Electromagnetic interference shield and method of making the same

Abstract

An EMI shield for blocking and dissipating electromagnetic interference. The EMI shield includes a primary conductive member having a plurality of catches extending into a plurality of receptacles defined in an absorptive member so as to firmly connect the members. Advantageously, the absorptive member is sufficiently solid to be retained against the primary conductive member during normal use. In addition, the absorptive member is constructed of materials capable of withstanding a temperature range of 139° C. to 260° C. associated with most soldering operations. In this manner, the conductive and absorptive members can be attached prior to soldering of the EMI shield to electronic circuitry of a mobile station. The catches may have sharp edges allowing the absorptive member to be pressed onto the catches.

1 . A method of manufacturing an electromagnetic interference shield, said method comprising: 
 providing a plurality of catches on a primary conductive member;    providing a plurality of receptacles in an absorptive member; and    mounting the absorptive member to the primary conductive member by positioning the catches in the receptacles.    
   
   
       2 . A method of  claim 1 , wherein providing and mounting occur simultaneously by bringing a first attachment surface of the conductive member, from which the catches extend, into contact with a second attachment surface of the absorptive member so that the catches penetrate the second surface and become embedded in the absorptive member and form the receptacles.  
   
   
       3 . A method of  claim 1 , further comprising soldering the conductive member to a circuit board of a mobile station.  
   
   
       4 . A method of  claim 1 , wherein providing the receptacles includes defining the receptacles in the absorptive member so that the receptacles extend from a second attachment surface of the absorptive member to an opposite surface of the absorptive member, said method further comprising bending ends of the catches over portions of the opposite surface.  
   
   
       5 . A method of  claim 1 , wherein forming the plurality of catches includes punching holes into the primary conductive member.  
   
   
       6 . A method of  claim 5 , wherein punching holes includes punching holes with a triangular punch to form triangular catches.  
   
   
       7 . A method of  claim 1 , wherein defining the receptacles includes cutting the receptacles in the absorptive member prior to positioning the catches in the receptacles.  
   
   
       8 . A method of  claim 7 , wherein defining the receptacles includes one of die cutting, water jet drilling, laser drilling, bit drilling and ultrasonically cutting the absorptive member.  
   
   
       9 . A method of  claim 1 , wherein forming the catches includes molding the primary conductive member with the catches thereon.  
   
   
       10 . A method of  claim 9 , further comprising applying a conductive coating to the molded primary conductive member and the catches.  
   
   
       11 . A method of  claim 1 , further comprising forming the absorptive member prior to defining the receptacles therein.  
   
   
       12 . A method of  claim 11 , wherein forming the absorptive member includes encasing a conductive mesh within an absorptive polymer matrix.  
   
   
       13 . A method of  claim 11 , wherein forming the absorptive member includes adding conductive materials to a polymer.  
   
   
       14 . A method of  claim 11 , wherein forming the absorptive member includes forming a laminate with layers of conductive and absorptive materials.  
   
   
       15 . A method of  claim 11 , wherein forming the absorptive member includes embedding an absorptive mesh into a conductive foam material.  
   
   
       16 . A method of  claim 11 , further comprising soldering electronic components to the primary conductive member.  
   
   
       17 . A method of manufacturing an electromagnetic interference shield, said method comprising: 
 providing a primary conductive member;    providing a plurality of receptacles in an absorptive member, wherein said receptacles are positioned in a fractal pattern;    mounting the absorptive member to the primary conductive member; and    electrically connecting the absorptive member and primary conductive member at the plurality of receptacles.    
   
   
       18 . A method of  claim 17 , wherein providing the primary conductive member includes providing a plurality of catches on the primary conductive member and wherein electrically connecting the members includes positioning the catches in the receptacles  
   
   
       19 . A method of  claim 18 , wherein forming the plurality of catches includes punching holes into the primary conductive member.  
   
   
       20 . A method of  claim 17 , wherein providing the receptacles includes defining the receptacles in the absorptive member so that the receptacles extend from a second attachment surface of the absorptive member to an opposite surface of the absorptive member, said method further comprising bending ends of the catches over portions of the opposite surface.