Dynamic atomizer on conditioner assemblies using high velocity water

Abstract

A conditioner assembly is disclosed for conditioning a polishing pad used in chemical mechanical polishing of planar semiconductor wafer components. One embodiment of the conditioner assembly comprises a plate-type conditioner plate comprising a circular edge, having a first side and a second side, where on the first side is provided one or more diamond-impregnated abrasive elements, each comprising an abrasive surface disposed a distance from said first side comprising diamond particles, and one or more jets oriented to discharge fluid away from said first side. In operation the jets dispense high velocity fluid that hits the surface of the adjacent polishing pad with sufficient force to dislodge diamond particles that have loosened or broken off from the diamond-impregnated abrasive elements, thereby avoiding the embedding of such particles into the polishing pad surface. Another embodiment uses a ring-type conditioner plate assembly instead of a plate type, and also comprises one or more diamond-impregnated abrasive elements, each comprising an abrasive surface disposed a distance from said first side comprising diamond particles, and one or more jets oriented to discharge fluid away from said first side.

1 . A conditioner assembly for conditioning a polishing pad used in chemical mechanical polishing of semiconductor wafer comprising: 
 a. a polishing pad conditioner body comprising an abrasive surface formed by a plurality of diamond particles embedded in the surface;    b. an apparatus for positioning said conditioner body in abrasive relationship with a planar surface of the polishing pad and for effective rotation of the conditioner body with the planar surface of the polishing pad; and    c. an apparatus for delivering a flow of fluid into an interface between said conditioner body and said planar surface of the polishing pad;    wherein the flow of fluid is sufficient to dislodge diamond particles which have become embedded in the planar surface of the polishing pad.    
   
   
       2 . The conditioner assembly of  claim 1  wherein said apparatus for delivering a flow of fluid is comprised of at least one jet.  
   
   
       3 . The conditioner assembly of  claim 1  wherein said abrasive surface is comprised of an annular ring.  
   
   
       4 . The conditioner assembly of  claim 1  wherein said abrasive surface is comprised of a plurality of sections separated by channels.  
   
   
       5 . The conditioner assembly of  claim 1  wherein said conditioner body is plate-shaped.  
   
   
       6 . The conditioner assembly of  claim 1  wherein said conditioner body comprises a ring shape and comprises a central void within said ring shape.  
   
   
       7 . The conditioner assembly of  claim 1  wherein said apparatus for delivering a flow of fluid is comprised of a plurality of jets, each said jet oriented at an angle less than 90 degrees, to direct fluid through one of said channels.  
   
   
       8 . The conditioner assembly of  claim 2 , apparatus for delivering a flow of fluid comprises a rotary union adapted for rotation, and a conduit attaching to said rotary union, fluidly communicating said at least one jet with a supply of water in fluid communication with said rotary union.  
   
   
       9 . A conditioner sub-assembly employed in conditioning a polishing pad used in chemical mechanical polishing of semiconductor wafer comprising: 
 a. a polishing pad conditioner body;    b. an abrasive surface formed by a plurality of diamond particles embedded in the surface, on one side of said conditioner body; and    c. one or more jets in fixed communication with said conditioner body, positioned to deliver a flow of fluid into an interface between said conditioner body and said planar surface of the polishing pad, wherein the flow of fluid is sufficient to dislodge diamond particles which have become embedded in the planar surface of the polishing pad.    
   
   
       10 . A method of conditioning a polishing pad with a diamond-impregnated conditioner body comprising the steps of: 
 a. contacting said polishing pad with an abrasive surface of said conditioner body, of a conditioner plate assembly plate comprising: 
 i. said conditioner body comprising said abrasive surface formed by a plurality of diamond particles embedded in the surface;  
 ii. an apparatus for positioning said conditioner body in abrasive relationship with a planar surface of the polishing pad and for effective rotation of the conditioner body with the planar surface of the polishing pad; and  
 iii. an apparatus for delivering a flow of fluid into an interface between said conditioner body and said planar surface of the polishing pad;  
   b. effecting relative rotation between said polishing pad and said conditioner body; and    c. supplying high velocity water through said apparatus for delivering a flow of fluid, directed to the surface of said polishing pad;    wherein said high velocity water carries away diamond particles loosened from said diamond-impregnated abrasive element during said contacting.    
   
   
       11 . The method of  claim 10 , wherein said diamond-impregnated abrasive element additionally comprises at least one channel communicating between an interior edge and an exterior edge of said diamond-impregnated abrasive element, additionally comprising flowing said high velocity water through said at least one channel.  
   
   
       12 . A method of assuring removal of particulate matter from a surface of a polishing pad during conditioning, comprising the steps of: 
 a. positioning a conditioner body in abrasive relationship with a planar surface of the polishing pad;    b. providing effective rotation of the conditioner body with the planar surface of the polishing pad; and    c. supplying high velocity water through said conditioner body for delivering a flow of fluid, directed to the surface of said polishing pad;    wherein said high velocity water carries away said particulate matter.    
   
   
       13 . The method of  claim 12 , wherein said supplying directs water of a force effective to loosen diamond particles embedded in said surface of said polishing pad.