customer benefit realized during use of the electronics assembly system solution.
48 . The method according to claim 39 , wherein the computer model represents the system at a material flow level.
49 . The method according to claim 39 , wherein the computer model comprises a portion that simulates at least an aspect of the behavior of the system.
50 . A method for selling a customer an electronic assembly system solution, the method comprising the steps of:
a. offering a performance-based contract for sale of the assembly system solution, wherein the price of the solution is a function of the performance of the solution; b. upon customer acceptance, delivering the assembly system solution; c. monitoring the performance of the assembly system solution; and d. assessing compensation based upon the monitored performance and the price function, wherein the performance of the system is predicted using a computer model executed by a computer, and wherein the computer model represents the electronics assembly system and simulates an aspect of the behavior of the system.
51 . The method according to claim 50 , wherein the step of predicting system performance comprises modeling the electronics assembly system at a material flow level.
52 . The method according to claim 50 , wherein the step of predicting system performance comprises the steps of:
entering data into an input interface; transferring the data from the input interface to a modeling tool; and building a simulation with the modeling tool utilizing the transferred data.
53 . The method according to claim 52 , wherein the simulation comprises a discrete event simulation.
54 . The method according to claim 52 , wherein the step of entering data is performed on a client device and the step of building the simulation is performed on a server device.
55 . The method according to claim 52 , wherein the input interface comprises a spread sheet.
56 . The method according to claim 52 , wherein the input interface comprises a web form.
57 . The method according to claim 50 , wherein the computer model represents the system at a material flow level.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.