Resilient contact probe apparatus, methods of using and making, and resilient contact probes

Abstract

Carriers comprising a carrier body having a plurality of openings holding a plurality of resilient contact probes are disclosed. A number of different embodiments for the resilient contact probes are also disclosed. The carriers of the present invention may be secured to an interface board (i.e., a printed circuit board (PCB)) and assembled with a-substrate (e.g., a wafer having integrated circuitry thereon, a PCB, etc.). The resilient contact probes electrically contact the terminal pads of the interface board and the electrical contacts of the substrate to enable electrical testing of the substrate. The configuration of the resilient contact probes, in combination with the carrier body, enables preferential, high mechanical loading of the terminal pads with controlled, predictable loading of the electrical contacts. Methods of making and use are also disclosed, as are a plurality of embodiments of resilient contact probes.

1 . An apparatus for making a temporary electrical connection with at least one electrical device, comprising: 
 a carrier body extending substantially in a plane and -having a first surface, an opposing second surface, and a plurality of openings extending through the carrier body from the first surface to the second surface; and    a plurality of resilient contact probes, each of the plurality of resilient contact probes partially received within an opening of the plurality of openings, each of the plurality of resilient contact probes comprising: 
 a first end region including a first contact end, a second end region including a second contact end, and an intermediate region therebetween, wherein the first end region of each of the plurality of resilient contact probes includes a portion comprising a first lateral dimension greater than a second lateral dimension that defines at least a portion of the opening adjacent the first end region.  
   
   
   
       2 . The apparatus of  claim 1 , wherein the first end region of at least one of the plurality of resilient contact probes is located outside of the opening and a surface of the first end region abuts the first surface of the carrier body.  
   
   
       3 . The apparatus of  claim 1 , further comprising: 
 a layer of compliant material secured over the first surface of the carrier body and having apertures therethrough aligned with openings of the plurality of openings, wherein the plurality of resilient contact probes each extend through the apertures and the layer of compliant material bears laterally against a portion of each resilient contact probe extending through an aperture.    
   
   
       4 . The apparatus of  claim 3 , wherein the first end region of at least one of the plurality of resilient contact probes is located outside of the opening and a surface of the first end region abuts the layer of compliant material.  
   
   
       5 . The apparatus of  claim 3 , wherein the openings of the plurality of openings include a countersink portion adjacent the first surface and the layer of compliant material laterally extends to the apertures over the countersink portions of the openings of the plurality of openings.  
   
   
       6 . The apparatus of  claim 3 , wherein the layer of compliant material comprises a resilient, nonconductive material.  
   
   
       7 . The apparatus of  claim 3 , wherein the layer of compliant material comprises a silicone-based elastomer or a fluorocarbon polymer.  
   
   
       8 . The apparatus of  claim 1 , wherein each of the openings of the plurality of openings includes a countersink portion adjacent the first surface.  
   
   
       9 . The apparatus of  claim 8 , wherein the first end region of each of the plurality of resilient contact probes are at least partially received in the countersink portions of the openings.  
   
   
       10 . The apparatus of  claim 1 , wherein the carrier body is a unitary carrier body.  
   
   
       11 . The apparatus of  claim 7 , wherein the carrier body is formed of an organic material, a ceramic material, a glass material, or a silicon material.  
   
   
       12 . The apparatus of  claim 1 , wherein the intermediate region of each of the plurality of resilient contact probes comprises a compression spring.  
   
   
       13 . The apparatus of  claim 12 , wherein the compression spring comprises an active, longitudinally compressible portion within the intermediate region and a dead, substantially incompressible portion within the intermediate region and proximate the second end region.  
   
   
       14 . The apparatus of  claim 13 , wherein the dead portion has a longitudinal extent equal to or greater than a lateral dimension of a portion of the opening that encloses at least part of the dead portion.  
   
   
       15 . The apparatus of  claim 12 , wherein the compression spring comprises an active, longitudinally compressible portion within the intermediate region.  
   
   
       16 . The apparatus of  claim 12 , wherein at least one of the plurality of resilient contact probes comprises: 
 a substantially tubular housing at least partially enclosing the compression spring and secured to a portion thereof adjacent the first end region; and    a plunger body comprising a stopper portion received within the housing and a contact tip portion extending longitudinally beyond the housing, the plunger body in contact with a portion of the compression spring remote from the first end region.    
   
   
       17 . The apparatus of  claim 1 , further comprising: 
 a plurality of spacer elements disposed on and protruding from the second surface of the carrier body.    
   
