Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

Abstract

A carrier tape, configured for use in an electronic device assembly process, includes a base film having a long edge and a plurality of first holes which extend through the base film. The first holes are aligned in a line that is adjacent to and parallel to the long edge of the base film and are spaced at a regular pitch. The carrier tape further includes a plurality of second holes which extend through the base film and which are aligned in the line. The second holes are spaced at the regular pitch and are respectively located between adjacent pairs of the first holes. Also, there is provided a method of manufacturing an electronic device with the carrier tape and a tape carrier package with the carrier tape.

1 . A carrier tape which is configured for use in an electronic device assembly process and which comprises: 
 a base film having a long edge;    a plurality of first holes which extend through the base film and which are aligned in a line that is adjacent to and parallel to the long edge of the base film, wherein the first holes are spaced at a regular pitch; and    a plurality of second holes which extend through the base film and which are aligned in the line, wherein the second holes are spaced at the regular pitch and are respectively located between adjacent pairs of the first holes.    
     
     
         2 . The carrier tape according to  claim 1 , wherein each of the second holes is located in the middle between respective adjacent pairs of the first holes.  
     
     
         3 . The carrier tape according to  claim 1 , wherein the regular pitch is 4.75 mm.  
     
     
         4 . The carrier tape according to  claim 1 , wherein a pitch between the first holes and the second holes is 2.375 mm.  
     
     
         5 . The carrier tape according to  claim 1 , wherein a size of each of the first holes is substantially equal to a size of each of the second holes in a direction of the line.  
     
     
         6 . The carrier tape according to  claim 1 , wherein a shape of each of the first holes is different than a shape of each of the second holes.  
     
     
         7 . The carrier tape according to  claim 1 , further comprising: 
 a plurality of third holes which extend through the base film and which are aligned on the line, wherein the third holes are spaced at the regular pitch and are respectively located adjacent pairs of the first and second holes.    
     
     
         8 . The carrier tape according to  claim 1 , wherein the regular pitch is substantially equal to a pitch of teeth of a sprocket which is used for a transferring movement of the carrier tape in the electronic device assembly process.  
     
     
         9 . A method of manufacturing an electronic device in an assembly process, comprising: 
 providing a carrier tape including (a) a base film having a long edge, (b) a plurality of first holes which extend through the base film and which are aligned in a line that is adjacent to and parallel to the long edge of the base film, wherein the first holes are spaced at a regular pitch, and (c) a plurality of second holes which extend through the base film and which are aligned in the line, wherein the second holes are spaced at the regular pitch and are respectively located between adjacent pairs of the first holes;    using at least one of the first holes to align a first electronic component at a first region of the carrier tape and mounting the first electronic component at the first region of the carrier tape; then    transferring the carrier tape by action of a sprocket having teeth extending into the first holes or the second holes of the carrier tape; then    using at least one of the second holes to align a second electronic component at a second region of the carrier tape and mounting the second electronic component at the second region of the carrier tape.    
     
     
         10 . The method according to  claim 9 , wherein the first electronic component is aligned with the first region so that a center line of the first electronic component which is perpendicular to the line is conformed to a center line of the first region which is perpendicular to the line.  
     
     
         11 . The method according to  claim 9 , wherein the first region is set to be positioned on the base film so that a center of the first region which is perpendicular to the line is conformed to a center line of the first hole which is perpendicular to the line.  
     
     
         12 . The method according to  claim 9 , wherein the second electronic component is aligned with the second region so that a center line of the second electronic component which is perpendicular to the line is conformed to a center line of the second region which is perpendicular to the line.  
     
     
         13 . The method according to  claim 9 , wherein the second region is set to be positioned on the base film so that a center of the second region which is perpendicular to the line is conformed to a center line of the second hole which is perpendicular to the line.  
     
     
         14 . The method according to  claim 9 , further comprising: 
 separating the first and second regions, in which the first and second electronic components are respectively mounted, from the carrier tape.    
     
     
         15 . The method according to  claim 9 , wherein the carrier tape is transferred while one of the first and second holes is detected.  
     
     
         16 . The method according to  claim 9 , wherein a pitch of the teeth of the sprocket is substantially equal to the regular pitch of the first and second holes.  
     
     
         17 . A tape carrier package, comprising: 
 a carrier tape including (a) a base film having a long edge, (b) a plurality of first holes which extend through the base film and which are aligned in a line that is adjacent to and parallel to the long edge of the base film, wherein the first holes are spaced at a regular pitch, and (c) a plurality of second holes which extend through the base film and which are aligned in the line, wherein the second holes are spaced at the regular pitch and are respectively located between adjacent pairs of the first holes;    a first electronic component located in a first region of the carrier tape and aligned with with one of the first holes;    a first resin which covers the first electronic component;    a second electronic component located in a second region of the carrier tape and aligned with one of the second holes, wherein the second region is different from the first region; and    a second resin which covers the second electronic component.    
     
     
         18 . The tape carrier package according to  claim 17 , further comprising: 
 a plurality of first wiring patterns formed in the first region and electrically connected with the first electronic component;    a plurality of second wiring patterns formed in the second region and electrically connected with the second electronic component.    
     
     
         19 . The tape carrier package according to  claim 18 , wherein a distance between the first wiring pattern and the second wiring pattern ranges from 0.05 to 0.2 mm.  
     
     
         20 . The tape carrier package according to  claim 17 , wherein each of the second holes is formed in the middle between the adjacent pair of the first holes.  
     
     
         21 . The tape carrier package according to  claim 17 , wherein the regular pitch is 4.75 mm.  
     
     
         22 . The tape carrier package according to  claim 17 , wherein a center line of the first electronic component which is perpendicular to the line is conformed to a center line of the first region which is perpendicular to the line.  
     
     
         23 . The tape carrier package according to  claim 17 , wherein a center line of the second electronic component which is perpendicular to the line is conformed to a center line of the second region which is perpendicular to the line.