Board for printed wiring, printed wiring board, and method for manufacturing them

Abstract

A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

1 . A board for printed wiring made by treating the surface of a board whereon a conductor wiring is to be formed by one of the following surface treatment methods: 
 (1) surface roughening treatment for achieving center line average roughness Ra in a range from 30 to 300 nm;    (2) plasma treatment;    (3) surface roughening treatment for achieving center line average roughness Ra in a range from 30 to 300 nm followed by plasma treatment, or    (4) surface roughening treatment for achieving center line average roughness Ra in a range from 30 to 300 nm followed by the step of forming a porous metal layer made of at least one kind of metal selected from among the group consisting of Al, Cr, Co, Ni, Cu and Ag, by sputtering.    
   
   
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       10 . A printed wiring board made by forming a conductor wiring by printing an electrically conductive paste containing metal particles M used as an electrically conductive filler and a binder B in volume ratio of M/B=1/1 to 1.9/1 on the surface of the board for printed wiring of  claim 1  whereon the surface treatment has been applied, etching the surface of the conductor wiring on at least a portion thereof used for connection with an external circuit so as to expose the metal particles on the surface, and forming a plating layer by electroless plating on the surface of the conductor wiring where the metal particles have been exposed by etching.  
   
   
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