   
       18 . The apparatus of  claim 17 , wherein the plurality of spacer elements is formed of solder mask material, metal material, or plastic material.  
   
   
       19 . The apparatus of  claim 1 , further comprising: 
 an interface board secured to the carrier body, the interface board having a contact surface including a plurality of terminal pads thereon opposing the first surface of the carrier body and the first contact end of at least some of the plurality of resilient contact probes are in electrical contact with terminal pads of the interface board; and    the portion of the first end region of each of the plurality of resilient contact probes comprising the first lateral dimension greater than the second lateral dimension of the at least a portion of the opening adjacent the first end region is disposed between the carrier body and the interface board.    
   
   
       20 . The apparatus of  claim 19 , further comprising: 
 a substantially planar chuck member disposed over the carrier body and extending laterally therebeyond; and    a seal element extending peripherally about the carrier body and disposed between the interface board and the chuck member.    
   
   
       21 . The apparatus of  claim 20 , wherein the chuck member comprises a vacuum port extending therethrough.  
   
   
       22 . An apparatus for making a temporary electrical connection with at least one electrical device, comprising: 
 a carrier body extending substantially in a plane and having a first surface, an opposing second surface, and a plurality of openings extending through the carrier body from the first surface to the second surface;    a layer of compliant material adhered to the first surface and having a plurality of apertures therethrough aligned with the plurality of openings; and    a plurality of resilient contact probes, each of the plurality of resilient contact probes partially received within an opening of the plurality of openings and extending through an aperture of the plurality of apertures, each of the plurality of resilient contact probes comprising: 
 a first end region including a first contact end, a second end region including a second contact end, and an intermediate region therebetween, wherein the first end region of each of the plurality of resilient contact probes includes a portion comprising a first lateral dimension greater than a second lateral dimension that defines at least a portion of the opening adjacent the first end region and wherein the compliant material of the layer laterally engages the resilient contact probe passing therethrough.  
   
   
   
       23 . The apparatus of  claim 22 , wherein the first end region of at least one of the plurality of resilient contact probes is located outside of the opening and a surface of the first end region abuts the layer of compliant material.  
   
   
       24 . The apparatus of  claim 22 , wherein the openings of the plurality of openings include a countersink portion adjacent the first surface and the layer of compliant material laterally extends to the plurality of apertures over the countersink portions of the openings of the plurality of openings.  
   
   
       25 . The apparatus of  claim 22 , wherein the layer of compliant material comprises a resilient, nonconductive material.  
   
   
       26 . The apparatus of  claim 22 , wherein the layer of compliant material comprises a silicone-based elastomer or a fluorocarbon polymer.  
   
   
       27 . The apparatus of  claim 22 , wherein the carrier body is a unitary carrier body.  
   
   
       28 . The apparatus of  claim 22 , wherein the carrier body is formed of an organic material, a ceramic material, a glass material, or a silicon material.  
   
   
       29 . The apparatus of  claim 22 , wherein the intermediate region of each of the plurality of resilient contact probes comprises a compression spring.  
   
   
       30 . The apparatus of  claim 29 , wherein the compression spring comprises an active, longitudinally compressible portion within the intermediate region and a dead, substantially incompressible portion within the intermediate region and proximate the second end region.  
   
   
       31 . The apparatus of  claim 30 , wherein the dead portion has a longitudinal extent equal to or greater than a lateral dimension of a portion of the opening that encloses at least part of the dead portion.  
   
   
       32 . The apparatus of  claim 29 , wherein the compression spring comprises an active, longitudinally compressible portion within the intermediate region.  
   
   
       33 . The apparatus of  claim 29 , wherein at least one of the plurality of resilient contact probes comprises: 
 a substantially tubular housing at least partially enclosing the compression spring and secured to a portion thereof adjacent the first end region; and    a plunger body comprising a stopper portion received within the housing and a contact tip portion extending longitudinally therebeyond, the plunger body in contact with a portion of the compression spring remote from the first end region.    
   
   
       34 . The apparatus of  claim 22 , further comprising: 
 a plurality of spacer elements disposed on and protruding from the second surface of the carrier body.    
   
   
       35 . The apparatus of  claim 34 , wherein the plurality of spacer elements is formed of solder mask material, metal material, or plastic material.  
   
