Curing accelerator for curing resin, curing resin composition, electronic component device and method for producing phosphine derivative

Abstract

The invention relates to a curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation, a curing resin composition containing the curing accelerator, and an electronic component device having a device component encapsulated with the curing resin composition. The curing accelerator exhibits superior curability under moisture absorption, flow properties, reflow cracking resistance and high-temperature storage characteristics.

1 . A curing accelerator for a curing resin obtained by reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged, and subjecting the reaction product to dehydrohalogenation.  
   
   
       2 . The curing accelerator for the curing resin according to  claim 1 , wherein the phosphine compound (a) is represented by the following general formula (I).  
     
       
         
         
             
             
         
       
     
     (wherein R 1  to R 3 in the formula (I) represent a hydrogen atom, or a substituted or unsubstituted hydrocarbon group having 1 to 18 carbon atoms, and each may be the same or different. Two or more of R 1  to R 3  may be mutually bonded to form a cyclic structure.)  
   
   
       3 . The curing accelerator for the curing resin according to any one of claims  1 ,  2 , wherein the compound (b) having at least one halogen atom substituted on the aromatic ring and at least one proton atom which can be discharged is represented by the following general formula (II).  
     
       
         
         
             
             
         
       
     
     (wherein R 4  to R 7  in the formula (II) represent a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and each may be the same or different. YH represents a monovalent group having 0 to 18 carbon atoms and at least one proton which can be discharged. X represents a halogen atom. Two or more of R 4 to R 7  and YH may be mutually bonded to form a cyclic structure.)  
   
   
       4 . The curing accelerator for the curing resin according to  claim 3 , wherein the compound (b) having at least one halogen atom substituted on the aromatic ring and at least one proton atom which can be discharged has a phenolic hydroxyl group.  
   
   
       5 . The curing accelerator for the curing resin according to  claim 2 , wherein R 1  to R 3  in the general formula (I) are a monovalent substituent group selected from the group consisting of an alkyl group and an aryl group which does not have a phenolic hydroxyl group or a mercapto group.  
   
   
       6 . A curing resin composition comprising: at least one kind of the curing accelerator for the curing resin (A) according to any one of  claims 1  to  5 ; and a curing resin (B).  
   
   
       7 . The curing resin composition according to  claim 6 , wherein the curing resin (B) contains an epoxy resin (C).  
   
   
       8 . The curing resin composition according to any one of  claims 6  to  7 , further comprising a curing agent (D).  
   
   
       9 . The curing resin composition according to any one of  claims 6  to  7 , further comprising inorganic filler (E).  
   
   
       10 . The curing resin composition according to  claim 7 , wherein the epoxy resin (C) contains at least one kind of epoxy resin selected from the group consisting of a biphenyl type epoxy resin, a stilbene type epoxy resin, a diphenylmethane type epoxy resin, a sulfur atom content type epoxy resin, a novolac type epoxy resin, a dicyclopentadiene type epoxy resin, a salicylaldehyde type epoxy resin, a copolymer type epoxy resin of naphthol and cresol, and an epoxidized material of an aralkyl type phenolic resin.  
   
   
       11 . The curing resin composition according to  claim 8 , wherein the curing agent (D) contains at least one kind selected from the group consisting of an aralkyl type phenolic resin, a dicyclopentadiene type phenolic resin, a salicylaldehyde type phenolic resin, a copolymer type resin of a benzaldehyde type phenolic resin and the aralkyl type phenolic resin, and a novolac type phenolic resin.  
   
   
       12 . An electronic component device comprising a device component encapsulated with the curing resin composition according to any one of  claims 6  to  11 .  
   
   
       13 . A method for producing a phosphine derivative comprising the steps of: reacting a phosphine compound (a) with a compound (b) having at least one halogen atom substituted on an aromatic ring and at least one proton atom which can be discharged to produce a phosphonium halide; and subjecting the phosphonium halide to dehydrohalogenation.