Device transfer method and display apparatus

Abstract

A device transfer method and a display apparatus are provided. A device transfer method and a display apparatus are provided by or in which, in transferring devices arranged on a substrate onto another substrate, it is possible to easily strip the substrate after the transfer of the devices, to lower the possibility of damaging of the substrate, and to additionally transfer devices onto the same substrate after the transfer of the devices. A plurality of devices arranged on a temporary holding substrate are embedded into and held in a pressure sensitive adhesive layer formed on a transfer substrate, and the devices are stripped from the temporary holding substrate. Other devices are further additionally embedded into the pressure sensitive adhesive layer before hardening the pressure sensitive adhesive layer, whereby the devices can be arranged on a transfer substrate having a large area. Besides, where the devices additionally embedded into the pressure sensitive adhesive layer are different in characteristics from the devices embedded in the pressure sensitive adhesive layer in advance, it is possible to easily obtain a display apparatus for multicolor display, a display apparatus having a driving circuit, and the like.

1 - 23 . (canceled)  
     
     
         24 . A device transfer method comprising the steps of: 
 embedding devices arranged on a first substrate into a pressure sensitive adhesive layer provided on a second substrate; and    stripping the devices from the first substrate so as to hold the devices in an embedded state in the pressure sensitive adhesive layer.    
     
     
         25 . The device transfer method as set forth in  claim 24 , comprising hardening the pressure sensitive adhesive layer after the devices are held in the embedded state in the pressure sensitive adhesive layer.  
     
     
         26 . The device transfer method as set forth in  claim 25 , comprising forming first electric wirings on the pressure sensitive adhesive layer after the pressure sensitive adhesive layer is hardened.  
     
     
         27 . The device transfer method as set forth in  claim 26 , comprising adhering a third substrate onto the side on which the first electric wirings are formed of the pressure sensitive adhesive layer after the first electric wirings are formed on the pressure sensitive adhesive layer.  
     
     
         28 . The device transfer method as set forth in  claim 27 , comprising stripping the second substrate and the pressure sensitive adhesive layer from each other after the third substrate is adhered to the side on which the first electric wirings are formed of the pressure sensitive adhesive layer.  
     
     
         29 . The device transfer method as set forth in  claim 28 , wherein the pressure sensitive adhesive layer is provided with openings reaching the devices after the second substrate and the pressure sensitive adhesive layer are stripped from each other.  
     
     
         30 . The device transfer method as set forth in  claim 29 , comprising filling the openings with a conductive material and forming second electric wirings on the pressure sensitive adhesive layer.  
     
     
         31 . The device transfer method as set forth in  claim 24 , further comprising bringing the devices into contact with a temporary adhesion layer provided on the first substrate for temporarily adhering the devices to the temporary adhesion layer thereby arranging the devices on the first substrate, before the embedding of the devices into the pressure sensitive adhesive layer.  
     
     
         32 . The device transfer method as set forth in  claim 31 , wherein a tack of the pressure sensitive adhesive layer provided on the second substrate is greater than a tack of the temporary adhesion layer provided on the first substrate.  
     
     
         33 . The device transfer method as set forth in  claim 32 , wherein the tack any one of the pressure sensitive adhesive layer and the temporary adhesion layer is changed so that the tack of the pressure sensitive adhesive layer will be greater than the tack of the temporary adhesion layer.  
     
     
         34 . The device transfer method as set forth in  claim 24 , wherein the embedding into the pressure sensitive adhesive layer provides the devices in a partially embedded state.  
     
     
         35 . The device transfer method as set forth in  claim 24 , wherein the pressure sensitive adhesive layer is formed of an insulating material.  
     
     
         36 . A device transfer method comprising: 
 embedding other-side devices arranged on a first substrate into a pressure sensitive adhesive layer provided on a second substrate where one-side devices are embedded in the pressure sensitive adhesive layer; and    stripping the other-side devices from the first substrate thereby holding the other-side devices in an embedded states in the pressure sensitive adhesive layer.    
     
     
         37 . The device transfer method as set forth in  claim 36 , wherein the one-side devices and the other-side devices have different characteristics.  
     
     
         38 . The device transfer method as set forth in  claim 36 , wherein the one-side devices and the other-side devices are held in the embedded state in different areas on the substrate.  
     
     
         39 . A display apparatus obtained by a method comprising: 
 embedding devices arranged on a first substrate into a pressure sensitive adhesive layer provided on a second substrate;    stripping the devices from the first substrate thereby holding the devices in an embedded state in the pressure sensitive adhesive layer, and hardening the pressure sensitive adhesive layer;    forming first electric wirings on the pressure sensitive adhesive layer, adhering a third substrate onto a side on which the first electric wirings are formed of the pressure sensitive adhesive layer, and stripping the second substrate and the pressure sensitive adhesive layer from each other; and    providing the pressure sensitive adhesive layer with openings reaching the devices, filling the openings with a conductive material, and forming second electric wirings on the pressure sensitive adhesive layer.    
     
     
         40 . The display apparatus as set forth in  claim 39 , wherein display is carried out through simple matrix driving by impressing a voltage on the devices through the first electric wirings and the second electric wirings.  
     
     
         41 . A display apparatus obtained by a method comprising: 
 embedding one-side devices arranged on a first substrate into a pressure sensitive adhesive layer provided on a second substrate, and stripping the one-side devices from the first substrate thereby holding the one-side devices in an embedded state in the pressure sensitive adhesive layer;    further embedding other-side devices arranged on the first substrate into the pressure sensitive adhesive layer, and stripping the other-side devices from the first substrate thereby holding the other-side devices in an embedded state in the pressure sensitive adhesive layer, where the one-side devices are embedded in the pressure sensitive adhesive layer;    hardening the pressure sensitive adhesive layer where the one-side devices and the other-side devices are held in the embedded state in the pressure sensitive adhesive layer;    forming first electric wirings on the pressure sensitive adhesive layer, adhering a third substrate onto the side on which the first electric wirings are formed of the pressure sensitive layer, and stripping the second substrate and the pressure sensitive adhesive layer from each other; and    providing the pressure sensitive adhesive layer with openings reaching the one-side devices or the other-side devices, filling the openings with a conductive material, and forming second electric wirings on the pressure sensitive adhesive layer.    
     
     
         42 . The display apparatus as set forth in  claim 41 , wherein the one-side devices and the other-side devices have different characteristics.  
     
     
         43 . The display apparatus as set forth in  claim 41 , wherein the one-side devices and the other-side devices are held in the embedded state in different areas on the second substrate.  
     
     
         44 . The display apparatus as set forth in  claim 41 , wherein display is carried out through simple matrix driving by impressing a voltage on the one-side devices or the other-side devices through the first electric wirings and the second electric wirings.  
     
     
         45 . The display apparatus as set forth in  claim 41 , wherein any one of the one-side devices and the other-side devices are any one of display devices and driving circuit devices.  
     
     
         46 . The display apparatus as set forth in  claim 45 , wherein display is carried out through active matrix driving by impressing a voltage on the display devices by the driving circuit devices.