   
       36 . The apparatus of  claim 22 , further comprising: 
 an interface board secured to the carrier body, the interface board having a contact surface including a plurality of terminal pads thereon opposing the first surface of the carrier body and the first contact end of at least some of the plurality of resilient contact probes are in electrical contact with terminal pads of the interface board; and    the portion of the first end region of each of the plurality of resilient contact probes comprising the first lateral dimension greater than the second lateral dimension of the at least a portion of the opening adjacent the first end region is disposed between the carrier body and the interface board.    
   
   
       37 . The apparatus of  claim 36 , further comprising: 
 a substantially planar chuck member disposed over the carrier body and extending laterally therebeyond; and    a seal element extending peripherally about the carrier body and disposed between the interface board and the chuck member.    
   
   
       38 . The apparatus of  claim 37 , wherein the chuck member comprises a vacuum port extending therethrough.  
   
   
       39 . A method of forming a resilient contact probe apparatus for making a temporary electrical connection with at least one electrical device, comprising: 
 providing a carrier body extending substantially in a plane and having a first surface and an opposing second surface;    forming a plurality of openings extending from the first surface to the second surface; and    inserting a resilient contact probe into at least some of the plurality of openings of the carrier body, each of the resilient contact probes comprising: 
 a first end region including a first contact end, a second end region including a second contact end, and an intermediate region therebetween, wherein the first end region of each of the resilient contact probes includes a portion comprising a first lateral dimension greater than a second lateral dimension that defines at least a portion of the opening adjacent the first end region.  
   
   
   
       40 . The method of  claim 39 , further comprising: 
 selecting the carrier body to be a unitary carrier body.    
   
   
       41 . The method of  claim 39 , further comprising: 
 selecting the carrier body to be formed from an organic material, a ceramic material, a glass material, or a silicon material.    
   
   
       42 . The method of  claim 39 , further comprising: 
 securing an interface board having a contact surface including a plurality of terminal pads thereon to the carrier body, the contact surface opposing the first surface of the carrier body;    providing a seal element extending peripherally about the carrier body and contacting the contact surface of the interface board;    providing a substrate having a surface including a plurality of electrical contacts thereon to be received within at least a portion of an interior region defined by the seal element, the surface of the substrate opposing the second surface of the carrier body; and    contacting the first contact end and the second contact end of at least some of the resilient contact probes to terminal pads of the interface board and electrical contacts of the substrate.    
   
   
       43 . The method according to  claim 42 , wherein the contacting the first contact end and the second contact end of at least some of the resilient contact probes to terminal pads of the interface board and electrical contacts of the substrate comprises: 
 providing a substantially planar chuck member having a vacuum port to contact a back surface of the substrate and a portion of the seal element; and    applying at least a partial vacuum communicated through the vacuum port to cause the first contact end and the second contact end of at least some of the resilient contact probes to be in electrical communication with terminal pads of the interface board and electrical contacts of the substrate.    
   
   
       44 . The method of  claim 43 , wherein the applying the at least a partial vacuum causes the first contact end of at least some of the resilient contact probes to load terminal pads of the interface board to a greater degree than the second contact end loads electrical contacts of the substrate.  
   
   
       45 . The method of  claim 43 , wherein the applying the at least a partial vacuum causes the first surface of the carrier body to urge the first contact end of each of the resilient contact probes to contact terminal pads on the contact surface of the interface board and the second contact end of each of the resilient contact probes to contact electrical contacts on the surface of the substrate.  
   
   
       46 . The method of  claim 39 , further comprising: 
 forming a plurality of spacer elements disposed and located at predetermined locations on the second surface of the carrier body.    
   
   
       47 . The method of  claim 42 , further comprising: 
 selecting the substrate to be a semiconductor substrate or a printed circuit board.    
   
   
       48 . A method of forming a resilient contact probe apparatus for making a temporary electrical connection with at least one electrical device, comprising: 
 providing a carrier body extending substantially in a plane and having a first surface, an opposing second surface, and a layer of compliant material secured over the first surface of the carrier body;    forming a plurality of openings extending from the first surface to the second surface of the carrier body and a plurality of apertures through the layer of compliant material, each of the plurality of apertures aligned with openings of the plurality of openings; and    inserting a resilient contact probe into at least some of the plurality of openings of the carrier body and into apertures of the layer of compliant material aligned therewith, each of the resilient contact probes comprising: 
 a first end region including a first contact end, a second end region including a second contact end, and an intermediate region therebetween, wherein the first end region of each of the resilient contact probes includes a portion comprising a first lateral dimension greater than a second lateral dimension that defines at least a portion of the opening adjacent the first end region.  
   
