LED package and method for producing the same

Abstract

An LED package and method for producing the same are described. The LED package has an LED die with a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface. An insulation layer is formed on the conductive region-forming surface of the LED die, and has a plurality of openings corresponding to the conductive regions, respectively. A conductive member fills a respective opening, and is electrically connected a respective conductive regions to an exterior circuit.

1 . An LED package, comprising: 
 an LED die having a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface;    an insulation layer formed on the conductive region-forming surface of the LED die, and having a plurality of openings corresponding to the conductive regions, respectively; and    a conductive member filling a respective one of the openings, and electrically connected a respective one of the conductive regions to an exterior circuit.    
   
   
       2 . The LED package as claimed in  claim 1 , wherein the conductive member is made of conductive adhesives.  
   
   
       3 . The LED package as claimed in  claim 2 , further including a metallic layer formed on the conductive member.  
   
   
       4 . The LED package as claimed in  claim 3 , further including an exterior conductive body disposed on the metallic layer.  
   
   
       5 . The LED package as claimed in  claim 3 , wherein the metallic layer includes a nickel layer and a gold layer.  
   
   
       6 . The LED package as claimed in  claim 1 , further including a metallurgic layer formed on a respective one of the conductive regions.  
   
   
       7 . The LED package as claimed in  claim 1 , wherein each opening communicates with a corresponding one of conductive regions.  
   
   
       8 . The LED package as claimed in  claim 1 , wherein the conductive member is made of metallic material by a sputtering process.  
   
   
       9 . The LED package as claimed in  claim 8 , further including an exterior conductive body disposed on the conductive member.  
   
   
       10 . The LED package as claimed in  claim 9 , wherein the exterior conductive body is a solder bump.  
   
   
       11 . An LED package, comprising: 
 an LED die having a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface;    a first insulation layer formed on the conductive region-forming surface of the LED die, and having a plurality of channels corresponding to the conductive regions, respectively;    a metallic reflection layer formed on the first insulation layer, and having a plurality of through holes corresponding the channels, respectively;    a second insulation later formed on the metallic reflection layer, and having a plurality of openings corresponding to the conductive regions via the channels and the through holes, respectively; and    a conductive member filling a respective one of the openings, and electrically connected a respective one of the conductive regions to an exterior circuit.    
   
   
       12 . The LED package as claimed in  claim 11 , wherein the conductive member is made of conductive adhesives.  
   
   
       13 . The LED package as claimed in  claim 12 , further including a metallic layer formed on the conductive member.  
   
   
       14 . The LED package as claimed in  claim 13 , further including an exterior conductive body disposed on the metallic layer.  
   
   
       15 . The LED package as claimed in  claim 14 , wherein the metallic layer includes a nickel layer and a gold layer.  
   
   
       16 . The LED package as claimed in  claim 11 , further including a metallurgic layer formed on a respective one of the conductive regions.  
   
   
       17 . The LED package as claimed in  claim 11 , wherein the conductive member is made of metallic material by a sputtering process.  
   
   
       18 . The LED package as claimed in  claim 17 , further including an exterior conductive body disposed on the conductive member.  
   
   
       19 . The LED package as claimed in  claim 18 , wherein the exterior conductive body is a solder bump.  
   
   
       20 . The LED package as claimed in  claim 11 , wherein each opening extends through a corresponding one of the through holes and a corresponding one of the channels registered therewith and reaching a corresponding one of conductive regions, such that an opening-confining wall of each of the openings is transverse to a plane of the metallic reflection layer to isolate the metallic reflection layer from the a corresponding one of the conductive regions, while permitting access to the corresponding one of the conductive regions..  
   
   
       21 . An LED package, comprising: 
 an LED die having a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface;    a reflection layer formed on an opposed surface of the LED die opposite the conductive region-forming surface;    a substrate having a die-installation surface, whereon the LED die is disposed via the reflection layer, and wherein the substrate includes a plurality of connection members in accordance with the conductive regions for electrical connection, respectively, and each connection member extends from the die-installation surface to a predetermined portion of a back surface of the substrate, opposite the die-installation surface, for electrically connecting an exterior circuit;    a binding wire connecting a respective one of the conductive regions and a corresponding one of the connection members; and    a protection layer covering the substrate for enclosing the LED die and the binding wire.    
   
   
       22 . The LED package as claimed in  claim 21 , further including a reflection layer adhered to a surface of the LED die.  
   
