Apparatus and method for terminating probe apparatus of semiconductor wafer

Abstract

A method and apparatus for terminating a probe that probes a semiconductor device with a signal cable from a tester is provided to connect layers of the probe to layers of the signal cable side by side. The probe and signal cable can be a co-axial or tri-axial probe and signal cable, respectively. A center conductive probe needle of the probe is disposed side by side with and electrically connects to a center signal conductor of the signal cable. A dielectric layer of the probe is disposed side by side with and connects to a dielectric layer of the signal cable. A conductive guard layer of the probe is disposed side by side with and electrically connects to a conductive dispersion/guard layer of the signal cable, and a sleeve of the probe is disposed side by side with and connects to a sleeve of the signal cable. In a tri-axial embodiment, a second dielectric layer of the probe is disposed side by side with and connects to a second dielectric layer of the signal cable.

1 - 15 . (canceled)  
   
   
       16 . A method of terminating a probe that probes a semiconductor device with a signal cable, comprising the steps of: 
 stripping back at least one layer of the signal cable and at least one layer of the probe;    placing a proximal end of the probe along side of a distal end of the signal cable; and    shrinking the at least one layer of the signal cable and the at least one layer of the probe.    
   
   
       17 . The method of  claim 16 , wherein the step of placing the proximal end of the probe along side of the distal end of the signal cable comprises the steps of: 
 placing a center conductive probe needle of the probe side by side with and electrically connected to a center signal conductor of the signal cable;    placing a dielectric layer of the probe side by side with and connected to a dielectric layer of the signal cable;    placing a conductive guard layer of the probe side by side with and electrically connected to a conductive dispersion/guard layer of the signal cable; and    placing a sleeve of the probe side by side with and connected to a sleeve of the signal cable.    
   
   
       18 . The method of  claim 16 , wherein the step of placing the proximal end of the probe along side of the distal end of the signal cable comprises the steps of: 
 placing a center conductive probe needle of the probe side by side with and electrically connected to a center signal conductor of the signal cable;    placing a dielectric layer of the probe side by side with and connected to a dielectric layer of the signal cable;    placing a conductive guard layer of the probe side by side with and electrically connected to a conductive dispersion/guard layer of the signal cable;    placing a second dielectric layer of the probe side by side with and connected to a second dielectric layer of the signal cable; and    placing a sleeve of the probe side by side with and connected to a sleeve of the signal cable.    
   
   
       19 . An apparatus for terminating a probe that probes a semiconductor device with a signal cable, the apparatus comprising at least one layer of the probe and at least one layer of the signal cable connected side by side.  
   
   
       20 - 21 . (canceled)