   
   
       49 . The method of  claim 48 , wherein the forming the plurality of openings and the plurality of apertures is effected by drilling through the layer of compliant material and the carrier body.  
   
   
       50 . The method of  claim 48 , further comprising: 
 heating the carrier body including the layer of compliant material and the resilient contact probes to cause the compliant material of the layer to laterally expand to engage the resilient contact probe passing therethrough.    
   
   
       51 . The method of  claim 48 , further comprising: 
 selecting the compliant material to comprise a resilient, nonconductive material.    
   
   
       52 . The method of  claim 48 , further comprising: 
 selecting the layer of compliant material to comprise a silicone-based elastomer or a fluorocarbon polymer.    
   
   
       53 . The method of  claim 48 , further comprising: 
 selecting the carrier body to be a unitary carrier body.    
   
   
       54 . The method of  claim 48 , further comprising: 
 selecting a material for the carrier body to be formed from an organic material, a ceramic material, a glass material, or a silicon material.    
   
   
       55 . The method of  claim 48 , further comprising: 
 securing an interface board having a contact surface including a plurality of terminal pads thereon to the carrier body, the contact surface opposing the first surface of the carrier body;    providing a seal element extending peripherally about the carrier body and contacting the contact surface of the interface board;    providing a substrate having a surface including a plurality of electrical contacts thereon to be received within at least a portion of an interior region defined by the seal element, the surface of the substrate opposing the second surface of the carrier body; and    contacting the first contact end and the second contact end of at least some of the resilient contact probes to terminal pads of the interface board and electrical contacts of the substrate.    
   
   
       56 . The method according to  claim 55 , wherein the contacting the first contact end and the second contact end of at least some of the resilient contact probes to terminal pads of the interface board and electrical contacts of the substrate comprises: 
 providing a substantially planar chuck member having a vacuum port to contact a back surface of the substrate and a portion of the seal; and    applying at least a partial vacuum communicated through the vacuum port to cause the first contact end and the second contact end of at least some of the resilient contact probes to be in electrical communication with terminal pads of the interface board and electrical contacts of the substrate.    
   
   
       57 . The method of  claim 56 , wherein the applying the at least the partial vacuum causes the first contact end of at least some of the resilient contact probes to load terminal pads of the interface board to a greater degree than the second contact end loads electrical contacts of the substrate.  
   
   
       58 . The method of  claim 56 , wherein the applying the at least the partial vacuum causes the first surface of the carrier body to urge the first contact end of each of the resilient contact probes to contact terminal pads on the contact surface of the interface board and the second contact end of each of the resilient contact probes to contact electrical contacts on the surface of the substrate.  
   
   
       59 . The method of  claim 48 , further comprising: 
 forming a plurality of spacer elements disposed and located at predetermined locations on the second surface of the carrier body.    
   
   
       60 . The method of  claim 55 , further comprising: 
 selecting the substrate to be a semiconductor substrate or a printed circuit board.    
   
   
       61 . A method of forming a resilient contact probe apparatus for making a temporary electrical connection with at least one electrical device, comprising: 
 providing a carrier body extending substantially in a plane and having a first surface, an opposing second surface, and a plurality of openings extending from the first surface to the second surface;    securing a layer of compliant material over the first surface of the carrier body;    forming a plurality of apertures through the layer of compliant material, each of the plurality of apertures aligned with openings of the plurality of openings; and    inserting a resilient contact probe into at least some of the plurality of openings of the carrier body and apertures of the layer of compliant material aligned therewith, each of the resilient contact probes comprising: 
 a first end region including a first contact end, a second end region including a second contact end, and an intermediate region therebetween, wherein the first end region of each of the resilient contact probes includes a portion comprising a first lateral dimension greater than a second lateral dimension that defines at least a portion of the opening adjacent the first end region.  
   
   
   
       62 . The method of  claim 61 , wherein the forming the plurality of apertures is effected by piercing through the layer of compliant material.  
   
   
       63 . The method of  claim 61 , further comprising: 
 heating the carrier body including the layer of compliant material and the resilient contact probes to cause the compliant material of the layer to laterally expand to engage the resilient contact probe passing therethrough.    
   
   
       64 . The method of  claim 61 , further comprising: 
 selecting the compliant material to comprise a resilient, nonconductive material.    
   