   
       23 . A method for producing an LED package, comprising: 
 providing an LED wafer, including a plurality of LED sections, wherein each LED section includes a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface;    forming an insulation layer on the conductive region-forming surface of each LED section, and patterning the insulation layer with a plurality of openings corresponding to the conductive regions, respectively;    making a conductive formation layer on the insulation layer with the openings, and removing the conductive layer and leaving a conductive member filled inside each opening; and    arranging an exterior conductive body on the conductive member, and dicing the LED wafer into a plurality of LED packages.    
   
   
       24 . The method as claimed in  claim 23 , further including: providing a metallurgic layer on each conductive region before the step of making the conductive formation layer.  
   
   
       25 . The method as claimed in  claim 23 , wherein making the conductive formation layer includes providing a conductive adhesive as the conductive formation layer.  
   
   
       26 . The method as claimed in  claim 25 , further including providing a metallic layer on the conductive member before the step of arranging the exterior conductive body.  
   
   
       27 . The method as claimed in  claim 26 , wherein making the conductive formation layer includes forming a nickel layer and a gold layer as the metallic layer.  
   
   
       28 . The method as claimed in  claim 23 , wherein pattering the openings includes communicates with a corresponding one of conductive regions.  
   
   
       29 . The method as claimed in  claim 23 , wherein making the conductive formation layer includes sputtering metallic materials in order to form the conductive formation layer.  
   
   
       30 . The method as claimed in  claim 29 , wherein arranging the exterior conductive body includes: 
 forming an auxiliary insulation layer on the insulation layer and patterning a plurality of passageways corresponding to the openings, respectively, wherein each passageway extending through a corresponding one of the openings for reaching a corresponding one of conductive regions, and each passageway and the corresponding one of the openings together form a conductive-body formation hole;    arranging an exterior conductive body in the conductive-body formation hole to connect electrically the corresponding conductive member, wherein the exterior conductive body is exposed out of the conductive-body formation hole; and    removing an exposed portion of the exterior conductive body to flatten the exterior conductive body, and removing the auxiliary insulation layer.    
   
   
       31 . The method as claimed in  claim 30 , wherein arranging the exterior conductive body includes arranging a solder bump as the exterior conductive body.  
   
   
       32 . A method for producing an LED package, comprising: 
 providing an LED wafer, including a plurality of LED sections, wherein each LED section includes a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface;    forming a first insulation layer on the conductive region-forming surface of each LED section;    making a metallic reflection layer on the first insulation layer, and patterning the metallic reflection layer with a plurality of through holes in order to expose the first insulation layer;    patterning the first insulation layer with a plurality of channels communicating with the through holes, respectively, so as to expose the corresponding conductive regions;    forming a second insulation layer on the metallic reflection layer, and patterning the second insulation layer with a plurality of openings in accordance with the through holes and the channels, so as to expose the corresponding conductive regions;    disposing a conductive formation layer on the second insulation layer, removing an exposed portion thereof higher than the second insulation layer, and leaving a conductive member inside each opening for electrically connected the corresponding one of conductive regions; and    providing an exterior conductive body electrically connected to an exterior circuit and to the corresponding one of conductive regions, and dicing the LED wafer into a plurality of LED packages.    
   
   
       33 . The method as claimed in  claim 32 , further including providing metallurgic layer on each pad before the step of making the first insulation layer.  
   
   
       34 . The method as claimed in  claim 32 , wherein forming the conductive formation layer includes providing a conductive adhesive as the conductive formation layer.  
   
   
       35 . The method as claimed in  claim 34 , further including a metallic layer formed on the conductive member before the step of disposing the exterior conductive body.  
   
   
       36 . The method as claimed in  claim 35 , wherein forming the metallic layer includes providing a nickel layer and a gold layer formed together as the metallic layer.  
   
   
       37 . The method as claimed in  claim 32 , wherein forming the second insulation layer includes providing each opening extending through a corresponding one of the through holes and a corresponding one of the channels registered with the corresponding through hole and reaching a corresponding one of conductive regions, such that an opening-confining wall of each of the openings is transverse to a plane of the metallic reflection layer to isolate the metallic reflection layer from the corresponding one of the conductive regions, while permitting access to the corresponding one of the conductive regions.  
   
   
       38 . The method as claimed in  claim 32 , wherein forming the conductive formation layer includes sputtering metallic materials in order to form the conductive formation layer.  
   
