US2005230048A1PendingUtilityA1

Liner for use in processing chamber

Individually held — no corporate assignee on recordPriority: May 25, 1999Filed: Jun 10, 2005Published: Oct 20, 2005
Est. expiryMay 25, 2019(expired)· nominal 20-yr term from priority
H10P 72/0462H10P 72/0421H01J 37/32477H01J 37/321H01J 37/32458H01J 37/32623
52
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Claims

Abstract

A container for use in a processing chamber to lessen the amount of contaminant particles found within the chamber after processing. The container fits closely within the chamber and includes ports for a gas conduit and a vacuum conduit. The container may be locked to the chamber through a locking mechanism and a recess in the container. The container may be guided into the chamber with a plurality of chamfers. The container may be used in inductively coupled plasma chambers, electron cyclotron resonance chambers, and chambers capable of receiving microwaves.

Claims

exact text as granted — not AI-modified
1 - 86 . (canceled)  
   
   
       87 . A system for processing a semiconductor workpiece, said system comprising: 
 an enclosed processing chamber having at least one wall, an access door to an interior space, a vacuum port through said wall and a gas port through said wall; and    a locking mechanism for locking a container within said interior space of said processing chamber.    
   
   
       88 . The system of  claim 87 , wherein said processing chamber has an inner surface having a guiding mechanism for guiding insertion of said container.  
   
   
       89 . The system of  claim 88 , wherein said guiding mechanism comprises a plurality of chamfers.  
   
   
       90 . The system of  claim 87 , wherein said processing chamber is adapted to conduct inductively coupled plasma reactions, said processing chamber further comprising an electrode structure for producing said plasma reactions.  
   
   
       91 . The system of  claim 90 , wherein said electrode structure comprises an inductive coil and a source of radio frequency energy.  
   
   
       92 . A system for plasma processing a semiconductor workpiece, said system comprising: 
 a processing chamber having at least one wall an access door to an interior space of said processing chamber, an interior surface, a vacuum port and a gas port through said chamber wall;    a guiding mechanism for guiding insertion of a container;    a vacuum conduit; and    a gas conduit.    
   
   
       93 . The system of  claim 92 , wherein said processing chamber has a portion of a locking mechanism for locking said container to said processing chamber.  
   
   
       94 . The system of  claim 92 , wherein said processing chamber is adapted to provide inductively coupled plasma reactions, said processing chamber further comprising an electrode structure for producing said coupled plasma reactions.  
   
   
       95 . The system of  claim 92 , wherein said guiding mechanism comprises a plurality of chambers.

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