Plating apparatus

Abstract

A plating apparatus can form a plated film having a uniform thickness on a surface to be plated of a substrate without employing a complicated structure, such as a conduction detection means capable of detecting the state of conduction (contact state) of feeding contacts in contact with a conductive portion of the substrate. The plating apparatus includes a substrate holder having a plurality of feeding contacts for contact with a conductive portion provided in a surface of a substrate, wherein the substrate holder includes a feeding ring comprised of a single member and having the feeding contacts disposed at regular intervals along the circumferential direction, a plurality of substrate chucks for contact with the substrate in the vicinity of the contact portions of the feeding contacts with the conductive portion to support the substrate, and a substrate deflection preventing mechanism for preventing deflection of the substrate.

1 . A plating apparatus comprising: 
 a substrate holder having a plurality of feeding contacts for contact with a conductive portion provided in a surface of a substrate, wherein the substrate holder includes;    a feeding ring comprised of a single member and having the feeding contacts disposed at regular intervals along the circumferential direction,    a plurality of substrate chucks for contact with the substrate in the vicinity of the contact portions of the feeding contacts with the conductive portion to support the substrate, and    a substrate deflection preventing mechanism for preventing deflection of the substrate.    
   
   
       2 . The plating apparatus according to  claim 1 , wherein the substrate chucks each have a guide for stopping the peripheral end portion of the substrate.  
   
   
       3 . The plating apparatus according to  claim 2 , wherein the guide is provided in such a position as not to interfere with the feeding contact.  
   
   
       4 . The plating apparatus according to  claim 1 , wherein the substrate deflection preventing mechanism is comprised of an annular flat stage.  
   
   
       5 . The plating apparatus according to  claim 4 , wherein the substrate chucks are provided around the flat stage.  
   
   
       6 . The plating apparatus comprising: 
 a substrate holder having a plurality of feeding contacts for contact with a conductive portion provided in a surface of a substrate and forming, together with the substrate, a plating solution holding portion;    an immersion member disposed opposite the substrate, held by the substrate holder, at a predetermined distance therefrom; and    an electrode disposed on the immersion member and opposite the substrate, held by the substrate holder, at a predetermined distance therefrom;    wherein the feeding contacts are provided opposite the peripheral end portion of the substrate held by the substrate holder.    
   
   
       7 . The plating apparatus according to  claim 6 , wherein the feeding contacts are provided in the form of fixed pins in an inner peripheral end portion of the substrate holder.  
   
   
       8 . The plating apparatus according to  claim 7 , wherein the feeding contacts are provided in an inclined position and opposite to a bevel surface of the substrate held by the substrate holder.  
   
   
       9 . The plating apparatus according to  claim 6 , further comprising a sealing member for sealing the gap between the substrate holder and the substrate on the back surface side of the substrate when the substrate is held by the substrate holder.  
   
   
       10 . The plating apparatus according to  claim 6 , wherein the immersion member is a non-conductive foam of the continuous cell type.  
   
   
       11 . The plating apparatus comprising: 
 a substrate holder having a plurality of feeding contacts for contact with a conductive portion provided in a surface of a substrate; and    an immersion member and an electrode each disposed opposite the substrate, held by the substrate holder, at a predetermined distance therefrom;    wherein the substrate holder includes a feeding ring comprised of a single member and having the feeding contacts disposed at regular intervals along the circumferential direction, a plurality of substrate chucks for contact with the substrate in the vicinity of the contact portions of the feeding contacts with the conductive portion to support the substrate, and a substrate deflection preventing mechanism for preventing deflection of the substrate,    wherein the diameters of the immersion member and the electrode are set to be equal to or larger than the effective diameter of the substrate, and    wherein the feeding contacts are provided opposite the peripheral end portion of the substrate held by the substrate holder.