   
       39 . The method as claimed in  claim 38 , wherein arranging the exterior conductive body includes: 
 forming an auxiliary insulation layer on the second insulation layer and patterning a plurality of passageways corresponding to the openings, respectively, wherein each passageway extending through a corresponding one of the openings, and each passageway and the corresponding opening together form a conductive-body formation hole;    arranging an exterior conductive body in the conductive-body formation hole to connect electrically the corresponding conductive member, wherein the exterior conductive body is exposed out of the conductive-body formation hole; and    removing an exposed portion of the exterior conductive body to flatten the exterior conductive body, and removing the auxiliary insulation layer.    
   
   
       40 . The method as claimed in  claim 39 , wherein arranging the exterior conductive body includes arranging a solder bump as the exterior conductive body.  
   
   
       41 . A method for producing an LED package, comprising: 
 providing an LED die, including a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface;    adhering a reflection layer to the LED die, wherein the reflection layer is opposite the conductive region-forming layer;    providing a substrate having a die-installation surface, to which the LED die is connected via the reflection layer, wherein the substrate includes two connection members in accordance with the conductive regions for electrical connection, respectively, and each connection member extends from the die-installation surface to a predetermined portion of a back surface of the substrate, opposite the die-installation surface, for electrically connected an exterior circuit;    a binding wire connected a respective one of the conductive regions and a corresponding one of the connection members; and    a protection layer covers the substrate for enclosing the LED die and the binding wire.    
   
   
       42 . The method as claimed in  claim 41 , further including adhering a reflection layer to a surface of the LED die.  
   
   
       43 . A method for producing an LED package, comprising: 
 providing an LED wafer, including a plurality of LED sections, wherein each LED section includes a conductive region-forming surface and a plurality of conductive regions disposed on the conductive region-forming surface;    forming a first insulation layer on the conductive region-forming surface of each LED section;    making a metallic reflection layer on the first insulation layer,    forming a second insulation layer on the metallic reflection layer, and patterning the second insulation layer with a plurality of openings so as to expose the metallic reflection layer;    patterning the metallic reflection layer with a plurality of through holes in order to uncover the first insulation layer;    patterning the first insulation layer with a plurality of channels communicating with the through holes, respectively, so as to communicate with the through holes;    forming a third insulation layer on the second insulation layer beside the openings, and patterning the third insulation layer with a plurality of penetrating holes in accordance with the openings, the through holes and the channels, in order to expose the corresponding conductive regions, respectively    disposing a conductive formation layer on the third insulation layer, removing an exposed portion thereof higher than the third insulation layer, and leaving a conductive member inside each penetrating hole for electrically connected the corresponding pad; and    providing an exterior conductive body electrically connected to an exterior circuit and to each conductive region, and dicing the LED wafer into a plurality of LED packages.    
   
   
       44 . The method as claimed in  claim 43 , further including providing metallurgic layer on each conductive region before the step of making the first insulation layer.  
   
   
       45 . The method as claimed in  claim 43 , wherein forming the conductive formation layer includes providing a conductive adhesive as the conductive formation layer.  
   
   
       46 . The method as claimed in  claim 45 , further including a metallic layer formed on the conductive member before the step of disposing the exterior conductive body.  
   
   
       47 . The method as claimed in  claim 46 , wherein forming the metallic layer includes providing a nickel layer and a gold layer formed together as the metallic layer.  
   
   
       48 . The method as claimed in  claim 43 , wherein forming the third insulation layer includes providing each penetrating hole extending through a corresponding opening, a corresponding through hole and a corresponding channel registered with the corresponding through hole and reaching a corresponding conductive region, such that an opening-confining wall of each of the penetrating holes is transverse to a plane of the metallic reflection layer to isolate the metallic reflection layer from a corresponding one of the conductive regions while permitting access to the corresponding one of the conductive regions.  
   
   
       49 . The method as claimed in  claim 43 , wherein forming the conductive formation layer includes sputtering metallic materials in order to form the conductive formation layer.  
   
   
       50 . The method as claimed in  claim 49 , wherein arranging the exterior conductive body includes: 
 forming an auxiliary insulation layer on the third insulation layer and patterning a plurality of passageways corresponding to the through holes, respectively, wherein each passageway communicates with corresponding openings , and each passageway and one of the corresponding through holes together form a conductive-body formation hole;    arranging an exterior conductive body in the conductive-body formation hole to connect electrically the corresponding conductive member, wherein the exterior conductive body is exposed out of the conductive-body formation hole; and    removing an exposed portion of the exterior conductive body to flatten the exterior conductive body, and removing the auxiliary insulation layer.    
   
   
       51 . The method as claimed in  claim 50 , wherein arranging the exterior conductive body includes arranging a solder bump as the exterior conductive body.