Method of temporarily securing a die to a burn-in carrier

Abstract

A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of the tape beyond the normal operating range of the adhesive coating on the tape, the die is removed from the tape, the tape is removed from the test and burn-in fixture, and the remaining adhesive, if any, is removed from the test and burn-in fixture.

1 . A retention method for a semiconductor die in a fixture comprising: 
 supplying tape having adhesive on at least one side thereof;    cutting a piece of the tape having a size to fit in the fixture;    transferring the piece of the tape to the fixture, the fixture having at least one contact pad thereon;    placing the semiconductor die on the piece of the tape transferred to the fixture;    adhesively securing one of the fixture and the semiconductor die by the adhesive on at least one side of the piece of the tape;    performing testing and burn-in operations on the semiconductor die when mounted in the fixture;    removing the semiconductor die from the fixture after performing the testing and burn-in operations on the semiconductor die; and    removing the piece of the tape from the fixture after performing the testing and burn-in operations on the semiconductor die in the fixture.    
   
   
       2 . The method of  claim 1 , further comprising: 
 connecting the at least one bond pad on the semiconductor die with the at least one contact pad on the fixture.    
   
   
       3 . The method of  claim 2 , further comprising: 
 tape automated bonding the at least one bond pad of the semiconductor die to the at least one contact pad on the fixture.    
   
   
       4 . A temporary retention method for a semiconductor die located in a fixture comprising: 
 supplying tape having adhesive on at least one side thereof;    cutting a piece of the tape having a size to fit in the fixture;    transferring the piece of the tape to the fixture, the fixture having at least one contact pad thereon;    placing the semiconductor die on the piece of the tape transferred to the fixture;    adhesively securing one of the fixture and the semiconductor die by the adhesive on at least one side of the piece of the tape;    performing testing and burn-in operations on the semiconductor die when mounted in the fixture;    removing the semiconductor die from the fixture after performing the testing and burn-in operations on the semiconductor die; and    removing the piece of the tape from the fixture after performing the testing and burn-in operations on the semiconductor die in the fixture.    
   
   
       5 . The method of  claim 4 , further comprising: 
 connecting the at least one bond pad on the semiconductor die with the at least one contact pad on the fixture.    
   
   
       6 . The method of  claim 5 , further comprising: 
 tape automated bonding the at least one bond pad of the semiconductor die to the at least one contact pad on the fixture.    
   
   
       7 . A retention method using a semiconductor die and a fixture comprising: 
 supplying tape having adhesive on at least one side thereof;    cutting a piece of the tape having a size to fit in the fixture;    transferring the piece of the tape to the fixture, the fixture having at least one contact pad thereon;    placing the semiconductor die on the piece of the tape transferred to the fixture;    adhesively securing one of the fixture and the semiconductor die by the adhesive on at least one side of the piece of the tape;    performing testing and burn-in operations on the semiconductor die when mounted in the fixture;    removing the semiconductor die from the fixture after performing the testing and burn-in operations on the semiconductor die; and    removing the piece of the tape from the fixture after performing the testing and burn-in operations on the semiconductor die in the fixture.    
   
   
       8 . The method of  claim 7 , further comprising: 
 connecting the at least one bond pad on the semiconductor die with the at least one contact pad on the fixture.    
   
   
       9 . The method of  claim 8 , further comprising: 
 tape automated bonding the at least one bond pad of the semiconductor die to the at least one contact pad on the fixture.