High thermal conductivity materials aligned within resins

Abstract

In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the fillers have an aspect ratio of between 3-100. The fillers are substantially evenly distributed through the host resin matrix, and are aligned in essentially the same direction. In some embodiments the resins are highly structured resin types.

1 . A high thermal conductivity resin comprising: 
 a host resin matrix; and    a high thermal conductivity filler;    wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host resin matrix;    and wherein high thermal conductivity fillers have an aspect ratio of between 3-100;    wherein said high thermal conductivity fillers are substantially evenly distributed through said host resin matrix, and wherein said high thermal conductivity fillers are aligned in essentially the same direction.    
     
     
         2 . The high thermal conductivity resin of  claim 1 , wherein said high thermal conductivity fillers are from 1-1000 nm in length.  
     
     
         3 . The high thermal conductivity resin of  claim 1 , wherein said high thermal conductivity fillers are at least one of diamond, Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2.  
     
     
         4 . The high thermal conductivity resin of  claim 1 , wherein said high thermal conductivity fillers are surface coated onto a non-high thermal conductivity filler.  
     
     
         5 . The high thermal conductivity resin of  claim 1 , where said resin is a highly structured resin.  
     
     
         6 . A method for making a thermal conductivity resin comprising: 
 impregnating a host resin matrix with a high thermal conductivity filler;    distributing said high thermal conductivity filler evenly through said resin matrix;    aligning at least 75% of said high thermal conductivity fillers within 15 degrees of a common direction; and    curing said resin matrix;    wherein said high thermal conductivity fillers have an aspect ratio of between 3-100.    
     
     
         7 . The method of  claim 6 , wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host resin matrix.  
     
     
         8 . The method of  claim 6 , wherein said high thermal conductivity fillers are from 1-1000 nm in length.  
     
     
         9 . The method of  claim 6 , wherein the alignment is done by the self-alignment and aggregation of said high thermal conductivity fillers.  
     
     
         10 . The method of  claim 6 , wherein the alignment is done by the application of an external field.  
     
     
         11 . The method of  claim 10 , wherein said external field is one of mechanical, electric, magnetic, sonic and ultrasonic.  
     
     
         12 . The method of  claim 6 , further comprising first surface coating said high thermal conductivity fillers with field responsive materials  
     
     
         13 . The method of  claim 6 , further comprising coating field responsive fillers with high thermal conductivity coatings.  
     
     
         14 . The method of  claim 6 , wherein said host resin matrix comprises a highly structured resin that is aligned uniformly with said high thermal conductivity filler.  
     
     
         15 . A high thermal conductivity resin comprising: 
 a host resin matrix; and    a high thermal conductivity filler;    wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host resin matrix;    and wherein said high thermal conductivity fillers have an aspect ratio of between 3-100;    wherein said high thermal conductivity fillers are substantially evenly distributed through said host resin matrix, and wherein said high thermal conductivity fillers form substructures within said host resin matrix;    wherein said substructures comprise at least one of columns, layers and super lattices.    
     
     
         16 . The high thermal conductivity resin of  claim 15 , wherein said high thermal conductivity fillers are at least one of oxides, nitrides and carbides.  
     
     
         17 . The high thermal conductivity resin of  claim 15 , wherein said high thermal conductivity fillers contain at least one of metallic and organo-metallic compounds that are capable of responding to an external field.  
     
     
         18 . A porous media impregnated with a high thermal conductivity resin comprising: 
 a porous media; and    a high thermal conductivity material loaded resin, wherein said high thermal conductivity material comprises 5-60% by volume of said resin;    wherein said high thermal conductivity materials have aspect ratios of 10-50 and are aligned within said porous media in essential the same direction.