Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus and a substrate processing method can appropriately control the charge of a substrate depending on the type of wet processing, thereby reducing defective processing due to static electricity on the surface of the substrate. The substrate processing apparatus includes: a static electricity adjustment section for adjusting static electricity on a substrate; and a wet processing apparatus for carrying out wet processing of the static electricity-adjusted substrate. The static electricity adjustment section removes static electricity from the substrate or charges the substrate into a desired charged state, for example.

1 . A substrate processing apparatus comprising: 
 a static electricity adjustment section for adjusting static electricity on a substrate; and    a wet processing apparatus for carrying out wet processing of the static electricity-adjusted substrate.    
     
     
         2 . The substrate processing apparatus according to  claim 1 , wherein the wet processing apparatus is comprised of at least one of an electroplating apparatus, an electroless plating apparatus, a CMP apparatus, an electrolytic etching apparatus, an electrolytic polishing apparatus, a chemical etching apparatus and a cleaning apparatus.  
     
     
         3 . The substrate processing apparatus according to  claim 1 , wherein the static electricity adjustment section is adapted to remove static electricity from the substrate.  
     
     
         4 . The substrate processing apparatus according to  claim 3 , wherein the removal of static electricity is effected by grounding the substrate.  
     
     
         5 . The substrate processing apparatus according to  claim 1 , wherein the static electricity adjustment section is adapted to charge the substrate into a desired charged state.  
     
     
         6 . The substrate processing apparatus according to claim  5 , wherein the static electricity adjustment section includes a static electricity sensor for detecting the charge of the substrate, a charging unit for charging the substrate, and a control section for controlling the charging unit.  
     
     
         7 . The substrate processing apparatus according to  claim 1 , wherein the static electricity adjustment section is provided in a substrate transport robot for transporting the substrate to the wet processing apparatus.  
     
     
         8 . The substrate processing apparatus according to  claim 1 , wherein the static electricity adjustment section is provided in a substrate transport route for transport of the substrate to the wet processing apparatus.  
     
     
         9 . The substrate processing apparatus according to  claim 1 , wherein the static electricity adjustment section is provided in the wet processing apparatus.  
     
     
         10 . A substrate processing method comprising: 
 adjusting static electricity on a substrate; and    carrying out wet processing of the static electricity-adjusted substrate.    
     
     
         11 . The substrate processing method according to  claim 10 , wherein the wet processing comprises at least one of electroplating, electroless plating, CMP, electrolytic etching, electrolytic polishing, chemical etching and cleaning.  
     
     
         12 . The substrate processing method according to  claim 10 , wherein adjusting static electricity on a substrate is performed by removing static electricity from the substrate.  
     
     
         13 . The substrate processing method according to  claim 12 , wherein the removal of static electricity from the substrate is effected by grounding the substrate.  
     
     
         14 . The substrate processing method according to  claim 10 , wherein adjusting static electricity on a substrate is performed by charging the substrate into a desired charged state.