Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates

Abstract

Semiconductor device components include a substrate with contact pads and at least one stabilizer protruding from the contact pad-bearing surface of the substrate. The at least one stabilizer may include adjacent, mutually adhered regions. Each region includes dielectric material. The at least one stabilizer is configured to at least partially stabilize the semiconductor device component upon assembly of the semiconductor device component in flip-chip fashion relative to a higher level substrate, preventing tilting or tipping of the semiconductor device component relative to the higher level substrate. The at least one stabilizer may be configured and positioned to define a minimum, substantially uniform distance between the semiconductor device component and the higher level substrate.

1 . A semiconductor device component, comprising: 
 a substrate having a surface with contact pads exposed thereto; and    at least one stabilizer protruding from the surface and including a plurality of mutually adhered regions, every region of the plurality comprising dielectric material.    
   
   
       2 . The semiconductor device component of  claim 1 , wherein every region of the plurality comprises the same type of dielectric material.  
   
   
       3 . The semiconductor device component of  claim 1 , wherein the at least one stabilizer protrudes from the surface a distance no more than a distance that at least one conductive structure to be disposed in contact with at least one of the contact pads will extend beyond the surface.  
   
   
       4 . The semiconductor device component of  claim 3 , wherein the at least one stabilizer protrudes from the surface a distance that permits conductive structures on the contact pads to contact conductors of another semiconductor device component upon assembly of the substrate with the another semiconductor device component such that the surface of the assembly faces a conductor-bearing surface of the another semiconductor device component.  
   
   
       5 . The semiconductor device component of  claim 1 , wherein the dielectric material comprises a photocurable material.  
   
   
       6 . The semiconductor device component of  claim 1 , further comprising: protruding conductive structures in contact with selected ones of the contact pads.  
   
   
       7 . The semiconductor device component of  claim 1 , wherein the substrate comprises a fabrication substrate carrying a plurality of devices.  
   
   
       8 . The semiconductor device component of  claim 1 , wherein the contact pads are arranged substantially in-line relative to one another.  
   
   
       9 . The semiconductor device component of  claim 8 , wherein the contact pads are arranged on or proximate to a center line of the substrate.  
   
   
       10 . The semiconductor device component of  claim 1 , wherein the at least one stabilizer is electrically nonconductive.  
   
   
       11 . The semiconductor device component of  claim 1 , wherein the at least one stabilizer is positioned between the contact pads and a periphery of the substrate.  
   
   
       12 . A semiconductor device component, comprising: 
 a substrate having a surface with contact pads exposed thereto, the contact pads being configured to be connected with conductors on a surface of another semiconductor device component; and    at least one stabilizer protruding from the surface of the substrate, the at least one stabilizer comprising a plurality of mutually adhered regions, each region of the plurality comprising dielectric material.    
   
   
       13 . The semiconductor device component of  claim 12 , wherein each of region of the plurality comprises the sane type of dielectric material.  
   
   
       14 . The semiconductor device component of  claim 12 , wherein the at least one stabilizer protrudes from the surface of the substrate a distance no more than a distance that at least one conductive structure to be disposed in contact with at least one of the contact pads will extend beyond the surface.  
   
   
       15 . The semiconductor device component of  claim 14 , wherein the at least one stabilizer protrudes from the surface of the substrate a distance that permits conductive structures on the contact pads to contact the conductors of the another semiconductor device component.  
   
   
       16 . The semiconductor device component of  claim 12 , wherein the dielectric material comprises a photocurable material.  
   
   
       17 . The semiconductor device component of  claim 12 , further comprising: 
 protruding conductive structures in contact with selected ones of the contact pads.    
   
   
       18 . The semiconductor device component of  claim 12 , wherein the substrate comprises a fabrication substrate carrying a plurality of devices.  
   
   
       19 . The semiconductor device component of  claim 12 , wherein the at least one stabilizer maintains a substantially uniform distance between the surface of the substrate and the surface of the another semiconductor device component.  
   
   
       20 . The semiconductor device component of  claim 12 , wherein the contact pads are arranged substantially in-line relative to one another.  
   
   
       21 . The semiconductor device component of  claim 20 , wherein the contact pads are arranged on or proximate to a center line of the substrate.  
   
   
       22 . The semiconductor device component of  claim 12 , wherein the at least one stabilizer is electrically nonconductive.  
   
   
       23 . The semiconductor device component of  claim 12 , wherein the at least one stabilizer is positioned between the contact pads and a periphery of the substrate.