US2005256557A1PendingUtilityA1
Medical lead and method for medical lead manufacture
Individually held — no corporate assignee on recordPriority: Sep 26, 2000Filed: Mar 8, 2005Published: Nov 17, 2005
Est. expirySep 26, 2020(expired)· nominal 20-yr term from priority
A61N 1/05A61N 1/056
43
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Claims
Abstract
The present invention provides a medical lead for implantation within a patient. The medical lead has a seem-less lead body having one or more electrodes secured to the distal end and one or more connector bands attached to the proximal end of the lead.
Claims
exact text as granted — not AI-modified1 .- 2 . (canceled)
3 . A method of forming a medical lead, the method comprising:
forming a welding region within insulating material in a lead body of the medical lead to expose a conductor; forming a conductive pad within the welding region by melting conductive material at a point over the welding region to form the conductive pad and electrically connecting the conductive pad to the conductor; and electrically connecting an electrode to the conductive pad.
4 . A method in accordance with claim 3 wherein the welding region is formed using a laser.
5 . A method in accordance with claim 3 wherein the conductive material comprises a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—Ir, platinum, silver, gold, copper and vanadium.
6 . A method in accordance with claim 3 wherein the welding region is in the shape of a groove.
7 . A method in accordance with claim 3 further comprising:
welding the electrode to the conductive pad.
8 . A method in accordance with claim 3 wherein forming the conductive pad further comprises melting and welding the conductive pad to the conductor using a laser.
9 . A method in accordance with claim 3 wherein forming the conductive pad further comprises;
placing a length of wire over the welding region; and melting the wire at a point such that ends of the wire are drawn into the welding region to form the conductive pad.
10 . A method of forming a medical lead, the method comprising:
forming a first welding region within insulating material in a lead body of the medical lead to expose a conductor; forming a second welding region within the insulating material in the lead body of the medical lead to expose the conductor; forming a first conductive pad within the first welding region by melting a first conductive material at a point over the first welding region to form the first conductive pad and electrically connecting the first conductive pad to the conductor; forming a second conductive pad within the second welding region by melting a second conductive material at a point over the second welding region to form the second conductive pad and electrically connecting the second conductive pad to the conductor; and electrically connecting an electrode to the first conductive pad and the second conductive pad.
11 . A method in accordance with claim 10 wherein the first and second welding regions are formed using a laser.
12 . A method in accordance with claim 10 wherein the first and second conductive material each comprise a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—Ir, platinum, silver, gold, copper and vanadium.
13 . A method in accordance with claim 10 wherein the first and second welding regions are in the shape of a groove.
14 . A method in accordance with claim 10 further comprising:
welding the electrode to the first conductive pad; and welding the electrode to the second conductive pad.
15 . A method in accordance with claim 10 wherein forming the first conductive pad further comprises melting and welding the first conductive pad to the conductor using a laser, and forming the second conductive pad further comprises melting and welding the second conductive pad to the conductor using a laser.
16 . A method in accordance with claim 10 wherein forming the first conductive pad further comprises,
placing a length of first wire over the first welding region; and melting the first wire at a point such that ends of the first wire are drawn into the first welding region to form the first conductive pad; and wherein forming the second conductive pad further comprises, placing a length of second wire over the second welding region; and melting the second wire at a point such that ends of the second wire are drawn into the second welding region to form the second conductive pad
17 . A method of forming a medical lead, the method comprising:
forming a welding region within insulating material in a lead body of the medical lead to expose a conductor; forming, using a laser, a conductive pad within the welding region by melting wire conductive material within the welding region to form the conductive pad thereby welding the conductive pad to the conductor; and welding an electrode to the conductive pad.
18 . A method in accordance with claim 17 wherein the welding region is formed using a laser.
19 . A method in accordance with claim 17 wherein the conductive material comprises a conductive metal selected from the group consisting of stainless steel, MB35N, Pt—Ir, platinum, silver, gold, copper and vanadium.
20 . A method in accordance with claim 17 wherein forming the conductive pad further comprises;
placing a length of wire over the welding region; and melting the wire at a point such that ends of the wire are drawn into the welding region to form the conductive pad.Join the waitlist — get patent alerts
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