US2005269058A1PendingUtilityA1

Heat exchanger plate, a plate heat exchanger and a method for manufacturing a heat exchanger plate

Individually held — no corporate assignee on recordPriority: Jul 29, 2002Filed: Jul 7, 2003Published: Dec 8, 2005
Est. expiryJul 29, 2022(expired)· nominal 20-yr term from priority
Inventors:Bernt Tagesson
F28D 9/005F28F 3/10F28F 2230/00
30
PatentIndex Score
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Cited by
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References
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Claims

Abstract

The invention relates to a heat exchanger plate ( 3 ), a plate heat exchanger with a plate package of heat exchanger plates and a method for manufacturing a heat exchanger plate. The heat exchanger plate includes a heat transfer area ( 20 ) and a border area ( 22 ), which is located outside the heat transfer area and which extends along and delimits the heat transfer area. A curable polymer material is applied to the border area in such a way that it extends along the whole or parts of the border area. The polymer material forms after curing a gasket ( 30 ) for tight abutment against an adjacent plate in the plate heat exchanger.

Claims

exact text as granted — not AI-modified
1 - 25 . (canceled)  
   
   
       26 . A heat exchanger plate for a plate heat exchanger comprising: 
 a heat transfer area and a border area, the border area being located outside the heat transfer area and extending along and delimiting the heat transfer area,    wherein a curable polymer material is applied to and cured on the border area such that the polymer material extends along the whole or parts of the border area and is arranged to form a gasket for tight abutment against an adjacent plate in the plate heat exchanger.    
   
   
       27 . A heat exchanger plate according to  claim 26 , wherein the curable polymer material includes silicon.  
   
   
       28 . A heat exchanger plate according to  claim 27 , wherein the curable polymer material includes Liquid Silicon Rubber.  
   
   
       29 . A heat exchanger plate according to  claim 26 , wherein the curable polymer material after curing forms a lower, substantially planar surface attached directly to the border area.  
   
   
       30 . A heat exchanger plate according to  claim 29 , wherein the curable polymer material after curing includes an upper surface which in a cross section has a softly curved, convex shape.  
   
   
       31 . A heat exchanger plate according to  claim 26 , wherein the curable polymer material includes a first component and a second component, which are mixed to form an applicable polymer mixture.  
   
   
       32 . A heat exchanger plate according to  claim 31 , wherein the applicable polymer mixture before curing is highly viscous.  
   
   
       33 . A heat exchanger plate according to  claim 32 , wherein the applicable polymer mixture has a viscosity in the range from 300 to 800 Pas.  
   
   
       34 . A heat exchanger plate according to  claim 26 , wherein the border area includes a bottom surface along substantially the whole border area and at least a first side surface extending along the whole border area and between the bottom surface and the heat transfer area, and wherein the first side surface forms an angle to the bottom surface.  
   
   
       35 . A heat exchanger plate according to  claim 34 , wherein the border area includes a second side surface, extending along the whole border area outside the bottom surface, and wherein the second side surface forms an angle to the bottom surface.  
   
   
       36 . A heat exchanger plate according to  claim 26 , the plate including an edge area located outside the border area and extending around and limiting the border area.  
   
   
       37 . A heat exchanger plate according to  claim 36 , wherein the second side surface extends between the bottom surface and the edge area.  
   
   
       38 . A plate heat exchanger comprising a plate package having heat exchanger plates according to  claim 26 .  
   
   
       39 . A method for manufacturing a heat exchanger plate comprising: 
 providing a sheet,    cutting and forming the sheet to a heat exchanger plate with a heat transfer area, the plate having a number of open portholes, and a border area, the border area being located outside the heat transfer area and extending along and delimiting the heat transfer area,    applying a curable polymer material to the border area such that the polymer material extends along the whole or parts of the border area, and    curing the polymer material to form a gasket for tight abutment against an adjacent plate in a plate heat exchanger.    
   
   
       40 . A method according to  claim 39 , wherein the curable polymer material includes silicon.  
   
   
       41 . A method according to  claim 40 , wherein the curable polymer material includes Liquid Silicon Rubber.  
   
   
       42 . A method according to  claim 39 , wherein the curable polymer material includes a first component and a second component, wherein the method includes 
 mixing the two components to form an applicable polymer mixture substantially immediately before applying the curable polymer material.    
   
   
       43 . A method according to  claim 42 , wherein the applicable polymer mixture before curing is highly viscous.  
   
   
       44 . A method according to  claim 42 , wherein the applicable polymer mixture has a viscosity in the range from 300 to 800 Pas.  
   
   
       45 . A method according to  claim 42 , wherein the first component includes silicon and optionally a catalyst, and the second component includes silicon and an activator, and further wherein the parts of the two components in the polymer mixture are substantially equal.  
   
   
       46 . A method according to  claim 45 , wherein the viscosity of the two components are substantially equal.  
   
   
       47 . A method according to  claim 39 , wherein the curable polymer material is applied by means of an automatic handling device arranged to carry a nozzle for discharge of the polymer material and for guiding the nozzle along the border area.  
   
   
       48 . A method according to  claim 39 , wherein the curable polymer material is cured at a raised temperature.  
   
   
       49 . A method according to  claim 48 , wherein the raised temperature is in the range from 150° C. to 250° C.  
   
   
       50 . A method according to  claim 39 , wherein the curable polymer material is cured during a curing time that amounts to at least 0.5 hr.

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