Method and apparatus for supporting microelectronic substrates

Abstract

A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus can further include a first connection structure carried by the support member. The first connection structure can have a first bond site configured to receive a flowable conductive material, and can further have at least two first elongated members connected and extending outwardly from the first bond site. Each first elongated member can be configured to receive at least a portion of the flowable conductive material from the first bond site, with none of the first elongated members being electrically coupled to the microelectronic substrate. The assembly can further include a second connection structure that is electrically coupled to the microelectronic substrate and that can include second elongated members extending away from a second bond site. The number of second elongated members can be equal to the number of first elongated members.

1 - 61 . (canceled)  
   
   
       62 . An electronic device, comprising: 
 a housing;    a microelectronic substrate positioned within the housing;    a support substrate carrying the microelectronic substrate in the housing; and    a connection structure carried by the support substrate, the connection structure having a bond site configured to receive a flowable conductive material, the connection structure further having at least two elongated members, each of which is connected to and extends outwardly from the bond site, each elongated member being configured to receive at least a portion of the flowable conductive material from the bond site, and neither of which is electrically connected to the microelectronic substrate.    
   
   
       63 . The device of  claim 62  wherein each elongated member is configured to receive at least a portion of the flowable conductive material from the bond site.  
   
   
       64 . The device of  claim 62  wherein the connection structure is a first connection structure and the elongated members are first elongated members configured to receive at least a portion of the flowable conductive material from the first bond site, and wherein the apparatus further comprises a second connection structure carried by the support substrate, the second connection structure having a second bond site configured to receive a flowable conductive material, the second connection structure having a third bond site electrically coupled to the microelectronic substrate, the second connection structure further having second elongated members extending outwardly from the second bond site, wherein each of the second elongated members is configured to receive at least a portion of the flowable conductive material, and wherein and at least one of the second elongated members extends between the second and third bond sites.  
   
   
       65 . The device of  claim 62  wherein the elongated members are configured to be wetted by the flowable conductive material when the flowable conductive material is in a flowable state.  
   
   
       66 . The device of  claim 62  wherein the conductive structure includes two elongated members extending away from opposite sides of the bond site.  
   
   
       67 . The device of  claim 62 , further comprising a layer disposed on the elongated members and attached to the support substrate, the layer having an aperture aligned with the bond site.  
   
   
       68 . The device of  claim 62 , further comprising a layer disposed on the elongated members and attached to the support substrate, the layer having an aperture aligned with the bond site, and wherein a covered portion of each elongated member extends between the layer and the support substrate, and an exposed portion of each elongated member is exposed through the aperture, further wherein each exposed portion has approximately the same length.  
   
   
       69 . The device of  claim 62  wherein the connection structure includes at least one electrically conductive metallic material.  
   
   
       70 . The device of  claim 62  wherein the bond site includes a solder ball pad, and wherein the apparatus further comprises a solder ball disposed on the solder ball pad.  
   
   
       71 . The device of  claim 62  wherein at least one of the elongated members has a first end connected to the bond site and a second end spaced apart from the bond site, and wherein the elongated member includes an anchor toward the second end to secure the elongated member to the support substrate.  
   
   
       72 . The device of  claim 62  wherein the support substrate has a first surface coupled to the microelectronic substrate and a second surface facing opposite from the first surface, the connection structure being disposed on the second surface, and wherein the support substrate includes a slot extending between the first and second surfaces, and wherein the device further comprises wires extending through the slot between the second connection structure and the microelectronic substrate.  
   
   
       73 - 81 . (canceled)  
   
   
       82 . An apparatus for supporting a microelectronic substrate, comprising: 
 a support member having a first surface and a second surface facing opposite from the first surface, the second surface being configured to carry a microelectronic substrate; and    a connection structure carried by the support member, the connection structure including:    first and second bond sites, the first bond site being positioned at least proximate to the first surface of the support member, the second bond site being positioned at least proximate to the second surface of the support member, the second bond site being configured to be electrically coupled to the microelectronic substrate when the support member carries the microelectronic substrate, the first bond site being configured to receive a flowable conductive material; and    at least two elongated members connected to and extending outwardly from the first bond site, at least one of the elongated members being coupled between the first and second bond sites.    
   
   
       83 . The apparatus of  claim 82  wherein the at least one elongated member includes a first portion in a first plane generally parallel to the first surface, a second portion in a second plane generally parallel to the second surface and spaced apart from the first plane, and a third portion connected between the first and second portions.  
   
   
       84 . The apparatus of  claim 82 , further comprising a solder ball disposed on the first bond site.  
   
   
       85 . The apparatus of  claim 82 , further comprising: 
 a microelectronic substrate carried by the support member; and    a conductive link electrically coupled between the microelectronic substrate and the second bond site.    
   
   
       86 . The apparatus of  claim 82 , further comprising: 
 a microelectronic substrate carried by the support member; and    a wire bond electrically coupled between the microelectronic substrate and the second bond site.    
   
   
       87 . The apparatus of  claim 82  wherein each elongated member is configured to receive at least a portion of a flowable material from the first bond site.  
   
   
       88 - 124 . (canceled)