Method of plating

Abstract

An apparatus and method for treating a substrate to deposit, clean or etch material on a substrate use a first horizontal chuck to which a plurality of substrates is attached and electrically charged. Spaced closely to the first horizontal chuck is a coextensive horizontal second chuck which receives and showers reaction solution over all portions of each substrate. During the reaction process, both chucks are substantially submerged in reaction solution within a tank. At least one of the chucks is attached and controllable from a control arm. At least one of the chucks is rotated about a vertical axis at a slow speed during the reaction process. The axes of rotation of the two chucks may be coincident, or the axes may be offset from each other, and/or one or both axes may be offset from the chuck centerpoint(s). One of the chucks may also be periodically moved in a vertical direction relative to the other chuck.

1 . A method for simultaneously depositing a material onto at least one surface of a substrate of a plurality of substrates, comprising: 
 forming a deposition solution;    placing said deposition solution in a tank;    attaching a plurality of substrates onto a substantially horizontal surface of a first chuck;    submerging said first chuck in said deposition solution in said tank;    submerging a second chuck comprising a shower head in said deposition solution in said tank for horizontally orienting at least one substrate of said plurality of substrates parallel to said shower head and spaced therefrom;    applying a cathodic charge to at least one substrate of said plurality of substrates and an anodic charge to said shower head; and    showering said substrates with said deposition solution from said shower head.    
   
   
       2 . The method in accordance with  claim 1 , further comprising rotating at least one of the first chuck and the second chuck.  
   
   
       3 . The method in accordance with  claim 1 , wherein one of the first chuck and the second chuck includes a chuck rotated at a speed in the range of from about 0.1 rpm to about 5 rpm.  
   
   
       4 . The method in accordance with  claim 1 , wherein one of the first chuck and the second chuck includes a chuck rotated at a speed in the range of from about 0.2 rpm to about 3 rpm.  
   
   
       5 . The method in accordance with  claim 1 , wherein both of the first chuck and the second chuck includes a plurality of chucks rotated at speeds wherein a difference in speeds is in the range of from about 0.1 rpm to about 5 rpm.  
   
   
       6 . The method in accordance with  claim 1 , wherein both of the first chuck and the second chuck includes a plurality of chucks rotated at speeds wherein a difference is speeds is in the range of from about 0.2 rpm to about 3 rpm.  
   
   
       7 . The method in accordance with  claim 1 , wherein the first chuck includes a chuck rotated in a first direction and the second chuck includes a chuck rotated in a second, opposite direction.  
   
   
       8 . The method in accordance with  claim 1 , wherein all of the plurality of substrates are equally negatively charged.  
   
   
       9 . The method in accordance with  claim 1 , wherein one or more substrates of the plurality of substrates include at least one substrate unequally negatively charged from another substrate of the plurality of substrates.  
   
   
       10 . A method for simultaneously removing a material from at least a portion of at least one surface of a substrate of a plurality of substrates in a solution in a tank, comprising: 
 attaching a plurality of substrates onto a substantially horizontal surface of a first chuck;    submerging the first chuck in the solution in the tank;    submerging a second chuck comprising a shower head in the solution in the tank for horizontally orienting at least one substrate of the plurality of substrates parallel to the shower head and spaced therefrom;    applying a charge to the at least one substrate of the plurality of substrates and another charge to the shower head; and    showering the substrates with the solution from the shower head.    
   
   
       11 . The method in accordance with  claim 10 , further comprising rotating at least one of the first chuck and the second chuck.  
   
   
       12 . The method in accordance with  claim 10 , wherein one of the first chuck and the second chuck includes a chuck rotated at a speed in the range of from about 0.1 rpm to about 5 rpm.  
   
   
       13 . The method in accordance with  claim 10 , wherein one of the first chuck and the second chuck includes a chuck rotated at a speed in the range of from about 0.2 rpm to about 3 rpm.  
   
   
       14 . The method in accordance with  claim 10 , wherein both of the first chuck and the second chuck include a plurality of chucks rotated at speeds wherein the difference in speeds is in the range of from about 0.1 rpm to about 5 rpm.  
   
   
       15 . The method in accordance with  claim 10 , wherein both of the first chuck and the second chuck include a plurality of chucks rotated at speeds wherein the difference is speeds is in the range of from about 0.2 rpm to about 3 rpm.  
   
   
       16 . The method in accordance with  claim 10 , wherein the first chuck includes a chuck rotated in a first direction and the second chuck includes a chuck rotated in a second, opposite direction.  
   
   
       17 . The method in accordance with  claim 10 , wherein all of the plurality of substrates are equally charged.  
   
   
       18 . The method in accordance with  claim 10 , wherein one or more substrates of the plurality of substrates includes at least one substrate unequally charged from another substrate of the plurality of substrates.