   
       65 . The method of  claim 61 , further comprising: 
 selecting the layer of compliant material to comprise a silicone-based elastomer or a fluorocarbon polymer.    
   
   
       66 . The method of  claim 61 , further comprising: 
 selecting the carrier body to be a unitary carrier body.    
   
   
       67 . The method of  claim 61 , further comprising: 
 selecting a material for the carrier body to be formed from an organic material, a ceramic material, a glass material, or a silicon material.    
   
   
       68 . The method of  claim 61 , further comprising: 
 securing an interface board having a contact surface including a plurality of terminal pads thereon to the carrier body, the contact surface opposing the first surface of the carrier body;    providing a seal element extending peripherally about the carrier body and contacting the contact surface of the interface board;    providing a substrate having a surface including a plurality of electrical contacts thereon to be received within at least a portion of an interior region defined by the seal element, the surface of the substrate opposing the second surface of the carrier body; and    contacting the first contact end and the second contact end of at least some of the resilient contact probes to terminal pads of the interface board and electrical contacts of the substrate.    
   
   
       69 . The method according to  claim 68 , wherein the contacting the first contact end and the second contact end of at least some of the resilient contact probes to terminal pads of the interface board and electrical contacts of the substrate comprises: 
 providing a substantially planar chuck member having a vacuum port to contact a back surface of the substrate and a portion of the seal element; and    applying at least a partial vacuum communicated through the vacuum port to cause the first contact end and the second contact end of at least some of the resilient contact probes to be in electrical communication with terminal pads of the interface board and electrical contacts of the substrate.    
   
   
       70 . The method of  claim 69 , wherein the applying the at least the partial vacuum causes the first contact end of at least some of the resilient contact probes to load terminal pads of the interface board to a greater degree than the second contact end loads electrical contacts of the substrate.  
   
   
       71 . The method of  claim 69 , wherein the applying the at least the partial vacuum causes the first surface of the carrier body to urge the first contact end of each of the resilient contact probes to contact terminal pads on the contact surface of the interface board and the second contact end of each of the resilient contact probes to contact electrical contacts on the surface of the substrate.  
   
   
       72 . The method of  claim 61 , further comprising: 
 forming a plurality of spacer elements disposed and located at predetermined locations on the second surface of the carrier body.    
   
   
       73 . The method of  claim 68 , further comprising: 
 selecting the substrate to be a semiconductor substrate or a printed circuit board.    
   
   
       74 . A resilient contact probe comprising: 
 a first end region, a second end region, and an intermediate region therebetween, the intermediate region comprising a compression spring having an active, longitudinally compressible portion, wherein at least a portion of the first end region includes a lateral dimension greater than a diameter of the active, longitudinally compressible portion.    
   
   
       75 . The resilient contact probe of  claim 74 , wherein the compression spring comprises a dead, substantially incompressible portion within the intermediate region and proximate the second end region.  
   
   
       76 . The resilient contact probe of  claim 74 , wherein the first end region comprises at least one coil having the lateral dimension greater than the diameter of the active, longitudinally compressible portion.  
   
   
       77 . The resilient contact probe of  claim 76 , wherein the first end region further comprises a pigtail extending distally from the at least one coil.  
   
   
       78 . The resilient contact probe of  claim 74 , further comprising: 
 a substantially tubular housing at least partially enclosing the compression spring and secured to a portion thereof adjacent the first end region, the lateral dimension of the first end region greater than a diameter of the housing; and    a plunger body comprising a stopper portion received within the housing and a contact tip portion extending longitudinally beyond the housing, the plunger body longitudinally biased by a portion of the compression spring and adjacent a portion thereof remote from the first end region.    
   
   
       79 . The resilient contact probe of  claim 78 , wherein the housing comprises: 
 an annular, crimped portion that bears against a portion of the compression spring adjacent the first end region.    
   
   
       80 . The resilient contact probe of  claim 78 , further comprising: 
 an end cap secured to an end of the housing proximate the first end region.    
   
   
       81 . The resilient contact probe of  claim 78 , further comprising: 
 an annular ring extending peripherally about the housing and secured to an outer surface thereof proximate the first end region.    
   
   
       82 . The resilient contact probe of  claim 78 , wherein the first end region comprises at least one coil located outside of the housing, the at least one coil having a lateral extent greater than the diameter of the housing.  
   
   
       83 . The resilient contact probe of  claim 82 , wherein the first end region further comprises a pigtail extending distally from the at least one coil.