Prefabricated semiconductor chip carrier

Abstract

A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.

1 - 46 . (canceled)  
   
   
       47 . A multi-layer substrate comprising: 
 a plurality of layers of insulative material, including at least an upper layer and a lower layer;    at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and characterized by:    a surface-mount-compatible bonding pad formed within each well on the inner surface of the multi-layer substrated; and electrically-conductive adhesive fill material having a bottom and top, the adhesive fill material filling the at least one well from the bottom to the top of the adhesive fill material, wherein the bottom of the adhesive fill material contacts the bonding pad and the adhesive fill material is provided between the bonding pad and a lead wire of an electrical interconnect component to form an electrical connection between the bonding pad and the wire.